103 TTM Search Results

BJ3157F-4TS

Abstract: BJ3157F-2C
Contextual Info: MTG HDLE DESCRIPTION DASH ND MODEL ND -2C BJ3157F-2C CL .103 DIA -2T -4C -4T BJ3157F-2T THD 4-40UNC-2B BJ 3 157F-4C CL THD .103 DIA CL THD .103 DIA CL THD .103 DIA BJ3157F-4T -2CS BJ3157F-2CS -2TS BJ3157F-2TS -4CS BJ3157F-4CS -4TS BJ3157F-4TS TYPE 4-40UNC-2B

Contextual Info: DATA SHEET 10GBPS 850NM VCSEL ARRAYS HFE8004-103, HFE8012-103 FEATURES: 850nm cathode common VCSEL array Capable of 10Gbps per channel modulation Fully tested and Burned in with STABILAZETM process 1x4 and 1x12 version The HFE80xx-103 are high-performance 850 nm VCSEL Vertical Cavity SurfaceEmitting Laser array die optimized for high-speed data communications.

HFE8004-103

Abstract: VCSEL die bonding VCSEL array common anode VCSEL array, 850nm 10GBPS 850NM HFE8012-103 T-25 laser DFB 1550nm 10mW VCSEL array driver
Contextual Info: DATA SHEET 10GBPS 850NM VCSEL ARRAYS HFE8004-103, HFE8012-103 FEATURES: 850nm cathode common VCSEL array Capable of 10Gbps per channel modulation Fully tested and Burned in with STABILAZETM process 1x4 and 1x12 version The HFE80xx-103 are high-performance 850 nm VCSEL Vertical Cavity SurfaceEmitting Laser array die optimized for high-speed data communications.

BJ3157f

Abstract: 4-40-UNC-2B
Contextual Info: DASH ND MODEL ND -2C -2T -4C BJ3157F-2C BJ3157F-2T -4T -2CS -2TS -4CS -4TS TYPE CL MTG HOLE DESCRIPTION A DIM BJ3157F-4C BJ3157F-4T THO CL THD ,103 DIA 4-40UNC-2B ,103 DIA 4-40UNC-2B BJ3157F-2CS BJ3157F-2TS CL THD ,103 DIA 4-40UNC-2B .425 BJ3157F-4CS BJ3157F-4TS

VCSEL array common anode

Abstract: VCSEL die bonding VCSEL array, 850nm HFE8012-103 Finisar 1x12 VCSEL
Contextual Info: DATA SHEET 10GBPS 850NM VCSEL ARRAYS HFE8004-103, HFE8012-103 FEATURES: 850nm cathode common VCSEL array Capable of 10Gbps per channel modulation Fully tested and Burned in with STABILAZETM process 1x4 and 1x12 version The HFE80xx-103 are high-performance 850 nm VCSEL Vertical Cavity SurfaceEmitting Laser array die optimized for high-speed data communications.

Finisar 1x12 VCSEL

Abstract: VCSEL array common anode VCSEL array, 850nm
Contextual Info: DATA SHEET 10GBPS 850NM VCSEL ARRAYS HFE8004-103, HFE8012-103 FEATURES: 850nm cathode common VCSEL array Capable of 10Gbps per channel modulation Fully tested and Burned in with STABILAZETM process 1x4 and 1x12 version The HFE80xx-103 are high-performance 850 nm VCSEL Vertical Cavity SurfaceEmitting Laser array die optimized for high-speed data communications.

BJ3157F-2C

Abstract: 4-40UNC-2B 4-40-UNC-2B Trompeter Electronics BJ3157F BJ3157F-4C trompeter 14949 BJ3157f BJ3157F-4T 15B30 Trompeter Electronics
Contextual Info: DASH ND -2C -2T -4C -4T TYPE MTG HDLE DESCRIPTION A DIM BJ3157F-2C BJ3157F-2T CL THD .103 DIA 4-40UNC-2B .425 BJ3157F-4C BJ3157F-4T CL .103 DIA 4-40UNC-2B .687 MDDEL ND -2CS BJ3157F-2CS -2TS BJ3157F-2TS -4CS BJ3157F-4CS -4TS BJ3157F-4TS THD CL THD CL THD .103 DIA

Contextual Info: PART N U MB E R 305-0960 DESCRIPTION 305-0960-1 .103 CLEARANCE 4-40UNC-2B HOLES THREADED HOLES .425 BASIC SHOWN 4. FEMALE SUBMINIATURE CONCENTRIC TWINAX/TRIAX SOLDER P O T 2 H O L E F L A N G E MO U N T B U L K H E A D J A C K TTM S T Y L E 3. SOLDER 2.

LD 7576 OS

Abstract: atf15* cross reference ELF COIL RECEIVER accelerator rockwell modem 1032C1 M90F AL-2001 ATF-13 L3900
Contextual Info: RC288ACL/VFC Modem Designer’s Guide 1 INTRODUCTION 1.1 SUMMARY 1.2 • Data modem throughput up to 115.2 kbps -V.Fast Class V.FC , V.32 bis. V.32, V.22 bis. V.22A/B, V.23, and V.21; Bell 212A and 103 -V .42 LAPM and MNP 2-4 error correction -V .42 bis and MNP 5 data compression

Contextual Info: STAüP: KKGS 2 5 5 5 -3 - ( ) SEE TABLE PUT. PENO. RESISTOR RESIST VALUE SEE TABLE NOTES: 1. WTERFACE PER U1-ST0-348, FIG. 301-1. 2. MATERIALS: NSULATOR: TEFLON. ASTM-D-4894 GASKET & O-RWG: S I RUB., ZZ-R -765 WASHER: PHOS. BRONZE, ASTM-B-103 SPRMG HASHER A OUTER CONTACT: BER. COP., A STM -B-196

