030411HC02 Search Results
030411HC02 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Reportable Substances in Components Package Type : TQFP 32 Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead frame plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die ECN 080105HC05 121010HC01 030411HC02 |
Original |
TQFP7x7-32LD-GRN-RS-1 |