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    0.35MM BGA Search Results

    0.35MM BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    0.35mm BGA

    Abstract: FR4 1.6mm substrate 0.35mm pitch BGA SF-BGA48C-B-03 FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8
    Contextual Info: Compatible BGA Footprint 16mm [0.630"] 13.5mm [0.531"] 13.2mm [0.520"] 7.29mm [0.287"] 11mm [0.433"] 10.72mm [0.422"] 10.85mm [0.427"] 0.75mm 0.35mm [0.014"] 7.4mm [0.291"] Top View 9.8mm [0.386"] D 0.8 mm x4 0.38mm [0.015"] 9.75mm [0.384"] End View 0.75mm pitch typ.


    Original     		FR4/G10 SF-BGA48C-B-03 SF-BGA048C-B-03 0.35mm BGA FR4 1.6mm substrate 0.35mm pitch BGA FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8 PDF

    0.35mm BGA

    Abstract: BGA 0.35mm pitch 17X17 SF-BGA208D-B-01 SN63 0.35mm pitch BGA
    Contextual Info: 15.00mm [0.591"] 1.13mm [0.044"] 0.80mm pitch typ. 1.13mm [0.044"] Top View 15.00mm [0.591"] 0.35mm [0.014"] dia. Side View 2 0.33mm [0.013"] 5.64mm [0.222"] 8.70mm [0.342"] 1 0.80mm pitch typ. 3 Bottom View Patent # 6,351,392 1 Substrate: 0.0985"±0.006" FR4/G10 or


    Original     		FR4/G10 17X17X4 127mm SF-BGA208D-B-01 0.35mm BGA BGA 0.35mm pitch 17X17 SN63 0.35mm pitch BGA PDF

    0.35mm BGA

    Abstract: BGA 0.35mm pitch SF-BGA107C-B-62F 0.35mm pitch BGA
    Contextual Info: Top View RoHS Compliant 8mm [0.315"] 1.1mm [0.043"] 0.8mm [0.031"] 0.8mm typ. 11mm [0.433"] 8.8mm [0.346"] Detail A 0.89mm [0.035"] 2.83mm [0.112"] 6.4mm [0.252"] Side View Detail A 2 2.48mm [0.098"] 1 3 0.35mm ± 0.05mm [0.014" ± 0.002"] 1 CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins


    Original     		254mm/0 203mm 254mm0 FR4/G10 SF-BGA107C-B-62F 0.35mm BGA BGA 0.35mm pitch 0.35mm pitch BGA PDF

    0.35mm BGA

    Abstract: SG-MLF-7022
    Contextual Info: GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer


    Original     		025mm 275mm 075mm SG-MLF-7022 0.35mm BGA PDF

    1mm pitch BGA socket

    Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
    Contextual Info: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)


    Original     		MIL-STD202, 1mm pitch BGA socket thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO PDF

    IC 7108

    Abstract: SG-BGA-7108 7108 and/cj 7108
    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		f/4/09, 725mm 025mm SG-BGA-7108 125mm. IC 7108 7108 and/cj 7108 PDF

    0.35mm BGA

    Abstract: 7060 SG-BGA-7060
    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. 725mm 025mm SG-BGA-7060 125mm. 0.35mm BGA 7060 PDF

    SG-BGA-7056

    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. SG-BGA-7056 725mm 025mm 125mm. PDF

    SG-BGA-7084

    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		725mm 025mm SG-BGA-7084 125mm. PDF

    BOX21151

    Abstract: SG-BGA-6153 fillister head screw st 6153
    Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		225mm SG-BGA-6153 725mm 725mm 025mm BOX21151 fillister head screw st 6153 PDF

    ic 7085

    Abstract: FR4 thickness 7085 ic SG-BGA-7085 FR4 1.6mm thickness 0.35mm BGA FR4 0.8mm thickness
    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. SG-BGA-7085 725mm 025mm ic 7085 FR4 thickness 7085 ic FR4 1.6mm thickness 0.35mm BGA FR4 0.8mm thickness PDF

    0.35mm BGA

    Abstract: 7063 transistor SG-BGA-7063
    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. 725mm 025mm SG-BGA-7063 125mm. 0.35mm BGA 7063 transistor PDF

    7062

    Abstract: ic 7062 SG-BGA-7062 0.35mm BGA
    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. 525mm 725mm 025mm SG-BGA-7062 125mm. 7062 ic 7062 0.35mm BGA PDF

    7086

    Abstract: BGA Solder Ball 0.6mm 0.35mm BGA SG-BGA-7086 BGA Solder Ball 0.35mm
    Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		475mm. 525mm 725mm 025mm SG-BGA-7086 125mm. 7086 BGA Solder Ball 0.6mm 0.35mm BGA BGA Solder Ball 0.35mm PDF

    SG-BGA-6111

    Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required 32.225mm Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		225mm 725mm 725mm 025mm SG-BGA-6111 125mm. PDF

    0.65mm pitch BGA

    Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
    Contextual Info: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following


    Original     		PDF

    SG-BGA-7112

    Contextual Info: GHz BGA Socket - Direct mount, solderless Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View (Transparent) Compression plate distributes forces evenly Ball guide prevents over compression of elastomer


    Original     		SG-BGA-7112 125mm. PDF

    SG-BGA-7028

    Contextual Info: Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 18.125mm Easily removable socket lid


    Original     		125mm DP110 SG-BGA-7028 PDF

    "0.4mm" bga "ball collapse" height

    Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
    Contextual Info: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller


    Original     		TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 PDF

    General Micro-electronics

    Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip
    Contextual Info: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director


    Original     		PDF

    "0.4mm" bga "ball collapse" height

    Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch
    Contextual Info: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of


    Original     		TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch PDF

    BGA Solder Ball 0.6mm

    Abstract: SF-BGA240N-B-61F
    Contextual Info: 0.6mm [0.024"] 18mm [0.709"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm square [0.661"] Top View 0.2mm dia. [0.008"] 2 1 3.87mm ± 0.254mm [0.152"±0.010"] 0.8mm typ. 3 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non


    Original     		254mm FR4/G10 22x22 SF-BGA240N-B-61F BGA Solder Ball 0.6mm PDF

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Contextual Info: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide PDF

    TSM4405P

    Abstract: TSM8405P Ultra Low Qg
    Contextual Info: TSM8405P Single P-Channel 1.8V Specified MicroSURFTM MOSFET D D S Lateral Power for Load Switching and PA Switch S S G D G VDS = - 12V RDS on , Vgs @ - 4.5V, Ids @ - 4.9A = 50mΩ RDS (on), Vgs @ - 2.5V, Ids @ - 4.4A = 70mΩ RDS (on), Vgs @ - 1.8V, Ids @ - 4.0A = 90mΩ


    Original     		TSM8405P TSM8405P TSM4405P TSM4405P Ultra Low Qg PDF