140MBIT Search Results

PDH/SDH

Abstract: CMI encoder 78P2351 GR-253 GR-253-CORE STM-1e nrz optical TPK 03 microcontroller optics fiber TDK TRACE CODE INFORMATION
Contextual Info: 78P2351 Single Channel OC-3/ STM1-E/ E4 LIU TARGET DATASHEET APRIL 2003 DESCRIPTION FEATURES The 78P2351 is TDK’s second generation LIU for 155 Mbit/s SDH/SONET OC-3, STS-3, or STM-1 and 140Mbit/s PDH (E4) applications. The device is a single chip solution that includes an integrated

nrz optical

Abstract: 78P2352 GR-253 GR-253-CORE T151 CMI encoder PO23D
Contextual Info: 78P2352 Dual Channel OC-3/ STM1-E/ E4 LIU TARGET DATASHEET MARCH 2003 DESCRIPTION FEATURES The 78P2352 is TDK’s second generation LIU for 155 Mbit/s SDH/SONET OC-3, STS-3, or STM-1 and 140Mbit/s PDH (E4) applications. The device is a dual channel, single chip solution that includes an

T-110

Abstract: 78P2351 GR-253 GR-253-CORE tamura Pulse transformer
Contextual Info: 78P2351 Single Channel OC-3/ STM1-E/ E4 LIU PRELIMINARY DATASHEET FEBRUARY 2004 DESCRIPTION FEATURES The 78P2351 is TDK’s second generation Line Interface Unit LIU for 155 Mbit/s SDH/SONET (OC3, STS-3, or STM-1) and 140Mbit/s PDH (E4) applications. The device is a single chip solution

SDH ADM

Abstract: MultiService Access Platform Frame structure for Multiplexing of four E2 streams into E3 stream barker code motorola STM-1 Physical interface PHY STS-3c-SPE DS33 k4h561638f trace code micron label
Contextual Info: ABRIDGED DATA SHEET Rev: 101508 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper _ General Description _Features ♦ Support for EoS in One STS-3c/VC-4, EoS Over Up to Three Concatenated STS-1/VC-3s,

OPA623

Abstract: OPA623AP OPA623AU
Contextual Info: OPA623 OPA 623 OPA 623 Wide Bandwidth, Current-Feedback OPERATIONAL AMPLIFIER FEATURES APPLICATIONS ● BANDWIDTH: 350MHz, 2.8Vp-p ● HIGH OUTPUT CURRENT: ±70mA ● BROADCAST/HDTV EQUIPMENT ● HIGH-SPEED DIGITAL COMMUNICATIONS SLEW RATE: 2100V/µs, 5Vp-p

Contextual Info: OPA623 B U R R - B R O W N AVAILABLE IN DIE Wide Bandwidth, Current-Feedback OPERATIONAL AMPLIFIER FEATURES APPLICATIONS • • • • • • • • • • • • BANDWIDTH: 350MHz, 2.8Vp-p HIGH OUTPUT CURRENT: ±70mA SLEW RATE: 2100V/ns, 5Vp-p DIFFERENTIAL GAIN/PHASE: 0.12%/0.05°

Contextual Info: PRODUCT BRIEF DS3177 DS3/E3 Single-Chip Transceiver FEATURES GENERAL DESCRIPTION The DS3177 combines a DS3/E3 framer and an LIU single-chip transceiver to interface to a DS3/E3 physical copper line. • •  APPLICATIONS  Routers and Switches Multiservice Access

GENERAL INSTRUMENT DTMF

Contextual Info: issue 3.qxd 02/Dec/2004 12:20 Page 1 Telecommunications MIAMI Remote Network Monitoring Allows pro-active fault finding of telecomms networks from a central site. Uses configurable scans and graphical displays • Reduces maintenance costs Proactive Fault Finding

CR3425

Abstract: OPA623 OPA623AP OPA623AU Burr-Brown three phase sine wave generator
Contextual Info: OPA623 OPA 623 OPA 623 Wide Bandwidth, Current-Feedback OPERATIONAL AMPLIFIER FEATURES APPLICATIONS ● BANDWIDTH: 350MHz, 2.8Vp-p ● BROADCAST/HDTV EQUIPMENT ● HIGH OUTPUT CURRENT: ±70mA ● SLEW RATE: 2100V/µs, 5Vp-p ● HIGH-SPEED DIGITAL COMMUNICATIONS

Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment

RELAY RZ2 h12

Abstract: RELAY RZ2 G12 transistor k72 t8 transistor bipolar k72 65 k82 TZ62 rz24 relay K117 datasheet rz2 d12 relay k6f y2
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment

