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    Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire Solder Lead Plating Silicon Die Rev ECN A 032006HC03 B 101410HC01 Component Weight :


    Original     		PDF QSOPEP-16LD-PBY-RS-1 032006HC03 101410HC01