0.18U Search Results

IDCT design FPGA

Abstract: dct verilog code
Contextual Info: Ease of Integration & Performance  High clock speed >250 MHz in 0.18um ASIC technologies IDCT  Low gate count  Single clock cycle per sample 2-D Inverse Discrete Cosine Transform Core operation  Low latency (86 cycles) Design Quality The IDCT core implements the 2D Inverse Cosine Transform. Most of the image/video

dct verilog code

Abstract: EP20K100E-1 EP1S10-C5
Contextual Info: Ease of Integration & Performance  High clock speed >250 MHz in 0.18um ASIC technologies IDCT  Low gate count 2-D Inverse Discrete Cosine Transform Megafucntion  Low latency (86 cycles)  Single clock cycle per sample operation Design Quality

dct verilog code

Abstract: EP20K100E-1 2d dct block
Contextual Info: Ease of Integration & Performance  High clock speed >250 MHz in 0.18um ASIC technologies DCT  Low gate count 2-D Forward Discrete Cosine Transform Megafunction  Low latency (87 cycles)  Single clock cycle per sample operation Design Quality  Fully compliant with the JPEG

ARM dual port SRAM compiler

Abstract: rm2510 synopsys dc ultra DSPG 16C450 16C550 ARM920T ARM940T IEEE1284 STD110
Contextual Info: V S MSUNG STD130 ELECTRONICS STD130 Standard Cell 0.18um System-On-Chip ASIC Dec 2000, V2.0 Features 1.8/2.5/3.3V - Leff= 0.15um, Ldrawn = 0.18um Device - Up to 23 million gates - Power dissipation :24nW/MHz 3.3/5.0V - Gate Delay : 48ps @ 1.8V, 1SL Device

6JK3

Abstract: BC733 bc735 usb common mode choke BC380 BC628 MMDR BC148 pin configuration BC702 Wistron Corporation
Contextual Info: A B C D E D H2 BLOCK DIAGRAMVER.-4 Project Code 4 4,5 3 ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD DESKTOP CPU For ENG Willamette For M/P Northwood CLK GEN 6 0.18u 1.3G~1.8G G768D 0.13u 2.0G~2.4G 500mA; 600mA 15 7,8 9,10,11 3 2002/06/06 DDR*2 MCH 15 ATI P6

bc733

Abstract: PLW3216S 74BC645 bc732 TSLCX74 BC242 foxconn BC148 pin configuration 6JK3 wistron
Contextual Info: A B C D H2 BLOCK DIAGRAM E 2002/02/18 VER.S2 Project Code Project Code 4 4,5 DESKTOP CPU For ENG Willamette For M/P Northwood 3 CLK GEN ICS 94239 M/B D/D LAUNCH CDROM IR 2ND HDD 0.18u 1.3G~1.5G 0.13u 2.0G~2.4G 6 G768D 48.41T01.001 48.41T02.001 48.41T03.001

TDA 9361 PS

Abstract: tda 2974 LD5Q ci 8602 gn block diagram TDA 2265 5.1 AUDIO AMP TDA 2030 TDA 7877 TDA 0200 circuit TDA 9594 TDA 2088
Contextual Info: V S MSUNG STD130 ELECTRONICS STD130 Standard Cell 0.18um System-On-Chip ASIC Dec 2000, V2.0 Features 1.8/2.5/3.3V - Leff= 0.15um, Ldrawn = 0.18um Device - Up to 23 million gates - Power dissipation :24nW/MHz 3.3/5.0V - Gate Delay : 48ps @ 1.8V, 1SL Device

Contextual Info: Tyco Electronics 36502CR18JTDG Product Details 3650 1008 0.18uH 5% 2K RL Always EU RoHS/ELV Compliant Statement of No Image Available Compliance 36502CR18JTDG TE Internal Number: 21879023 - 0 Active Documentation & Additional Information Product Drawings:

ATX 2005 schematic diagram

Abstract: .dd2 nRF24Z1 atx schematic CC1608-0603 nRF24xx atx power supply schematic dc schematic atx 250 2.4GHz RECEIVER IC atx power supply schematic
Contextual Info: PRELIMINARY PRODUCT SPECIFICATION nRF24Z1 2.4GHz wireless audio streamer FEATURES APPLICATIONS • • • • • • • • • • • • • • • Low cost 0.18u CMOS process, 36 pin 6x6mm QFN package Single chip 2.4GHz RF transceiver 4Mbit/sec RF link

Contextual Info: RELIABILITY REPORT DATE: 10/26/2010 QUALITY ENG : PART NUMBER : MICREL QA SM8XXXXX products QUAL VEHICLES PACKAGE TYPE : FAB Location# PROCESS SM81X1129 32L MLF tolkien base die Burlington,Vermont CMOS 0.18um SM83X0830 44L MLF (tuscon base die) SM840051 8L TSSOP (tolkien option)

Contextual Info: CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL GRM188R71C184KA01_ 0603, X7R, 0.18uF, 16Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 2.MURATA Part NO. System

