1000MI Search Results

Contextual Info: xCORE-USB MODULAR DEVELOPMENT SYSTEM KIT FEATURES
Flexible core board o 1000MIPS 16-core multicore microcontroller with 128KB SRAM XS1-U16-128 o Three I/O slots for sliceCARDs §• Two digital slots §• One mixed signal slot
High Speed USB Device

Contextual Info: RoHS COMPLIANT Circuit 1 Specifications: Molding Materia : PA6&PA66,UL 94V-0 NO FLAME IEC 60335-1 rev.4 Color: Natural&White Current Rating: 7A AC,DC Voltage Rating: 250V AC,DC Temperature Range : -25 °C —1-85 °C Contact Resistance : lOmfi Max Insulation Resistance: 1000Mi2Min

Contextual Info: 0.10 CN4 CN1 0.16 0.10 1.52 CN3 CN2 0.16 0.16 0.16 1.52 LV-32MX MCU Card Dimensions v100 All Dimensions are in inches 1inch = 1000mil, 1inch = 2.54cm MikroElektr onika Development systems WEB: www.mikroe.com FORUM: www.mikroe.com/forum

2SB1258

Abstract: 2SD1785 FM20 DSA0016505
Contextual Info: 3 k Ω (1 0 0Ω) E 2SB1258 Silicon PNP Epitaxial Planar Transistor (Complement to type 2SD1785) A µA –100min hFE VCE=–2V, IC=–3A 1000min V IB –1 A VCE(sat) IC=–3A, IB=–6mA –1.5max PC 30(Tc=25°C) W VBE(sat) IC=–3A, IB=–6mA –2max Tj

2SB1258

Abstract: 2sb125 2SD1785 FM20
Contextual Info: 3 k Ω (1 0 0Ω) E 2SB1258 Silicon PNP Epitaxial Planar Transistor (Complement to type 2SD1785) A µA –100min hFE VCE=–2V, IC=–3A 1000min V IB –1 A VCE(sat) IC=–3A, IB=–6mA –1.5max PC 30(Tc=25°C) W VBE(sat) IC=–3A, IB=–6mA –2max Tj

Contextual Info: 0.10 CN27 CN28 0.16 0.10 1.22 CN26 CN29 0.16 0.16 0.16 1.22 dsPICPRO3 MCU Card Dimensions v100 All Dimensions are in inches 1inch = 1000mil, 1inch = 2.54cm MikroElektr onika Development systems WEB: www.mikroe.com FORUM: www.mikroe.com/forum

Contextual Info: 0.10 CN4 CN1 0.16 0.10 1.52 CN3 CN2 0.16 0.16 0.16 1.52 LV-18FJ MCU Card Dimensions v100 All Dimensions are in inches 1inch = 1000mil, 1inch = 2.54cm MikroElektr onika Development systems WEB: www.mikroe.com FORUM: www.mikroe.com/forum

Contextual Info: UGF6R832I843C Data sheets can be downloaded at www.unigen.com 32M Bytes 8M x 32 bits LINEAR FLASH MODULE 80 Pin Strata Flash SIMM based on 8 pcs 4M x 8 Strata Flash GENERAL DESCRIPTION PIN ASSIGNMENT (Front View) 80 Pin SIMM The UGF6R832I843C is a 8,298,608 bits by

Contextual Info: UGF6C132E811C Data sheets can be downloaded at www.unigen.com 4M Bytes 1M x 32 bits LINEAR FLASH MODULE 80 Pin Flash SIMM based on 8 pcs 512K x 8 Flash GENERAL DESCRIPTION PIN ASSIGNMENT (Front View) 80 Pin SIMM The UGF6C132E811C is a 1,048,576 bits by 32 FLASH SIMM module .The UGF6C132E811C is

Contextual Info: Panasonic P la stic Film C a p a cito rs = E quipped w ith a S afety M echanism = M etallized P olyester/P olypropylene Film C apacitor Type ECHAX N o n -in d u c tiv e c o n s tru c tio n , F la m e -re ta rd a n t e p o x y resin d ip p e d enclosure • Features

tic d 271

Contextual Info: Panasonic Plastic Film Capacitors M e tallized P olyester Film C a p a citor Type ECWS N on-inductive construction, Flam e-retardant plastic case, Fast-on type/Lead wire type. • Features •Self-healing propety •Flame-retardant ■ R ecom m ended Applications

ROD426

Abstract: AX2020 AM227 3YL-20 AM237 A4017 roq425 AM257 AM247 AM227M
Contextual Info: Synchron Servomotoren Serie AM227.297 Technische Beschreibung, Montage, Inbetriebnahme Ausgabe 12.2001 Bisher erschienene Ausgaben Ausgabe Bemerkung 11 / 1999 Erstausgabe 04 / 2000 Motor AM227LL aufgenommen, Erweiterte Darstellung der Kennlinien, weitere Optionen

