041913HC01 Search Results
041913HC01 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : TSSOP 20LD Lead #: No 1 2 3 4 5 6 7 Material Content in % Molding Compound 58.58% Copper Alloy Frame 38.16% Internal Plating 0.10% Silver Die Attach Epoxy 0.21% Gold Wire 1.35% External Plating 0.14% Silicon Die |
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TSSOP-20LD-GRN-RS-3 041913HC01 |