SMD K2F

Abstract: step down transformer 230 v to 15 v DS3171N BSP19 k117 GR msap smd diode K2F transistor k117 DS3171 DS3172
Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper

703 op amp

Abstract: op 50MHZ OPEN CR3425 OPA623 OPA623AD OPA623AP OPA623AU Burr-Brown three phase sine wave generator
Contextual Info: OPA623 OPA 623 OPA 623 Wide Bandwidth, Current-Feedback OPERATIONAL AMPLIFIER FEATURES APPLICATIONS ● BANDWIDTH: 350MHz, 2.8Vp-p ● BROADCAST/HDTV EQUIPMENT ● HIGH OUTPUT CURRENT: ±70mA ● SLEW RATE: 2100V/µs, 5Vp-p ● HIGH-SPEED DIGITAL COMMUNICATIONS

Contextual Info: PRELIMINARY PRELIMINARY DS3150 3.3V T3/E3/STS-1 Line Interface Unit www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § § § § § § § § Integrated transmit and receive for T3, E3, and STS-1 line interfaces Performs clock/data recovery and wave

Contextual Info: PRELIMINARY PRODUCT BRIEF Rev: 071207 DS33M30/DS33M31/DS33M33 Ethernet Over SONET/SDH Mapper Features General Description The DS33M30 family of products provide a compact and efficient solution for transporting Gigabit Ethernet traffic over STM-1/OC-3 Optical networks. With the

Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper

Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com GENERAL DESCRIPTION DS3/E3/STS-1 PORTS APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment Routers and Switches

M88E1111

Abstract: LCD 1602D
Contextual Info: Genesys Board Reference Manual Revision: May 8, 2013 Note: This document applies to REV C of the board. 1300 Henley Court | Pullman, WA 99163 509 334 6306 Voice and Fax Overview The Genesys circuit board is a complete, ready-to-use digital circuit development

Digital Oscilloscope Wideband amplifier

Abstract: CR3425 OPA623 OPA623AD OPA623AP OPA623AU
Contextual Info: OPA623 OPA 623 OPA 623 Wide Bandwidth, Current-Feedback OPERATIONAL AMPLIFIER FEATURES APPLICATIONS ● BANDWIDTH: 350MHz, 2.8Vp-p ● BROADCAST/HDTV EQUIPMENT ● HIGH OUTPUT CURRENT: ±70mA ● SLEW RATE: 2100V/µs, 5Vp-p ● HIGH-SPEED DIGITAL COMMUNICATIONS

HG73M

Abstract: IBM "embedded dram" HG71C HG73C Hitachi Semiconductor Hitachi DSA00186
Contextual Info: HG72C Series µCBIC - embedded SH-1 RISC ASIC Product Brief Description The HG72C Series is a family of cell-based integrated circuits CBICs implemented in advanced 0.6µm CMOS process technology featuring 5.0 V and 3.3 V low-voltage core operation. Process-optimized

PLCC-48 footprint

Abstract: an362 78P7200 78P7200L DS3150 DS3150GN DS3150Q DS3150QN DS3150T DS3150TN
Contextual Info: PRELIMINARY DS3150 3.3V T3 / E3 / STS-1 Line Interface www.dalsemi.com FEATURES • • • • • • • • • • • • • • • • • • • • • • Integrated transmit and receive for T3, E3 and STS-1 line interfaces Performs clock/data recovery and wave

smd K2F

Abstract: smd diode K2F din en iso 10664 J58-J5E K117 datasheet RGC W5 transistor k117 812e3 K117 DS3171N
Contextual Info: DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION FUNCTIONAL DIAGRAM The DS3171, DS3172, DS3173, and DS3174 DS317x combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper

Contextual Info: OPA623 B U R R - BROWN Wide Bandwidth, Current-Feedback OPERATIONAL AMPLIFIER FEATURES APPLICATIONS • BANDWIDTH: 350MHz, 2.8Vp-p • HIGH OUTPUT CURRENT: ±70mA • SLEW RATE: 2100V/|as, 5Vp-p • BROADCAST/HDTV EQUIPMENT • HIGH-SPEED DIGITAL COMMUNICATIONS

HG71C

Abstract: HG73C HG73M hitachi sh4 Hitachi Semiconductor ttl logic gates micro-controller 1550 3.3V HG74C Hitachi DSA00186
Contextual Info: HG73C Series µCBIC - embedded H8/300H, H8S, SH-1, & SH-3 ASIC Product Brief Description The HG73C Series is a family of cell-based integrated circuits CBICs implemented in advanced 0.35µm CMOS process technology featuring 3.3 V and 2.0 V core operation. Process-optimized libraries are