100-6 807 Search Results

BR2025

Contextual Info: Date PCB LATOUT #58 0.042 Drill 2PL SYM REVISION RECORD AUTH DR. CK. (-)Neg Term .256(6.50) ± .0 1 5 .807 (20.50±0.3) H older - 0 (+)Pos Term 0.750 [0 1 9 .0 5 ] 0.890 [0 2 2 .6 1 ] .420 [1 0 .6 6 ] LOCKING STAKE 2PL 1.075 [2 7 .3 1 ] ,100 [2 .5 3 ] .274 [6 .9 6 ]

Contextual Info: E G & G/HEIMANN OPTOELE b5E D T003320 0000033 bM5 HEIMANN TPS 408 Thermopile Sensors Thermoelement Sensoren 0,3 unit Einheit mm2 condition Bedingung - typ. 100 V/W typ. 100 uV/VHZ 6.14 pm 1 Hz, 100 °C 25 °C, pk pk typ. 35 kQ 25 °C W/VHZ type Sensitive Flache

LE7189

Contextual Info: 6-102567-5 Product Details - Tyco Electronics Page 1 of 2 | | | 6-102567-5 Product Details .100 inch AMPMODU 2 Piece Quick Links Always EU RoHS/ELV Compliant Statement of Compliance Check Pricing & Availability Search for Tooling Product Feature Selector

Contextual Info: KYOCERA INC/ ELCO CORP 71E » • S5R300b 0Q03354 420 Mating Condition Dual Row Receptacle. Headerx i SERIES 8261 HEADER ROUND POST 2.54/. 100 $ - 6 1 -1 5 Post Contact \ Header Hole Pattern Mounting A 2 .5 4 /.100 o o I \ \ 0 . 8 ~ I .I /0 . O3I-.O43 Triple

Contextual Info: Technical Specifications ELCO Technical Data B asic grid 100 2 54 x 100(2,54) In s e rtio n Force Series 8251 8352 8275 8281 8381 1-6 oz per contact W ith d ra w a l force 75 oz mm. per contact C o n ta c t re s is ta n c e 12 millohms max for gold plating

90130-1218

Abstract: Molex 90130-1310 90130-1216 molex 90142 90130-1208 90130-1214 90130-1224
Contextual Info: Dense Packaging A 2.54mm .100" Pitch C-Grid III Shrouded Header FEATURES AND SPECIFICATIONS Features and Benefits Sizes 6 to 64 circuits Contact and plating orientation according to DIN 41651 North/south contact orientation avoids overstress High pin retention

Contextual Info: Dense Packaging A 2.54mm .100" Pitch C-Grid III Shrouded Header FEATURES AND SPECIFICATIONS Features and Benefits Sizes 6 to 64 circuits Contact and plating orientation according to DIN 41651 North/south contact orientation avoids overstress High pin retention

Contextual Info: Dense Packaging A 2.54mm .100" Pitch C-Grid III Shrouded Header FEATURES AND SPECIFICATIONS Features and Benefits Sizes 6 to 64 circuits Contact and plating orientation according to DIN 41651 North/south contact orientation avoids overstress High pin retention

Contextual Info: Dense Packaging A 2.54mm .100" Pitch C-Grid III Shrouded Header FEATURES AND SPECIFICATIONS Features and Benefits Sizes 6 to 64 circuits Contact and plating orientation according to DIN 41651 North/south contact orientation avoids overstress High pin retention

DDR0515DT

Abstract: DDR0505S ddr0512dt DDR2405S ddr1215dt DDR2805S ddr2815dt DDR1212DT DDR4815DT DDR2812DT
Contextual Info: mterpoint 10301 Willows Road P.O. Box 97005 DDR SERIES DC-DC CONVERTERS Redmond, WA 9 8073-9705 TEL: 206 882-3100 • • • • • • • • FAX: (2 0 6 )8 8 2 -1 9 9 0 Up to 3.0 watts output power 100 Megohm isolation at 500 Vdc Standard 24-pin DIP package

transistor b 1238

Abstract: diode 1334 transistor A 1264 1334 diode 2.54mm Header 2.54mm Header 16 Pin 2.54mm shrouded header 94v-o Molex 90130-1310 molex header datasheet 6
Contextual Info: 2.54mm .100" Pitch C-Grid III Shrouded Header Features and Benefits • Sizes 6 to 64 circuits ■ Contact and plating orientation according to DIN 41651 ■ North/south contact orientation avoids overstress ■ High pin retention ■ Polarized ■ Friction lock

thm 6043

Abstract: ull 2803
Contextual Info: I C S R 13 MIL-C-39003/01 M allorY Solid Tantalum Capacitors Hermetically Sealed GENERAL SPECIFICATIONS Graded Failure Rates Operating Temperature: -55 'C to +125 C (With proper derating) Voltage Range: 6 to 100 WVDC @ 85°C Reverse Voltage (non-continuous):

pin shroud rows

Abstract: 90130-3308 3108 3212 A data sheet 901303106 5352 F
Contextual Info: 2.54mm .100" Pitch C-Grid III Shrouded Header Features and Benefits • Sizes 6 to 64 circuits ■ Contact and plating orientation according to DIN 41651 ■ North/south contact orientation avoids overstress ■ High pin retention ■ Polarized ■ Friction lock

