SOT261-2 |
|
NXP Semiconductors
|
Footprint for wave soldering |
Original |
PDF
|
10.85KB |
1 |
SOT261-2 |
|
NXP Semiconductors
|
Plastic leaded chip carrier; 28 leads |
Original |
PDF
|
236.57KB |
1 |
SOT261-3 |
|
NXP Semiconductors
|
Footprint for wave soldering |
Original |
PDF
|
10.85KB |
1 |
SOT261-3 |
|
NXP Semiconductors
|
Plastic leaded chip carrier; 28 leads; pedestal |
Original |
PDF
|
241.3KB |
1 |
SOT262A1 |
|
NXP Semiconductors
|
Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
|
225.55KB |
1 |
SOT262A2 |
|
NXP Semiconductors
|
Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
|
225.58KB |
1 |
SOT262B |
|
NXP Semiconductors
|
Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
|
225.44KB |
1 |
SOT263 |
|
Philips Semiconductors
|
Package outline |
Original |
PDF
|
10.51KB |
1 |
SOT263-01 |
|
NXP Semiconductors
|
Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option |
Original |
PDF
|
223.38KB |
1 |
SOT263B |
|
NXP Semiconductors
|
Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 |
Original |
PDF
|
222.81KB |
1 |
SOT263B-01 |
|
NXP Semiconductors
|
Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option |
Original |
PDF
|
227.67KB |
1 |
SOT266-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering |
Original |
PDF
|
16.86KB |
2 |
SOT266-1 |
|
NXP Semiconductors
|
Plastic shrink small outline package; 20 leads; body width 4.4 mm |
Original |
PDF
|
229.02KB |
1 |
SOT266-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT266-1 |
Original |
PDF
|
10.66KB |
1 |
|
SOT266-1_118 |
|
NXP Semiconductors
|
SSOP20; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
|
226.29KB |
4 |
SOT268A |
|
NXP Semiconductors
|
Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
Original |
PDF
|
223.39KB |
1 |
SOT268A_112 |
|
NXP Semiconductors
|
CDFM4; blister pack; standard product orientation 12NC ending 112 |
Original |
PDF
|
121.63KB |
2 |