"LEAD MATERIAL" DIP Search Results

solder

Abstract: plating
Contextual Info: GENERAL PURPOSE INFORMATION 2. STRUCTURE MINI MOLD Case Materia! Epoxy Lead Material : Fe - Ni Lead Plating Solder Dipping or Solder Plating M ark in g S u rfa ce POWER MINI MOLD Case Material Epoxy M a rk in g Lead Material : Cu Lead Plating Solder Plating

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

high power diode axial

Abstract: HITACHI AXIAL DIODE ZSH5MA HITACHI
Contextual Info: Application Note HITACHI Power Diode Lead-Free Status 1. Lead-Free Status Details Package Glass Molded Resin Molded Axial Lead High Voltage resin Surface Mounted ZSA5MA ZSH Series Plan Current plate material of external lead Sn Ag Current internal solder material for

Contextual Info: IDC DIP CONNECTORS CENTURY INTERCONNECT PRODUCTS 203 375-5344 FAX (203) 375-1631 SPECIFICATIONS MECHANICAL: Insulator Material: PBT, glass fiber reinforced, UL94V-0 Contact Material: Copper Alloy Contact Finish: Gold or tin-lead over nickel IDC Terminal Finish: Tin-lead over nickel

Contextual Info: IDC DIP CONNECTORS CENTURY INTERCONNECT PRODUCTS 203 375-5344 FAX (203) 375-1631 SPECIFICATIONS JTI MECHANICAL: Insulator Material: PBT, glass fiber reinforced, UL94V-0 Contact Material: Copper Alloy Contact Finish: Gold or tin-lead over nickel IDC Terminal Finish: Tin-lead over nickel

Contextual Info: External Lead Finish for Plastic Packages For plastic packages, National Semiconductor offers two primary lead finishes: solder plate and solder dip. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish

HQFP208-C-3939-0

Contextual Info: HQFP208-C-3939-0.65 Radiation fin 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Al2O3 Kovar Solder dipping (5~50µm) 25.9 TYP.

ceramic pin grid array package lead finish gold

Abstract: 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip
Contextual Info: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The

crossover

Contextual Info: TEPRO TYPE "TDN" ELECTRO TECHNIK STANDARD AND CUSTOM THICK FILM DIP NETWORKS FEATURES: Resistive element: Substrate material: Resistance range: Resistance tolerance: Temperature coefficient: Power rating, watts: Operating temperature: Lead material: Overcoating:

Contextual Info: TEPRO TYPE ELECTRa TECHNIK UUTDNUU STANDARD AND CUSTOM THICK FILM DIP NETWORKS FEATURES: Resistive element: Substrate material: Resistance range: Resistance tolerance: Temperature coefficient: Power rating, wafts: Operating temperature: Lead material: Overcoating:

Noble resistor

Abstract: crossover
Contextual Info: TEPRO TYPE “TDN” ELECTRO TECHNIK STANDARD AND CUSTOM THICK FILM DIP NETWORKS FEATURES: Resistive element: Substrate material: Resistance range: Resistance tolerance: Temperature coefficient: Power rating, watts: Operating temperature: Lead material: Overcoating:

DIP36-P-600-2

Contextual Info: DIP36-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 5.73 TYP. 2/Dec. 11, 1996

Contextual Info: DIP24-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 3.55 TYP. 2/Dec. 11, 1996

Contextual Info: DIP18-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.30 TYP. 2/Dec. 11, 1996

DIP42-P-600-2

Contextual Info: DIP42-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 6.20 TYP. 2/Dec. 11, 1996

Contextual Info: DIP22-P-400-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.90 TYP. 2/Dec. 11, 1996

Contextual Info: DIP48-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 7.20 TYP. 2/Dec. 11, 1996

Contextual Info: DIP16-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.99 TYP. 2/Dec. 11, 1996

Contextual Info: DIP28-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.30 TYP. 2/Dec. 11, 1996

DIP14-P-300-2

Contextual Info: DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.93 TYP. 2/Dec. 11, 1996

Contextual Info: DIP40-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 6.10 TYP. 2/Dec. 11, 1996

Contextual Info: DIP32-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 4.70 TYP. 3/Dec. 11, 1996

DIP20-P-300-2

Contextual Info: DIP20-P-300-2.54-W1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.50 TYP. 2/Dec. 11, 1996

Contextual Info: DIP22-P-300-2.54-S1 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.88 TYP. 2/Dec. 11, 1996