0101X Search Results

Contextual Info: User’s Manual V850ES/KF2 32-bit Single-Chip Microcontrollers Hardware PD70F3728 μPD70F3729 Document No. U17704EJ2V0UD00 2nd edition Date Published December 2006 N CP(K) 2005 Printed in Japan [MEMO] 2 User’s Manual U17704EJ2V0UD NOTES FOR CMOS DEVICES

Contextual Info: User’s Manual V850ES/KG2 32-bit Single-Chip Microcontrollers Hardware PD70F3731 μPD70F3732 Document No. U17703EJ2V0UD00 2nd edition Date Published October 2006 N CP(K) 2005 Printed in Japan [MEMO] 2 User’s Manual U17703EJ2V0UD NOTES FOR CMOS DEVICES

Contextual Info: SCREW TERMINAL TYPE ALUMINUM ELECTROLYTIC CAPACITORS New FXW Series Useful of 8,000 hours at 85°C Warranty of 5,000 hours at 85°C • Conform RoHS Features • Capacitance has been increased by 35% compared with FX2 model by special etched foil technology and new

Contextual Info: User’s Manual V850E/MA3 32-Bit Single-Chip Microcontrollers Hardware µPD703131A µPD703131AY µPD703132A µPD703132AY µPD703133A µPD703133AY µPD703134A µPD703134AY µPD703136A µPD703136AY µPD70F3134A µPD70F3134AY Document No. U16397EJ3V0UD00 3rd edition

Contextual Info: Preliminary User’s Manual V850ES/JF3-L 32-bit Single-Chip Microcontrollers Hardware PD70F3735 μPD70F3736 Document No. U18952EJ1V0UD00 1st edition Date Published February 2008 N 2008 Printed in Japan [MEMO] 2 Preliminary User’s Manual U18952EJ1V0UD

Contextual Info: User’s Manual 78K0R/KE3 16-bit Single-Chip Microcontrollers PD78F1142 μPD78F1143 μPD78F1144 μPD78F1145 μPD78F1146 The 78K0R/KE3 has an on-chip debug function. Do not use this product for mass production because its reliability cannot be guaranteed after the on-chip debug function

Contextual Info: Preliminary User’s Manual V850ES/SG2 32-Bit Single-Chip Microcontroller Hardware µPD703262HY µPD703263HY µPD70F3263HY µPD703272HY µPD703273HY µPD70F3273HY µPD703282HY µPD703283HY µPD70F3283HY Document No. U17644EJ1V0UD00 1st edition Date Published September 2005 N CP(K)

w19b320

Contextual Info: W19B320AT/B Data Sheet 4M x 8/2M × 16 BITS 3V FLEXIBLE BANK FLASH MEMORY Table of Contents1. GENERAL DESCRIPTION . 4 2. FEATURES . 4

GL032A

Abstract: S71GL032A S71GL032
Contextual Info: S71GL032A Based MCPs Stacked Multi-Chip Product MCP Flash Memory and RAM 32 Megabit (2 M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash Memory and 16/8/4 Megabit (1M/512K/256K x 16-bit) Pseudo Static RAM Data Sheet ADVANCE INFORMATION Notice to Readers: The Advance Information status indicates that this

Contextual Info: Freescale Semiconductor Product Preview Xtrinsic Battery Sensor The MM9Z1_638 is a fully integrated Battery monitoring device. The device supports precise current measurement via an external shunt resistor. It features four voltage measurement via an internal calibrated resistor divider or use of an external

703078AY

Abstract: 70F3079AY NEC D76 70307 U14665EJ4V0UD uPD703075AY uPD703076AY uPD703078AY uPD703078Y uPD703079YGC
Contextual Info: User’s Manual V850/SF1 32-Bit Single-Chip Microcontroller Hardware µPD703075AY µPD703075AY A µPD703076AY µPD703076AY(A) µPD703078AY µPD703078AY(A) µPD703078Y µPD703079AY µPD703079AY(A) µPD703079Y Document No. U14665EJ4V0UD00 (4th edition) Date Published September 2003 N CP(K)

L323C

Contextual Info: ADVANCE INFORMATION AMDZ1 Am29DL32xC 32 Megabit 4 M x 8 -Bit/2 M x 16-Bit CMOS 3.0 Volt-only, Sim ultaneous Operation Flash Mem ory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES • Simultaneous Read/Write operations — Data can be continuously read from one bank w hile

Contextual Info: HI-6130 / HI-6131 / HI-6132 MIL-STD-1553 / MIL-STD-1760 3.3V BC / MT / RT Multi-Terminal Device GENERAL DESCPIPTION • The 3.3V CMOS HI-613x device provides a complete single- or multi-function interface between a host processor and MIL-STD-1553B bus. Each IC contains

