0030 Search Results

Contextual Info: SIEMENS CMPNTSt OPTO 44E D B A23b32b OOOMbT? 2 B S IEX RM-85D Mask-Diffused GaAsP s|«t Monolithic LED W S IE M E N S FW- ? PART NO. 2680-0030 - P-metal anode Diffusion Barrier . Epitaxial Layer . Substrate . N-m etal (cathode)

114250

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 6 4 3 2 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. 25MAY11 LOC DIST AD 00 R E VIS IO N S LTR DESCRIPTION Z4 REVISED PER DATE 2 5M A Y 11 E C O - 1 1-01 0 8 3 9 APVD DWN RK HMR CONTACT AREA PLATED WITH .0 0 0030 MIN GOLD, SOLDER LEADS

Contextual Info: PRODUCT: SESD0402X1UN-0030-088 Single Channel DOCUMENT: SCD28656 REV LETTER: B REV DATE: MARCH 17, 2014 PAGE NO.: 1 OF 6 Silicon ESD Protector 308 Constitution Drive Menlo Park, CA USA www.circuitprotection.com Overvoltage Protection Device Specification Status: RELEASED

SAE J1128

Abstract: J1128 SAE-J-1128 parker 535-53DA02-303 SAE-J1128
Contextual Info: A. HONEYWELL PART NUMBER REV DOCUMENT D 0030760 CHANGED BY CH 14MAY07 CHECK CMH 5 3 5 -5 3 D A 0 2 -3 0 3 B B LEADWIRES 2 20 AWG, SAE J1128, TYPE TXL POLYETHYLENE INSULATION, 125’C RATED TEMP. HOUSING SAE # 360 BRASS, PASSIVATED ”0 ” RING AS 5 6 8 -9 0 6 , NITRILE RUBBER, 90 DUROMETER (PARKER 3 -9 0 6 , BUNA N OR EQUIVALENT)

transistor KSP 13

Contextual Info: 19-0030 ; Rev 0 . 9/ 9 ? K it ftVMLABUE yi/iyjxiyui 500ksp s, 12-B it ADCs w ith T rack /H o id a n d R e fe re n c e _ Featu res The MAX120 and MAX122 complete. BiCMOS, sampling 12-bit analog-to-digital converters ADCs combine an onchip track/hold (T/H) and a low-drift voltage reference with fast

Contextual Info: TAPE AND REEL SPECIFICATIONS MSOP8-MSOP12 CARRIER TAPE OUTLINE MF-PO-D-0030 revision 0.0 TM Monolithic Power Systems TM 0.30±0.05 3 Pin 1 ABCD www.MonolithicPower.com Copyright 2005 MPS. All Rights Reserved. PACKAGE ORIENTATION ABCD NOTES: 1. Measured from the centerline of sprocket hole to centerline of the pocket hole

Contextual Info: 6 THIS DR A WI N G COPYRI GHT IS UNPUBL IS HED. 19 RELEASED BY AMP INCORPORATED. ALL 3 F OR P U B L I C A T I O N RIGHTS R E V IS IO N S RESERVED. LTR 0. 76jjm [. 0 0 00301 MI N GOMO MOR A MENGTH OM 0 . G 4 L 0251 MAX, 0 . 1 3 [ . 0 0 5 1 NI N NROM NATI NG ENO, 3 . 8 1 juinn [ . 0 0 0 1 5 0 ] MI N T I N ON OPPOSI TE ENO FOR A LENGTH

Contextual Info: ANALOG DEVICES INC 42E D • 00301S5 a ■ ANA OfllbaDP ANALOG 16-Bit 100 KSPS D EV IC ES_ Oversampling ADC r-si 10 /6 AD776 □ FEATURES Monolithic 16-Bit ADC Third-Order Noise Shaping 96 dB Dynamic Range 90 dB S/ N + D 16-Bit 100 kHz Output from FIR Filter

Contextual Info: Product Number: 499-93-206-10-003000 Description: Interconnect Socket .100 Grid; Right Angle Socket .018 dia leads Double Row Through Hole Accepts .015-.025" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 803-99-052-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 99 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 499-43-206-10-003000 Description: Interconnect Socket .100 Grid; Right Angle Socket .018 dia leads Double Row Through Hole Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 803-43-056-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-13-006-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Single Row Through Hole Plating Code: 13 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 30 µ" Gold over 50 µ" Nickel #

Contextual Info: Product Number: 801-99-061-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Single Row Through Hole Accepts .015-.025" Leads Plating Code: 99 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 803-43-016-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 803-43-032-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:

Contextual Info: Product Number: 801-99-006-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Single Row Through Hole Plating Code: 99 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating: 100 µ" Tin/Lead(93/7) over 50 µ"

Contextual Info: Product Number: 803-13-010-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 13 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 30 µ" Gold over 50 µ" Nickel

Contextual Info: Product Number: 803-43-072-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 43 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel Inner Contact Plating:

BUZ32

Abstract: T-39
Contextual Info: 30E » 7=55^37 0030124 T • S w # S G S -T H O M S O N S-THOMSON G BUZ32 CHIP k 7 # [iD [S o [i[L[i(giriE(Q)iio(gi N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 156x156 mils METALLIZATION: Top Al Back A u /C r/N i/A u BACKSIDE THICKNESS:

taa 991

Abstract: FI510 9473
Contextual Info: GSM 9 0 0 / 180 0 F la t A n te n n a 1 . E x p la n a tio n o f P a rt N u m b er 0 0 H 00300 □ □□□ □□ — I- 1- r 1 2 3 — I— 4 5 1 : S c rie s ty p e , G SM X X DU C ode 1 2 3 C ode 999 998 997 996 995 994 993

Contextual Info: Product Number: 801-13-026-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Single Row Through Hole Accepts .015-.025" Leads Plating Code: 13 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 30 µ" Gold over 50 µ" Nickel

Contextual Info: Product Number: 803-13-072-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .015-.025" Leads Plating Code: 13 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 30 µ" Gold over 50 µ" Nickel

Contextual Info: Product Number: 803-93-002-10-003000 Description: Interconnect Socket .100 Grid; Low Profile Socket Low Profile Double Row Through Hole Accepts .025-.037 .025 sq post" Leads Plating Code: 93 Shell Plating: 200 µ" Tin/Lead 93/7 over 100 µ" Nickel Inner Contact Plating: