100 TQFP Search Results

EPC1213PC8

Abstract: EPC1PC8 EPC2LC20 epc2tc32 EPC4QC100 EPM7128* kit NIOS-EVALKIT-1C12 EPC1441PC8 EPC16UC88 EPM1270F256C5ES
Contextual Info: NEW! Package 100-TQFP 100-TQFP 100-TQFP 44-TQFP 44-TQFP 44-TQFP 44-TQFP 84-PLCC 100-TQFP 100-TQFP 100-TQFP 144-TQFP 100-TQFP 100-TQFP 144-TQFP * Tube CPLD’s Cont. Macro Cells Logic Elements Pin-Pin Delay (ns) I/O Pins Voltage Speed (NS) 64 64 64 64 64

APA150 -TQ1001 datasheet

Abstract: ProASICPLUS Flash Family FPGAs v4.0 APA1000 624 CCGA AA23 APA075 APA150 APA300 APA450 APA600
Contextual Info: ProASICPLUS Flash Family FPGAs Package Pin Assignments 100-Pin TQFP 1 100 100-Pin TQFP v4.0 2-1 ProASICPLUS Flash Family FPGAs 100-Pin TQFP 100-Pin TQFP 100-Pin TQFP Pin Number APA075 Function APA150 Function Pin Number APA075 Function APA150 Function Pin

UBGA49

Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
Contextual Info: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm

Contextual Info: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .

rp113

Contextual Info: dsPIC33EP512GM710 dsPIC33EP512GM710 100-Pin TQFP to 100-Pin Plug-In Module PIM Information Sheet OVERVIEW The dsPIC33EP512GM710 100-Pin TQFP to 100-Pin Plug-In Module (PlM) (MA330035) is designed to demonstrate the capabilities of the dsPIC33EP512GM710 device, which is a highperformance, 16-bit Digital Signal Controller (DSC).

MS-026-AED-HD

Abstract: SV-100-1
Contextual Info: 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] SV-100-1 Dimensions shown in millimeters a 0.75 0.60 0.45 16.00 BSC SQ 1.20 MAX 14.00 BSC SQ 100 1 SEATING PLANE 76 76 75 100 75 1 PIN 1 BOTTOM VIEW (PINS UP) TOP VIEW (PINS DOWN) CONDUCTIVE HEAT SINK

MS-026-AED-HD

Abstract: MS-026-AED AD9430
Contextual Info: a 0.75 0.60 0.45 100-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP/EP] SV-100 Dimensions shown in millimeters and (inches) 1.20 MAX 16.00 SQ 14.00 SQ 100 1 76 76 75 100 1 75 SEATING PLANE TOP VIEW (PINS DOWN) CONDUCTIVE HEAT SINK 50 25 26 50 49

MS-026-AED-HD

Abstract: MS-026-AED TQFP-EP 050BSC MS-026AED-HD MS026-AED-HD MS-026 TQFP
Contextual Info: a 100-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP/EP] SV-100 Dimensions shown in millimeters 1.20 MAX 0.75 0.60 0.45 16.00 SQ 14.00 SQ 100 1 76 76 75 100 1 75 SEATING PLANE BOTTOM VIEW TOP VIEW (PINS DOWN) 50 25 26 0.20 0.09 25 49 1.05 1.00 0.95

FLX100

Abstract: NQPACK100SE
Contextual Info: M3T-FLX-100NSE Converter for Connecting 100-core Flexible Board FLX100 to 100-pin 0.4mm-pitch TQFP External View and Dimensions Function The M3T-FLX-100NSE is a converter for connecting the FLX100 100-core flexible board to a foot pattern of a 100-pin 0.4mm-pitch TQFP 100PFB-A . This converter can be used

TQFP-EP

Abstract: SV-100-8 SV1008
Contextual Info: a 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] SV-100-8 Dimensions shown in millimeters 0.75 0.60 0.45 1.20 MAX 16.00 BSC SQ 14.00 BSC SQ 76 76 100 1 75 100 75 1 PIN 1 6.10 BSC SQ EXPOSED PAD TOP VIEW (PINS DOWN) 0° MIN 1.05 1.00 0.95 0.15 0.05

