02D7 Search Results

BR17

Contextual Info: TMS320C6474 SPRS552H – OCTOBER 2008 – REVISED APRIL 2011 www.ti.com TMS320C6474 Multicore Digital Signal Processor 1 Features 12 • Key Features – High-Performance Multicore DSP C6474 – Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns

mitsubishi split ac

Abstract: 013A1
Contextual Info: t U de nd v e er lo pm en Preliminary Specifications REV.A Mitsubishi microcomputers Specifications in this manual are tentative and subject to change. M16C / 6NT Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER Description Description The M16C/6NT group of single-chip microcomputers are built using the high-performance silicon gate

7813 Texas Instruments Transistor

Abstract: TMS320C6000 TMS320C6474 C6000 C6474 C64X DDR2-667 SPRS552H BR17
Contextual Info: TMS320C6474 SPRS552H – OCTOBER 2008 – REVISED APRIL 2011 www.ti.com TMS320C6474 Multicore Digital Signal Processor 1 Features 12 • Key Features – High-Performance Multicore DSP C6474 – Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns

Contextual Info: DAC1653Q/DAC1658Q Quad 16-bit DAC: 10 Gbps JESD204B interface: x2, x4 and x8 interpolating Advance data sheet Revision 2.3.1 1. GENERAL DESCRIPTION DAC1653Q and DAC1658Q are high-speed, high-performance 16-bit quad channel Digital-to-Analog Converters DACs .

transistor d880

Abstract: BR17
Contextual Info: TMS320C6474 www.ti.com SPRS552E – OCTOBER 2008 – REVISED APRIL 2010 TMS320C6474 Multicore Digital Signal Processor 1 Features 12 • Key Features – High-Performance Multicore DSP C6474 – Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns

1855A

Abstract: PE44586
Contextual Info: BODY CONTACT INSULATOR MATERIALS BRASS NICKEL PLATED GOLD PLATED WHITE DELRIN AND HDPE M O U NTIN G HOLE ASSEMBLY PROCEDURES PASTERNACK ENTERPRISES, INC. P.O BOX 16759, IRVINE, CA 92623 PHONE 949 261-1920 FAX (949) 261-7451 .5 0 0 1. STRIP CABLE AS SHOWN.

D8279

Abstract: M30840MCT M3084
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

REJ09B0324-0200

Abstract: PLQP0064KB-A
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

KFG2G16Q2A

Abstract: 0307h 0719h 63FBGA KFG2G16 onenand oneNand flash
Contextual Info: OneNAND2G KFG2G16Q2A-DEBx OneNAND4G(KFH4G16Q2A-DEBx) FLASH MEMORY KFG2G16Q2A KFH4G16Q2A 2Gb OneNAND A-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

63FBGA

Abstract: KFG1G16Q2B onenand
Contextual Info: OneNAND1Gb KFG1G16Q2B-DEBx FLASH MEMORY KFG1G16Q2B 1Gb OneNAND B-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

21-pin* 4 digits

Abstract: Applications Note U-96 program motor control with ccs software specification Note U-96 x0102 DRC3114 AM32C STPS 20
Contextual Info: REJ09B0271-0100 M32C/80 Group 16/32 Hardware Manual RENESAS 16/32-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / M32C/80 SERIES Before using this material, please visit our website to verify that this is the most current document available. Rev. 1.00 Revision Date: Nov. 01, 2005

REJ09B0267-0100

Contextual Info: User's Manual 32 R32C/111 Group User’s Manual: Hardware R32C/111 Group User’s Manual: Hardware RENESAS MCU M16C Family / R32C/100 Series All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by

high low cut off voltage alarm and delay

Abstract: RG62AU working of 5 pen pc technology 220H-223H 74LS245 82C570 74LS245 buffer 226H MC3486 application 82C574
Contextual Info: 8 CHIPSLinkTM SINGLECHIP “3270” PROTOCOLCONTROLLER Implements IBM 3270 Communication Protocol Dual port RAM control function 2.4K bytes internal microcode Provides IBM 3278/79 and IRMA’” emulation adapter cards interface Provisionsfor external microcode

