0.3MM QFP Search Results

Oscilloscope

Abstract: QFP 0.3mm pitch
Contextual Info: MicroGripperTM Oscilloscope Kit Oscilloscope Probe Adapter 0.8mm to 0.3mm Fine-Pitched Probing With Any Standard Oscilloscope w w w w w Connect to devices with lead pitches from 0.8mm to 0.3mm Use on a variety of QFP and SOIC packages Reduces chance of shorting with smallest wire tip diameter 0.08mm

0.3mm qfp

Contextual Info: MicroGripper 0.5-0.3mm MicroGripper Industry's smallest gripper simplifies testing of High-Performance Integrated Circuits w w w w w w w Used on a variety of QFP & SOIC chip packages Connects to devices with lead pitches as small as 0.3mm Reduces chance of shorting with smallest wire tip diameter 0.08mm

qfp 0.3mm pitch

Abstract: CA-QFE128RB-L-S-01 SF-QFE128RB-L-01
Contextual Info: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] Top View 0.3mm [0.012"] 19.56mm [0.770"] 1 8.61mm [0.339"] 3 10.52mm [0.414" plugged] 2 Side View 6.35mm [0.250"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

QFP 0.3mm pitch

Abstract: IPC-4101 345C BOX21151 IPC4553 SF-QFE80SC-L-01F
Contextual Info: RoHS COMPLIANT Emulates QFP package: 12.0mm body 14.0mm Tip to Tip 0.5mm pitch 13.2mm [0.520"] PAD DETAIL 0.5mm Top View 19 0.5mm =9.5mm 0.3mm 12.2mm [0.480"] 13.2mm [0.520"] 0.46mm±0.03mm dia. 0.1mm rad. 1.27mm typ. 2 6.4mm 0.250" 1 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

QFP-128

Abstract: 0.3mm qfp CA-QFE128RB-M-S-01
Contextual Info: 17.3mm [0.681"] 13.49mm [0.531"] 0.5mm typ. 25.96mm [1.022"] 23.3mm [0.917"] 19.49mm [0.767"] 0.3mm [0.012"] Top View 19.56mm [0.770"] 1 Side View 8.61mm [0.339"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

0.3mm qfp

Abstract: SF-QFE176SA-L-01F
Contextual Info: A RoHS COMPLIANT compatible target board land dimensions A< 0.935" B> 1.055" 25.3mm sqr. [0.995"] 23.7mm sqr. [0.935"] B 0.3mm pad [0.012"] 1 0.8mm pad [0.030"] 0.5mm typ. 0.46mm [0.018"] 1.27mm typ. [0.050"] 2 6.4mm ± 0.25mm [0.250" ± 0.010"] 4.7mm [0.187"]

Contextual Info: RN ICPAK Nuaent QFP Sockets REMARKS 3 Check the IC’s pin pitch before insertion. If the IC’s pin pitch is uneven, it might not fit into the socket or the 1C may become damaged. 4) Check that the contacts are clean before mount­ ing. Poor contact may result if the socket contacts

SG-QFE-7002

Abstract: Ultem1000
Contextual Info: Ø 10mm opening GHz QFP Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly

05Mm

Contextual Info: QFP Open Top IC200, IC201, IC218 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage 1,000MQ minimum at 500VDC 500VAC RMS fo r one minute: IC200-2084-009, IC200-2084-010, IC201-1004-008 700VAC RMS fo r one minute: IC200-1284-001, IC 201-0804-005,

Contextual Info: 1C 5 1 /5 3 SERIES S0P/QFP/QFN ICC /QF1(PLCC)/TCP FEATURES • • S ockets tor SOP, QFP and other surface-m ount 1C packages. Custom designs also available for m ulti-lead, fine-pitch and other special packages. SPECIFICATIONS PERFORMANCE Contact our Sales Department for detail. Specifications differ by the contact

bga 7x7

Abstract: BDN21-3CB C2121M cts T412 0.3mm qfp
Contextual Info: CTS Series BDN Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

C2121M cts

Abstract: bdn10-3cba01 BDN21-3CB
Contextual Info: CTS Series BND Extruded Heat Sinks ADHESIVE PEEL AND STICK HEAT SINKS Technical Data ELECTRONIC COMPONENTS Adhesive Peel and Stick Aluminum Heat Sinks • Pre-applied adhesive − just peel off the release liner and press onto the component • With pre-applied adhesive, just peel