C812

Abstract: MOLEX 8 pin 90142 A-126 DDD7147 94v-0 1808
Contextual Info: m o S e x 2.54mm .100" Pitch C-Grid III Shrouded Header C-Grid FEATURES AND SPECIFICATIONS D Features and Benefits • Sizes 6 to 64 circuits ■ Contact and plating orientation according to DIN 41651 ■ North/south contact orientation avoids overstress

DSP56300

Abstract: HD10 HD15 MSC7119 SC1400
Contextual Info: Freescale Semiconductor Data Sheet Document Number: MSC7119 Rev. 6, 7/2007 MSC7119 Low-Cost 16-bit DSP with DDR Controller and 10/100 Mbps Ethernet MAC • StarCore SC1400 DSP extended core with one SC1400 DSP core, 256 Kbyte of internal SRAM M1 memory, 16 way 16 Kbyte

AL6001

Contextual Info: í w # d lld 'IIIU IV Ib Q N ^ 7 # . G A L 6 0 0 1 S RfflD [S©ll[Lll OT R!]D©i E2P R 0 M CMOS PROGRAMMABLE LOGIC DEVICE • ELECTRICALLY ERASABLE CELL TECHNOLOGY — Instantly reconfigurable logic — Instantly reprogrammable cells — Guaranteed 100% yields

CQ 765

Abstract: CQ 637 CQ 818 FLK022
Contextual Info: FLK022XP : FLK022XV GaAs F ET u n dH E M T Chips ELECTRICAL CHARACTERISE CS Amb ent Temperature Ta=25° C Item Symbol Saturated Drain Current IDSS Test Conditions 100 150 mA - 50 - mS -1.0 -2.0 -3.5 V -5 - - V 23 24 - dBm 6 7 - dB - 32 - % VdS = 5V, Ids = 65mA

4010 IC

Abstract: 2N6062 2N5927 ic 4010 2N4866 50110 TO-114 2N1936 2N1937 2N3266
Contextual Info: NEU ENGLAND SEMICONDU CTOR b S b M ' m D000GS7 m 3 SRE D «NES Ic max — 2 0 to 6 0 A V ceo(sus) = 4 0 to 3 0 0 V fT = 0.6 to 3 0 MHz NPN TÜ-63 Case 807 V ce (sat ) @ IC/lB ( V @ A/A) VBE (SAT) @ IC/lB (V @A/A) VBE @ IC/VCE (V @ A/V) pd @ TC = 100 °C (Watts)

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C 6 5 4 3 2 RELEASED FOR PUBLICATION LOC REVISIONS DIST ALL RIGHTS RESERVED. COPYRIGHT 1 P DIM L .070 LTR DESCRIPTION DATE DWN APVD .010 DIM D D D C C DIM R DIM W .175 DIM K DIM S TYP .100 TYP .115 TYP DIM T TYP .930 .572 .155

IN3492

Abstract: sg 4001 diode 1NA4 md914 35C10 1N20b 1n67a 0a202 diode iN3495 1469r
Contextual Info: NIAX VAX U E S 0 2 5 ° D IO D E Vw PRV If Vf IR T Y P E u S E 0A5 100 .3 5 1 .3 30 G GP 0 A6 60 .3 5 1 .3 9 .0 G GP 0A7 30 .2 5 1 .7 6 .0 G SW O A IO 30 1 .0 .9 5 600 G SW OA3I 85 12 0 .7 40 G GP 0A47 30 .1 5 .6 5 10 G 0A70 2 2 .5 . 15 .2 5 30 G RF OA71 90

edp FLEX

Contextual Info: 13 II 12 IS 9 T 8 6 1 70430 3 1 CKT. SIZE NOTES; 1) PRE LOADED ASSEMBLY TO BE USED WITH 0.30)/.0 12 MAX. THICK FLAT FLEX CABLE WITH (1.57)/.062 WIDE COPPER CONDUC TO RS ON (2.54)/.100 CENTERS OR, (0.13)/.005 - (0.28)/.01 I THICK MYLAR WITH (1.02)/.040 - (1.65)/.065 WIDE SILVER INK CONDUC TO RS ON

aeg vde 0435

Abstract: oki relay aeg thyristors aeg diode Si 61 L 240V AC/48v output rectifiers circuit diagrams
Contextual Info: CONTA-ELECTRONICS ELECTRONICS CONTA-ELECTRONICS CONTA-ELECTRONICS Program Overview 3 4 5 6 10 14 16 22 23 25 27 30 32 34 35 38 39 40 44 46 48 50 52 54 56 58 66 67 68 70 76 90 91 92 94 95 96 98 100 102 104 106 110 112 113 Fuse, Component, Diode and Indicator Modules

Contextual Info: CONVERSION CHART] INCH .004 0.10 .009 0.23 .010 0.25 0.48 .031 0,79 1 .035 0.90 I 1.4° .067 .100 I 035 TYP. I T — T-— T~-T=-— T~~=F 2 1 3 LJ 4 6 L.J 7 LJ LJ g - =T 10 jJ I .125 3.18 I .140 3.56 I .197 5.00 .200 5.08 .267 6.78 DIM.'H .031 .498 12.65

TMP68303F16

Contextual Info: TMP68303F-16 1/3 IL22 * C-MOS 16-BIT MICRO PROCESSOR 51 55 GND 76 60 65 70 VDD(+5V) 75 —TOP VIEW— VDD(+5V) 50 80 45 85 40 GND GND 90 35 95 26 25 20 15 GND 5 10 VDD(+5V) 1 100 VDD(+5V) 30 (VDD = +5 V) PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14