L33A SMD

Abstract: smd TRANSISTOR code b6 l36a adc 809 wk1 smd EA1 transistor smd PRQP0100JD-B smd code book R8C 702 TRANSISTOR smd l33a
Contextual Info: REJ09B0441-0010 R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, R8C/L3AA Group, 16 R8C/L35B Group, R8C/L36B Group, R8C/L38B Group, R8C/L3AB Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/Lx SERIES Preliminary All information contained in these materials, including products and product specifications,

TSP50C04

Abstract: BD 4914 MX 0541 TSP5220 TSP50C12 BA 59 04AF P DAC 0804 interfacing DAC with 0830 microprocessor LCD 16PIN mozart
Contextual Info: TSP50C0x/1x Family Speech Synthesizer Design Manual 2000 Linear Products SPSS011D IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information

ITT ccu 3000 i

Abstract: ITT CCU CCU3000
Contextual Info: j& p n K | g » tt CCU 3000, CCU 3000-1, CCU 3001, CCU 3001-1, Central Control Unit h Edition Feb. 14, 1995 6251-367-1DS ITT Semiconductors • HbfiS?].! GGG4ò44 b'ìB ■ ITT CCU 3000, CCU 3000-1 CCU 3001, CCU 3001-1 Contents Page Section Title 4 1. 1.1.

Contextual Info: MuxOneNAND1G KFM1G16Q2A-DEBx MuxOneNAND2G(KFN2G16Q2A-DEBx) FLASH MEMORY KFXXX16Q2A 1Gb MuxOneNAND A-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: Datasheet R8C/3NT Group RENESAS MCU 1. R01DS0047EJ0100 Rev.1.00 Jan 25, 2011 Overview 1.1 Features The R8C/3NT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

Contextual Info: R8C/33T Group RENESAS MCU 1. R01DS0046EJ0110 Rev.1.10 Apr 26, 2011 Overview 1.1 Features The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

SLC NAND endurance 100k

Contextual Info: MuxOneNAND1G KFM1G16Q2M-DEB6 MuxOneNAND2G(KFN2G16Q2M-DEB6) FLASH MEMORY MuxOneNANDTMSpecification Density Part No. VCC(core & IO) 1Gb KFM1G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) 2Gb KFN2G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) Version: Ver. 1.0

samsung 2GB Nand flash 121 pins

Abstract: samsung 2GB Nand flash TOGGLE sensing nand flash memory SAMSUNG Electronics Toggle DDR NAND flash
Contextual Info: MuxOneNAND1G KFM1G16Q2M-DEB6 MuxOneNAND2G(KFN2G16Q2M-DEB6) FLASH MEMORY MuxOneNANDTMSpecification Density Part No. VCC(core & IO) 1Gb KFM1G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) 2Gb KFN2G16Q2M-DEB6 1.8V(1.7V~1.95V) Extended 63FBGA(LF) Version: Ver. 1.1

022AH

Contextual Info: OneNAND1Gb KFG1G16Q2B-DEBx FLASH MEMORY KFG1G16Q2B 1Gb OneNAND B-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

4GB MLC NAND

Abstract: SAMSUNG NAND Flash MLC
Contextual Info: MuxOneNAND2G KFM2G16Q2M-DEBx MuxOneNAND4G(KFN4G16Q2M-DEBx) Preliminary FLASH MEMORY KFM2G16Q2M KFN4G16Q2M 2Gb MuxOneNAND M-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

0F80b

Abstract: EM2800 00EM7 IC L1117 PED20 a141 ddx he nv bm10 es2 3024 1B812 C901
Contextual Info: Tri Core 16-Bit Digital Signal Processor MSC8113RM Rev 0, May 2008 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:i.MX Product Family, DragonBall Product Family