Contextual Info: MULTILAYER CHIP CERAMIC CAPACITOR • ÌIJ B M X 7 R tf# nm an«««, im u s m e . • * 4 -5 5 t:-1 2 5 T C Ift* B rt, ttH ± i5 % . * «Attft&ttfnatiitt, iSftTlslilftaift«*. • mm •£££«@KI/T^ B 0805 1 103 ~T ~T ® N T T T T T © © © © K

Mic5009

Abstract: MIC5009CN
Contextual Info: mCREL SEMICO NDU CTOR 34E I> E3 h Q û flfln GD0GSM5 4 E3 MRL M IC 5 0 0 9 C N Counter Time-Base Circuit • M M a R M M M M n H S S Q W S n a W M in M M B ttM B H M H I General Description Features The MIC5009 is a highly versatile MOS oscillator and divider

Contextual Info: 16 Subminiature bulkhead jacks 150/3150 Series trs/ttm 1.050 BJ157 Shown BJ158 Shown 1.070 .402 .620 ACCEPTS .034 MAX DIA CONDUCTOR .750 .437 HEX .3125-32UNEF-2A .375 HEX NUT .093 DIA HOLE .500 HEX .375-32UNEF-2A .437 HEX NUT 3-lug BJ157 Front mount, Solder pot

BJ3158

Abstract: BJ158
Contextual Info: 16 Subminiature bulkhead jacks 150/3150 Series trs/ttm 1.050 BJ157 Shown BJ158 Shown 1.070 .402 .620 ACCEPTS .034 MAX DIA CONDUCTOR .750 .437 HEX .3125-32UNEF-2A .375 HEX NUT .093 DIA HOLE .500 HEX .375-32UNEF-2A .437 HEX NUT 3-lug BJ157 Front mount, Solder pot

103 ttm

Contextual Info: 15 Subminiature jacks & plugs 150/3150 series trs/ttm Subminiature Jacks & Plugs. Subminiature concentric twinax/triax connectors increase packing density up to 246%. Designed for high density applications where digital, video pair, or baseband "noise free guarded" circuits are required. The 3-lug, 4-lug, and

Contextual Info: 15 Subminiature jacks & plugs 150/3150 series trs/ttm Subminiature Jacks & Plugs. Subminiature concentric twinax/triax connectors increase packing density up to 246%. Designed for high density applications where digital, video pair, or baseband "noise free guarded" circuits are required. The 3-lug, 4-lug, and

Contextual Info: Thann Aluminum Electrolytic Capacitors CD110XM 85'c, 2ooo/hw. ttmm&. °ratt# General Small size, long life, 85"C, 2000 hours, high stability and reliability s ^ T v c D , dvd. s in . Used in VCD, DVD, big screen color-TV, air conditioning, washing machine circuits etc.

SD-70LP

Abstract: SD-70LS
Contextual Info: jsnisn l f m fnrmlnniMinn/ttmzi FRONT VIEW SIDE VIEW M16 A p plicatio n Note: SPECIFICATIONS: use 20AWGN24AWG wire INSULATION RESISTANCE: 100M0HM @ 500VDC. DIELECTRIC STRENGTH: 1.000V A C /1 MINUTE. CONTACT RESISTANCE: 20mOHM MAX. RATING: 100VAC 2A. CUI INC

SD-80LP

Contextual Info: M16 SPECIFICATIONS: INSULATION RESISTANCE: 100M0HM @ 500VDC. DIELECTRIC STRENGTH: 1.000V A C /1 MINUTE. CONTACT RESISTANCE: 20mOHM MAX. RATING: 100VAC 2A. PC RLE NAME: s d - 8 0 lp.dwg copyright 2002 by cui inc 5 3 .5 iiM Pfnifnuniinwnifnvn -»IH SL i l luni fntifMinnimlnn/ttmzi

moto

Abstract: lifo
Contextual Info: 3 /$ ' M ulti tur a T n m p o ls * ith 25 t u r n i Ahd ratod Por 0 6 w aM t a t T fl'C . M a n tilic lu n d w ilh Ih« lechnical a s iiik m c e c \ S o u rn s In c . USA, Iheaa tinm pola m a ln ttm intarnaMortai Cavala ol quaWy and rei lab II ¡|y, MINIATURE MULTITURN

PDC 140M

Abstract: SRA-3H SYM-11MH ERA-3SM 99 NAT-1 ZHL-2-50P3 MAV-11SM T16KK81 JCIQ-176M ZFM20
Contextual Info: Model Index l Dot indicates surface mount models. mixers l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l l pages ADE-1 . ADE-1ASK . ADE-1H .

M 16100 39 2 1019

Contextual Info: SPC560P34L1, SPC560P34L3 SPC560P40L1, SPC560P40L3 32-bit Power Architecture based MCU with 320 KB Flash memory and 20 KB RAM for automotive chassis and safety applications Datasheet − production data Features • ■ Up to 64 MHz, single issue, 32-bit CPU core

Contextual Info: SPC560P34L1, SPC560P34L3 SPC560P40L1, SPC560P40L3 32-bit Power Architecture based MCU with 320 KB Flash memory and 20 KB RAM for automotive chassis and safety applications Features • Up to 64 MHz, single issue, 32-bit CPU core complex e200z0h – Compliant with Power Architecture®

Spc560p40

Abstract: linflex SPC560P34L1 73d15
Contextual Info: SPC560P34L1, SPC560P34L3 SPC560P40L1, SPC560P40L3 32-bit Power Architecture based MCU with 320 KB Flash memory and 20 KB RAM for automotive chassis and safety applications Features • Up to 64 MHz, single issue, 32-bit CPU core complex e200z0h – Compliant with Power Architecture®