HPA-E61

Abstract: HPA-T63 HPA-P61 HPA-R61 Transistor E11 HPA-R63 HPA-A61 HPA-D61 HPA-E63 HPA-T61
Contextual Info: SR. No. Yamatake Corporation SPECIFICATIONS THROUGH SCAN POLARIZED RETROREFLECTIVE SCAN SET EMITTER RECEIVER H P A -T 6 3 H P A -E 63 H P A -R 63 H P A -P 63 HPA-T61 HPA-E61 HPA-R61 HPA-P61 DIFFUSE SCAN DIFFUSE SCAN SELF-DIAGNOSIS/ LIGHT SOURCE : RED LIGHT SOURCE : INFRARED

edo dram 50ns 72-pin simm

Contextual Info: UG216W3258HSG T 64M Bytes (16M x 32) 72Pin SIMM based on 8M X 8 DRAM Features General Description The UG216W3258HSG(T) is a 16,777,216 bits by 32 SIMM module. The UG216W3258HSG(T) is assembled using 8 pcs of 8Mx8 3.3V 4K refresh EDO DRAM in 50 Pin TSOP package mounted on a 72 Pin printed circuit

UG32W3216GSG

Contextual Info: UG32W3216GSG Revision History Sep 02 , 1999 Rev - A 45388 Warm Springs Blvd. FULL Data sheet released. Fremont, CA. 94539 Tel: 510 668-2088 Fax: (510) 661-2788 support@unigen.com Re-Tek- 351_ µPD UG32W3216GSG 8M Bytes (2M x 32) DRAM 72Pin SODIMM based on 1M X 16

Contextual Info: UG10M14001DBG T Revision History Feb 17 , 1999 Rev - B Feb 16 , 1999 Rev - A Added More Detailed Dimension Information Of PCB , Full Data sheet Changed to new format. Data sheet released. 45388 Warm Springs Blvd. Fremont, CA. 94539 Tel: (510) 668-2088 Fax: (510) 661-2788

Contextual Info: UG31C321 4 6GSG 4M Bytes (1M x 32) DRAM 72Pin SODIMM based on 1M X 16 Features General Description The UG31C321(4)6GSG is a 1,048,576 bits by 32 SODIMM module.The UG31C321(4)6GSG is assembled using 2 pcs of 1M x 16 1K/4K refresh DRAMs in 42-pin SOJ package mounted on a 72 pin

Contextual Info: UG216D3654HKG T 64M Bytes (16M x 36) DRAM 72Pin SIMM w/ECC based on 16M X 4 General Description Features The UG216D3654HKG(T) is a 16,777,216 bits by 36 SIMM module.The UG216D3654HKG(T) is assembled using 9 pcs of 16Mx4 4K refresh DRAMs 400mil SOJ Package mounted on 72 Pin

Contextual Info: UG34C322 4 4GTG 16M Bytes (4M x 32) DRAM 72Pin SODIMM based on 4M X 4 Features General Description The UG34C322(4)4GTG is a 4,149,304 bits by 32 SODIMM module.The UG34C322(4)4GTG is assembled using 8 pcs of 4M x 4 2K/4K refresh DRAMs in 24-pin TSOP package mounted on a 72pin printed circuit board.

Contextual Info: UG54W742 4 4GJ(T)G 32M Bytes (4M x 72) DRAM 168Pin DIMM With ECC based on 4M x 4 General Description Features The UG54W742(4)4GJ(T)G is a 4,194,304 bits by 72 EDO DRAM module. The UG54W742(4)4GJ(T)G is assembled using 18 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in

Contextual Info: UG54W662 4 4GJ(T)G 32M Bytes (4M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG54W662(4)4GJ(T)G is a 4,194,304 bits by 64 EDO DRAM module. The UG54W662(4)4GJ(T)G is assembled using 16 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in

UG2M13201PBT

Contextual Info: UG2M13201PBT-6AT Data sheets can be downloaded at www.unigen.com 4M Bytes 1M x 32 bits FPM MODE DRAM MODULE FPM Mode 72Pin SIMM based on 2 pcs 1M x 16 DRAMs with LVTTL, 1K Refresh GENERAL DESCRIPTION PIN ASSIGNMENT (Front View) 72-Pin SIMM FEATURES Single 5V ± 10% power supply

Contextual Info: UG32W322 4 8GSG Revision History Mar 12 , 1999 Added More Detailed Dimension Information Of PCB , Full Data sheet Rev - B Changed to new format. Nov 06 , 1998 Rev - A Datasheet released. 45388 Warm Springs Blvd. Fremont, CA. 94539 Tel: (510) 668-2088 Fax: (510) 661-2788

Contextual Info: UG42S6428GSG-PL Data sheets can be downloaded at www.unigen.com 16M Bytes 2M x 64 bits SYNCHRONOUS DRAM MODULE PC100 SDRAM Unbuffered SODIMM based on 8 pcs 2M x 8 SDRAM with LVTTL, 2 banks & 2K Refresh GENERAL DESCRIPTION PIN ASSIGNMENT (Front View) 144-Pin SODIMM