| SOT1190-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 144 balls |
Original |
PDF
|
348.29KB |
1 |
| SOT1190-2 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 144 balls |
Original |
PDF
|
231.8KB |
1 |
| SOT1191-1 |
|
NXP Semiconductors
|
Plastic, extremely thin quad flat package; no leads; 10 terminals |
Original |
PDF
|
214.91KB |
1 |
| SOT1192-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals |
Original |
PDF
|
339.41KB |
1 |
| SOT1192-1 |
|
NXP Semiconductors
|
Reflow soldering footprint SOT1192-1 |
Original |
PDF
|
312.62KB |
1 |
| SOT1193-1 |
|
NXP Semiconductors
|
Plastic, extremely thin quad flat package; no leads; 8 terminals |
Original |
PDF
|
215.06KB |
1 |
| SOT1193-2 |
|
NXP Semiconductors
|
Plastic, extremely thin quad flat package; no leads; 8 terminals |
Original |
PDF
|
214.63KB |
1 |
| SOT1194-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1194-1 |
Original |
PDF
|
318.52KB |
1 |
| SOT1194-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals |
Original |
PDF
|
339.31KB |
1 |
| SOT1196-1 |
|
NXP Semiconductors
|
SO12: plastic small outline package; 12 leads; body width 3.9 mm |
Original |
PDF
|
334.66KB |
1 |
| SOT1197-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals |
Original |
PDF
|
339.28KB |
1 |
| SOT1197-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT1197-1 |
Original |
PDF
|
319.04KB |
1 |
| SOT1198-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based |
Original |
PDF
|
213.73KB |
1 |
| SOT1199-1 |
|
NXP Semiconductors
|
Plastic very thin fine-pitch ball grid array package; 24 balls |
Original |
PDF
|
321.75KB |
1 |
|
|
| SOT119a |
|
NXP Semiconductors
|
Flanged ceramic package; 2 mounting holes; 6 leads |
Original |
PDF
|
226.44KB |
1 |
| SOT119A_112 |
|
NXP Semiconductors
|
CDFM6; Blister pack Packing method; standard product orientation 12NC ending 112 |
Original |
PDF
|
182.23KB |
2 |