Contextual Info: CHIP MONOLITHIC CERAMIC CAPACITOR FOR GENERAL GRM188R71E184KA88_ 0603, X7R, 0.18uF, 25Vdc _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment. 2.MURATA Part NO. System

0.18Um Standard cell ST

Abstract: DAC1350X C100 V100 resistor 100ohm
Contextual Info: DAC1350X 0.18µ µm 10-BIT 75MSPS QUAD-DAC GENERAL DESCRIPTION This core is a CMOS quad-channel 10bit 75MSPS D/A converter for general & video applications. The dac1350x core is implemented in the Samsung 0.18um 3.3V CMOS process. Digital inputs are coded as straight binary.

dct verilog code

Abstract: verilog code DCT 2d dct block verilog code for 8x8
Contextual Info: Ease of Integration & Performance  High clock speed >250 MHz in 0.18um ASIC technologies DCT  Low gate count  Single clock cycle per sample 2-D Forward Discrete Cosine Transform Core operation  Low latency (87 cycles) Design Quality The DCT core implements the 2D Forward Cosine Transform. Most of the image/video

magnachip 0.18um

Abstract: nmos transistor 0.35 um TI 046 magnachip 0.18um 1p6m
Contextual Info: 0.18um 1P6M Low power 1.8V /3.3V updated in 2005.03.16 Features ƒ Vdd Core/IO 1.8V / 3.3V ƒ Substrate P-sub ƒ Well Retrograde Twin Well (Triple Well option) ƒ Isolation STI (Shallow Trench Isolation) ƒ Gate Oxide 37Å/70Å NO Oxide (electrical) ƒ

dct verilog code

Abstract: FI 201 FI 201 datasheet EP20K200E-1
Contextual Info: Ease of Integration & Performance  High clock speed >250 MHz in 0.18um ASIC technologies DCT-FI  Low gate count 2D Forward and Inverse Discrete Cosine Transform Megafunction  Low latency (89 cycles)  Single clock cycle per sample operation on both directions

Contextual Info: Tyco Electronics 36502AR18JTDG Product Details 3650 2A 0.18uH 5% 2K RL Always EU RoHS/ELV Compliant Statement of No Image Available Compliance 36502AR18JTDG TE Internal Number: 51624113 - 0 Active Documentation & Additional Information Product Drawings:

Contextual Info:
      0.18um 1P6M Logic 1.8V /3.3V
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loss tangent of FR4

Abstract: MAX3784 MAX3784UGE 3EB05
Contextual Info: 19-2565; Rev 0; 8/02 5Gbps PC Board Equalizer Features ♦ Spans 40in 1m of FR4 PC Board ♦ 0.18UI Deterministic Jitter Up to 40in ♦ Low Power Consumption: 185mW ♦ Equalization Reduces Intersymbol Interference ♦ Single +3.3V Supply ♦ Standby Mode

Contextual Info: QUALIFICATION REPORT Update Date: 9/23/11 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ885116MLL/MLLI/MLLU Qual vehicles PACKAGE TYPE : ASSEMBLY FAB LOC PROCESS 48L LQFP TICP, Taiwan DONGBU 0.18um KSZ8851-16MLLU MOLD COMPOUND CEL9200HF QUALIFICATION RESULTS:

Contextual Info: RELIABILITY REPORT DATE : 5/08/2013 QUALITY ENG : PURPOSE: H. Grimm MIC2871YMK 1.2A LED Flash Driver with Single Wire Serial Interface PART NUMBER PACKAGE TYPE ASSEMBLY LOCATION FAB LOCATION PROCESS NAME MIC2871YMK LDFN32-14L UNISEM, IPOH MALAYSIA Korea Dongbu 0.18um

DSPG

Abstract: Samsung Soc processor STD110 ASIC 16C450 16C550 ARM920T ARM940T IEEE1284 STD110 piler
Contextual Info: V S MSUNG STD131 ELECTRONICS STD131 Standard Cell 0.18um System-On-Chip ASIC Dec 2000, V2.0 Features 1.8/2.5/3.3V - Leff= 0.15um, Ldrawn = 0.18um Device - Up to 23 million gates - Power dissipation :24nW/MHz 3.3/5.0V - Gate Delay : 48ps @ 1.8V, 1SL Device

OPA BASEBAND MHZ

Abstract: DAC1331X
Contextual Info: 0.18µ µm 10-BIT 40MSPS DAC DAC1331X GENERAL DESCRIPTION The DAC1331X core is a CMOS 10-bit dual D/A Converter Wireless Lan application. The typical conversion rate is 40MHz. It is fabricated with 0.18um process and operated at 1.8Vsingle power. FEATURES

mobile phone circuit diagram

Abstract: mobile camera circuit diagram LCD for mobile phone 3 mobile phone "Camera Module" mobile phone camera circuit diagram video motion jpeg spi ccd camera circuit diagram mobile phone circuit diagram of camera ccd camera module HMS30C7080
Contextual Info: HMS30C7080 0.18um, 132fBGA MPEG4 Codec for Mobile Phone Mobile Phone Camera Back-End Processor ‰ General Description The HMS30C7080 is a integrated circuit for camera mobile phone application. The device provides an excellent solution for camera mobile phone. The device