MS-026-AED-HD

Abstract: TQFP-EP
Contextual Info: 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP] SV-100-3 Dimensions shown in millimeters a 0.75 0.60 0.45 16.00 BSC SQ 1.20 MAX 14.00 BSC SQ 76 76 100 1 75 100 75 1 PIN 1 EXPOSED PAD 0° MIN 1.05 1.00 0.95 0.15 0.05 SEATING PLANE 0.20 0.09 7° 3.5°

APA600

Abstract: AA23 APA075 APA1000 APA150 APA300 APA450 APA750
Contextual Info: ProASICPLUS Flash Family FPGAs Package Pin Assignments 100-Pin TQFP 1 100 100-Pin TQFP Note For Package Manufacturing and Environmental information, visit the Package Resource center at . v5.8 2-1 ProASICPLUS Flash Family FPGAs

HY628400LLG

Abstract: HY628400LG-I HY628400LLP 8K*8 sram 52-PIN
Contextual Info: •HYU N DAI QUICK REFERENCE SRAM ORGANIZATION 64K bit 8Kx8 256K bit (32Kx8) 6 PART NUMBER SPEED(ns) FEATURES HY6264AP HY6264ALP HY6264ALLP HY6264AJ HY6264ALJ HY6264ALLJ 70/85/100/120 70/85/100/120 70/85/100/120 70/85/100/120 70/85/100/120 70/85/100/120

Contextual Info: dsPIC33FJ64GS610 dsPIC33FJ64GS610 100-pin TQFP to 100-pin Plug-In Module PIM Information Sheet OVERVIEW The dsPIC33FJ64GS610 is a high-performance 16-bit Digital Signal Controller in a 100-pin TQFP package. The dsPIC33FJ64GS610 PIM is designed to demonstrate the capabilities of the dsPIC33FJ64GS610

Contextual Info: Preliminary GS880Z18/36T-166/150/133/100 100 Pin TQFP Commercial Temp Industrial Temp 166-100 Mhz 8Mb Pipelined and Flow Through 3.3V VDD 2.5V & 3.3V VDDQ Synchronous NBT SRAMs Features Functional Description • 512kx18 and 256kx36 Configurations. • User configurable Pipelined and Flow through mode.

GS881Z18T

Contextual Info: Preliminary GS881Z18/36T-11/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp MHz 8Mb Pipelined and Flow Through 100 MHz–66 3.3 V VDD Synchronous NBT SRAMs 2.5 V and 3.3 V VDDQ Features Functional Description • 512K x 18 and 256K x 36 configurations

tQFP pitch

Abstract: TQFP100
Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)

Contextual Info: Preliminary GS880Z18/36T-11/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp MHz 8Mb Pipelined and Flow Through 100 MHz–66 3.3 V VDD Synchronous NBT SRAMs 2.5 V and 3.3 V VDDQ Features • 512K x 18 and 256K x 36 configurations • User configurable Pipeline and Flow Through mode

Contextual Info: Preliminary GS880E18/32/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 8Mb Sync Burst SRAMs Features 100 MHz–66 MHz 3.3 V VDD 3.3 V and 2.5 V I/O interleave order with the Linear Burst Order LBO input. The

36T-11

Abstract: GS881E18
Contextual Info: Preliminary GS881E18/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp MHz 512K x 18, 256K x 36 ByteSafe 100 MHz–66 3.3 V VDD 8Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O 1.10 9/2000Features counter may be configured to count in either linear or

Contextual Info: Preliminary GS88118/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp MHz 512K x 18, 256K x 36 ByteSafe 100 MHz–66 3.3 V VDD 8Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features be used. New addresses can be loaded on every cycle with no

Contextual Info: Preliminary GS881E18/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp MHz 512K x 18, 256K x 36 ByteSafe 100 MHz–66 3.3 V VDD 8Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features be used. New addresses can be loaded on every cycle with no

Contextual Info: Preliminary GS88118/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp MHz 512K x 18, 256K x 36 ByteSafe 100 MHz–66 3.3 V VDD 8Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O 1.11 9/2000Features counter may be configured to count in either linear or

Contextual Info: Preliminary GS880E18/32/36T-11/11.5/100/80/66 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 8Mb Sync Burst SRAMs Features 100 MHz–66 MHz 3.3 V VDD 3.3 V and 2.5 V I/O interleave order with the Linear Burst Order LBO input. The