KL6021

Abstract: Schieberegister 0011X01X Rs485 potentialtrennung KL60
Contextual Info: KL6021 Serielle Schnittstelle RS485 RS422 Konfigurationsanleitung Version 2.1 24.10.2006 Inhaltsverzeichnis Inhaltsverzeichnis 1. Vorwort 3 Hinweise zur Dokumentation Sicherheitshinweise 2. Technische Daten 5 3. Funktionsbeschreibung 6 4. Klemmenkonfiguration

sandisk eMMC 4.41

Abstract: toshiba emmc 4.4 spec SANDISK inand Samsung eMMC 4.41 sandisk emmc 4.5 bcm 4330 programming Guide Sandisk iNAND eMMC toshiba emmc 4.4 linux toshiba emmc 4.4.1 spec sandisk inand extreme emmc
Contextual Info: An addendum for this document is available. See Document ID#: IMX25RMAD. i.MX25 Multimedia Applications Processor Reference Manual Supports i.MX251 MCIMX251 i.MX253 (MCIMX253) i.MX255 (MCIMX255) i.MX257 (MCIMX257) i.MX258 (MCIMX258) IMX25RM Rev. 1 06/2009

xeon mp 4MB

Abstract: intel ia32 AE30 CK408 socket 615-PIN xeon mp 4MB thermal bt 690
Contextual Info: Intel Xeon Processor MP with up to 4MB L3 Cache on the 0.13 Micron Process Datasheet Product Features • ■ ■ ■ ■ Available at 1.50, 1.90, 2, 2.50, 2.80, and 3 GHz Multi-processing server support Binary compatible with applications running on previous members of the Intel®

Contextual Info: CS2082 Dual Airbag Deployment ASIC The CS2082 controls and monitors two airbag firing loops. The independent firing loops are low– and high–side controlled. Device communication is through a Serial Peripheral Interface SPI port, and includes frame error detection circuitry for data reliability.

Contextual Info: User’s Manual The sales of these products are limited for China, Hong Kong, and India. R7F0C01072DNP, 16 R7F0C010B2DFP-C User’s Manual: Hardware 16-Bit Single-Chip Microcontrollers All information contained in these materials, including products and product specifications,

Contextual Info: 64-bit Intel Xeon Processor MP with 1MB L2 Cache Datasheet March 2005 Document Number: 306751-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

DL322

Abstract: DL323 DL324
Contextual Info: PRELIMINARY Am41DL32x4G Stacked Multi-Chip Package MCP Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (512 K x 8-Bit/256 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features

IQ65033QMA10

Contextual Info: Technical S pecification IQ65033QMA10 36-75V @ 10Amp 3.3V & 5.0V Quar ter-Brick ATCA Input/Output MGMT Power Power Inter face Module The IQ65033QMA10 iQor Power Interface Module integrates all features required by the AdvancedTCA Base Specification into a Quarter-Brick footprint. The iQor offers

Contextual Info: Technical S pecification IQ65033QMA10 36-75V @ 10Amp 3.3V & 5.0V Quar ter-Brick ATCA Input/Output MGMT Power Power Inter face Module The IQ65033QMA10 iQor Power Interface Module integrates all features required by the AdvancedTCA Base Specification into a Quarter-Brick footprint. The iQor offers

PLSI 1016-60LJ

Abstract: PAL 007 pioneer pal16r8 programming algorithm PAL 008 pioneer lattice 1016-60LJ ISP Engineering Kit - Model 100 PLSI-2064-80LJ GAL16v8 programmer schematic GAL programming Guide ispLSI 2064-80LT
Contextual Info: Lattice Semiconductor Data Book 1996 Click on one of the following choices: • Table of Contents • Data Book Updates & New Products • Go to Main Menu 1996 Lattice Semiconductor Corporation. All rights reserved. ispLSI and pLSI Product Index Pins Density

78F9177

Abstract: uPD78F9177A UPD78F9177AGB-8ES pd78f9177 78F9177A PD789166 uPD789166Y uPD789167 uPD789167Y uPD789176
Contextual Info: User’s Manual µPD789167, 789177, 789167Y, 789177Y Subseries 8-Bit Single-Chip Microcontrollers µPD789166 µPD789167 µPD789176 µPD789177 µPD78F9177 µPD78F9177A µPD789166 A µPD789167(A) µPD789176(A) µPD789177(A) µPD78F9177A(A) µPD789166Y µPD789166(A1)