| SOT115 |
|
NXP Semiconductors
|
SOT115 Mounting |
|
Original |
PDF
|
5.97KB |
2 |
| SOT1150-1 |
|
NXP Semiconductors
|
SOT1150-1_po |
|
Original |
PDF
|
297.33KB |
1 |
| SOT1151-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ball grid array package; 640 balls; heatsink |
|
Original |
PDF
|
301.42KB |
1 |
| SOT1152-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based |
|
Original |
PDF
|
230.34KB |
1 |
| SOT1153-1 |
|
NXP Semiconductors
|
Plastic ball grid array package; 456 balls |
|
Original |
PDF
|
268.03KB |
1 |
| SOT1154-1 |
|
NXP Semiconductors
|
Plastic dual bent surface mounted SIL power package; 27 leads |
|
Original |
PDF
|
379.68KB |
1 |
| SOT1155-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 48 balls |
|
Original |
PDF
|
231.31KB |
1 |
| SOT1155-1_118 |
|
NXP Semiconductors
|
TFBGA48; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
|
Original |
PDF
|
184.28KB |
4 |
| SOT1155-2 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 48 balls |
|
Original |
PDF
|
340.64KB |
1 |
| SOT1156-1 |
|
NXP Semiconductors
|
Plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals |
|
Original |
PDF
|
212.25KB |
1 |
| SOT1156-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1156-1 |
|
Original |
PDF
|
230.78KB |
1 |
| SOT1157-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals |
|
Original |
PDF
|
222.04KB |
1 |
| SOT1157-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1157-1 |
|
Original |
PDF
|
315.19KB |
1 |
| SOT1158-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals |
|
Original |
PDF
|
222.85KB |
1 |
|
|
| SOT1158-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1158-1 |
|
Original |
PDF
|
320.78KB |
1 |
| SOT1159-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1159-1 |
|
Original |
PDF
|
323.81KB |
1 |
| SOT1159-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
|
Original |
PDF
|
223.81KB |
1 |
| SOT115AA |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
|
Original |
PDF
|
241.46KB |
1 |
| SOT115AD |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
|
Original |
PDF
|
235.08KB |
1 |
| SOT115AE |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
|
Original |
PDF
|
227.81KB |
1 |
