112910HC09 Search Results
112910HC09 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : QFN 10 Lead #: No 1 2 3 3 4 5 6 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 112910HC09 Content in % 58.71% 34.66% |
Original |
QFN22-10LD-GRN-RS-3 112910HC09 |