CXB1452Q

Abstract: 18bit TTL 2SK303 CXB1451Q QFP080-P-1414 VGA decoder circuit 1PPC 18bit digital ttl rgb to analog vga ttl to vga connector CXB1452
Contextual Info: CXB1452Q VGA/SVGA/XGA digital data serial receiver VEET RED0 4 RED0 (5) RED0 (3) RED0 (2) RED0 (1) VCCT RED0 (0) VEET 80 pin QFP (Plastic) LOS REFRQP SDATAP REFRQN SDATAN VCCA VEEA VEES LPFB LPFA Block Digagram & Pin out TESTSB Features • 1 chip receiver for serial transmission of 18bit color

GVIF connector

Abstract: VIDEO TO SVGA ENCODER
Contextual Info: CXB1451Q VGA/SVGA/XGA digital data serial transmitter For the availability of this product, please contact the sales office. VEET RED0 4 RED0 (5) RED0 (3) RED0 (2) RED0 (1) VCCT RED0 (0) IDLE 80 pin QFP (Plastic) REFREQ VEEE SDATAP VCCE SDATAN VCCA VEEA

CXB1451Q

Abstract: CXB1452Q QFP080-P-1414 ckmode parallel to serial converter GVIF cable
Contextual Info: CXB1451Q VGA/SVGA/XGA digital data serial transmitter VEET RED0 4 RED0 (5) RED0 (3) RED0 (2) RED0 (1) VCCT RED0 (0) IDLE 80 pin QFP (Plastic) REFREQ VEEE SDATAP VCCE SDATAN VCCA VEEA VEES LPFB LPFA Block Digagram & Pin out TESTSB Features • 1 chip transmitter for serial transmission of 18bit color

GVIF

Abstract: CXB1451Q CXB1452Q GVIF cable
Contextual Info: CXB1451Q VGA/SVGA/XGA digital data serial transmitter VEET RED0 4 RED0 (5) RED0 (3) RED0 (2) RED0 (1) VCCT RED0 (0) IDLE 80 pin QFP (Plastic) REFREQ VEEE SDATAP VCCE SDATAN VCCA VEEA VEES LPFB LPFA Block Digagram & Pin out TESTSB Features • 1 chip transmitter for serial transmission of 18bit color

GVIF

Abstract: GVIF cable 18bit TTL 2SK303 CXB1451Q CXB1452Q QFP080-P-1414 30 pin xga lcd connector to vga connector 40 pins lcd to 15 pins vga QFP Package 80 lead
Contextual Info: CXB1452Q VGA/SVGA/XGA digital data serial receiver VEET RED0 4 RED0 (5) RED0 (3) RED0 (2) RED0 (1) VCCT RED0 (0) VEET 80 pin QFP (Plastic) LOS REFRQP SDATAP REFRQN SDATAN VCCA VEEA VEES LPFB LPFA Block Digagram & Pin out TESTSB Features • 1 chip receiver for serial transmission of 18bit color

IC Package Names and Code Designations

Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages

IC201-1604-006

Abstract: IC200-1284-001 IC217 IC217-2404-007 30407 YAMAICHI ic200 YAMAICHI ic248 IC200 IC201-1204-017 ic201-1444-026-2
Contextual Info: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 120 4 - 017 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*

IC201

Abstract: IC201-1604-006 IC217-2404-007 IC248-1284-007 QFP 128 pin Socket IC201-2084-029 IC201-1204-017 IC201-1444-026 IC201-1444-034 IC217-1444-003
Contextual Info: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 120 4 - 017 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*

IC201-0644-003

Abstract: IC201-1004-008 IC201-0644-003 socket 1004 170 IC201-0804-014 IC201-1004-050 IC200 IC201-0644-019 IC201-0644-040 IC201-0804-020
Contextual Info: IC200 to IC248 - Open Top Quad Flat Package QFP Specifications Part Number (Details) IC200 - 064 4 - 019 * - * 1,000MΩ min. at 500V DC or 1,000MΩ min. at 100V DC* Dielectric Withstanding Voltage: 100V AC for 1 minute or 500V AC for 1 minute or 700V AC for 1 minute*

QFP lead pitch 0.3mm

Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
Contextual Info: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration

SF-QFJ256SA-L-01

Contextual Info: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.

SF-QFJ256SC-L-01

Abstract: qfp 0.3mm pitch
Contextual Info: Detail A 41.28mm 1.625 38.99mm 1.535 0.0200" pitch Index pin Pin 256 Pin 1 38.99mm 1.535 41.28mm 1.625 Top View 0.46mm±0.03mm dia. 1.27mm typ. 0.050 2 6.35mm 0.250 1 0.0200" pitch B Side View 1 DETAIL A Substrate: 1.59mm±0.18mm FR4/G10 or equivalent high temp material.