120909HC01 Search Results
120909HC01 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : TSSOP 16 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Leadframe Plating Silver Die Attach Epoxy Gold Wire Silicon Die Content in % 51.84% 32.35% 1.01% 1.94% 2.44% |
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TSSOP-16LD-PBY-RS-3 120909HC01 |