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    111X109 Search Results

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    Aluminum Backside

    Contextual Info: SO LITR O IM P O W E R M O S F E T CHIP NUMBER CONTACT METALLIZATION Top Contact: A Aluminum 22,000 Backside Contact: 3,000 A Gold ASSEM BLY RECOMMENDATIONS It is advisable that: 111 MILS 2.81mm a) the chip be eutectically mounted with gold silicon preform 98/2% .


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    TIS88A equivalent

    Abstract: 2N3456 equivalent J411 fet 2n5952 equivalent 2n3820 equivalent 2N5248 equivalent fet 2N4304 2n5245 equivalent 2N4304 equivalent 2N5454 equivalent
    Contextual Info: a t t m ,© O R D E R IN G IN F O R M A T IO N Devices, Inc T O / » © 0© T Q K © K lO tP i M f l® The following is the product code index lor J-FET and MOS FET DIE/WAFERS having 2N, 3N JEDEC prefixes. This product code index is Solitron San Diego's standard for Q. A. production, marketing and sales.


    OCR Scan     		20x40 111x109 TIS88A equivalent 2N3456 equivalent J411 fet 2n5952 equivalent 2n3820 equivalent 2N5248 equivalent fet 2N4304 2n5245 equivalent 2N4304 equivalent 2N5454 equivalent PDF

    top 261

    Abstract: SOLITRON
    Contextual Info: S O LIT R O N P O W E R M O S FET CHIP NUMBER /O CONTACT METALLIZATION Top Contact: A Aluminum 22,000 Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS It is advisable that: 111 MILS 2.81mm a) the chip be eutectically mounted with gold silicon preform 98/2%.


    OCR Scan     		20x40 111x109 top 261 SOLITRON PDF