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    16 PIN DIP WITH HEAT SINK Search Results

    16 PIN DIP WITH HEAT SINK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4KMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4MMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4NQF10FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation

    16 PIN DIP WITH HEAT SINK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Thermal Management

    Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
    Text: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.


    Original     		PDF

    Motorola ULN2068B

    Abstract: all ic data Motorola ic DATA BOOK ULN2068 ULN2068B uln2060 motorola DTL
    Text: Order this document by ULN2068/D ULN2068 Quad 1.5 A Sinking High Current Switch The ULN2068B is a high–voltage, high–current quad Darlington switch array designed for high current loads, both resistive and reactive, up to 300 W. It is intended for interfacing between low level TTL, DTL, LS and 5.0 V


    Original     		PDF ULN2068/D ULN2068 ULN2068B ULN2068/D* Motorola ULN2068B all ic data Motorola ic DATA BOOK ULN2068 uln2060 motorola DTL

    Untitled

    Abstract: No abstract text available
    Text: OVEN INDUSTRIES, INC. OPERATING MANUAL Model 5C7-550 A THERMOELECTRIC MODULE TEMPERATURE CONTROLLER CAUTION: Always be careful around heaters and TE modules, their related heat sinks, or other parts of the thermal system. Do not come into contact with a hot or very cold surface. Use a thermal fuse for


    Original     		PDF 5C7-550 5C7-550 24volt

    tape head pre amplifier

    Abstract: TAPE RECORDER bias application TAPE RECORDER cassette tape head 16DIP300 1N60 PACKAGE diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER bias
    Text: 1 CHIP TAPE RECORDER SYSTEM S1A2213C01 INTRODUCTION The S1A2213C01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300


    Original     		PDF S1A2213C01 S1A2213C01 14pin/16 14-DIPH-300 16-DIP-300 150pF 1000pF tape head pre amplifier TAPE RECORDER bias application TAPE RECORDER cassette tape head 16DIP300 1N60 PACKAGE diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER bias

    TAPE RECORDER bias

    Abstract: TAPE RECORDER bias application 16DIP300 diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER tape head pre amplifier PRE-AMPLIFIER FOR TAPE RECORDER
    Text: 1 CHIP TAPE RECORDER SYSTEM S1A2213B01 INTRODUCTION The S1A2213B01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300


    Original     		PDF S1A2213B01 S1A2213B01 14pin/16 14-DIPH-300 16-DIP-300 150pF 1000pF TAPE RECORDER bias TAPE RECORDER bias application 16DIP300 diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER tape head pre amplifier PRE-AMPLIFIER FOR TAPE RECORDER

    HI1568PSI

    Abstract: TL1553-45 MIL-STD-1553 voltage HI-1567 TQ1553 TQ1553-2 HI-1568 HI-1569 HI-1567CDI HI-1567PSI
    Text: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers May 2003 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1567, HI-1568 MIL-STD-1553 HI-1569 MIL-STD-1553A MIL-STD-1760, 44-pin 20-PIN HI1568PSI TL1553-45 MIL-STD-1553 voltage HI-1567 TQ1553 TQ1553-2 HI-1568 HI-1567CDI HI-1567PSI

    Untitled

    Abstract: No abstract text available
    Text: SMB1N-1550 v 1.0 1.07.2014 Description SMB1N-1550 is a surface mount InGaAsP High Power LED with a typical peak wavelength of 1550 nm and radiation of 16 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-1550 SMB1N-1550

    124 008r

    Abstract: No abstract text available
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER July 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 124 008r

    3188 diode

    Abstract: 124 008r
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER December 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 3188 diode 124 008r

    124 008r

    Abstract: ESD 138C
    Text: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER July 2005 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


    Original     		PDF HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 124 008r ESD 138C

    T405R

    Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
    Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink


    Original     		PDF WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    SMB1N-670D-02

    Abstract: No abstract text available
    Text: SMB1N-670D-02 v 1.0 17.03.2014 Description SMB1N-670D-02 is a surface mount AlGaInP High Power LED with a typical peak wavelength of 670 nm and radiation of 290 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-670D-02 SMB1N-670D-02

    SMB1N-D660N

    Abstract: No abstract text available
    Text: SMB1N-D660N v 1.0 16.01.2014 Description SMB1N-D660N is a surface mount AlGaInP High Power LED with a typical peak wavelength of 660 nm and radiation of 250 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-D660N SMB1N-D660N

    SMB1N-670D

    Abstract: No abstract text available
    Text: SMB1N-670D v 1.0 11.06.2014 Description SMB1N-670D is a surface mount AlGaInP High Power LED with a typical peak wavelength of 670 nm and radiation of 250 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-670D SMB1N-670D

    SMB1N-740D-02

    Abstract: No abstract text available
    Text: SMB1N-740D-02 v 1.1 17.07.2014 Description SMB1N-740D-02 is a surface mount AlGaAs High Power LED with a typical peak wavelength of 740 nm and radiation of 290 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-740D-02 SMB1N-740D-02

    ixdd614

    Abstract: IXDI614 ixdd614ci JEDEC standard 033 ixdn614si 614C IXDD614YI
    Text: IXD_614 14-Ampere Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • 14A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V


    Original     		PDF 14-Ampere IXDD614 IXDI614 IXDN614 614-R03 ixdd614ci JEDEC standard 033 ixdn614si 614C IXDD614YI

    Untitled

    Abstract: No abstract text available
    Text: IXD_614 14-Ampere Low-Side Ultrafast MOSFET Drivers Features Description • 14A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V


    Original     		PDF 14-Ampere IXDD614 IXDI614 IXDN614 614-R02

    IXDD614

    Abstract: IXDD614CI IXDD614YI IXDI614 IXDI614PI IXDD614PI IXDD614SI IXDD614SITR IXDN614 IXDN614PI
    Text: IXD_614 14-Ampere Low-Side Ultrafast MOSFET Drivers Features Description • 14A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V


    Original     		PDF 14-Ampere IXDD614 IXDI614 IXDN614 614-R01 IXDD614CI IXDD614YI IXDI614PI IXDD614PI IXDD614SI IXDD614SITR IXDN614PI

    HI-1573PST

    Abstract: HI-1573PSI HI-1573PCT HI-1573 hi-1573pci HI-1574PCT HI-1573CDM HI_1573PSI HI1573PSI HI-1573CDI
    Text: HI-1573, HI-1574 MIL-STD-1553 3.3V Monolithic Dual Transceivers May 2003 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to


    Original     		PDF HI-1573, HI-1574 MIL-STD-1553 MIL-STD-1553A 44-pin 20-PIN HI-1573PST HI-1573PSI HI-1573PCT HI-1573 hi-1573pci HI-1574PCT HI-1573CDM HI_1573PSI HI1573PSI HI-1573CDI

    SMB1N-D660-02

    Abstract: No abstract text available
    Text: SMB1N-D660-02 v 1.0 24.07.2014 Description SMB1N-D660-02 is a surface mount AlGaInP High Power LED with a typical peak wavelength of 660 nm and radiation of 330 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-D660-02 SMB1N-D660-02

    SMB1N-420H

    Abstract: No abstract text available
    Text: SMB1N-420H v 1.0 17.07.2014 Description SMB1N-D420H is a surface mount InGaN High Power LED with a typical peak wavelength of 420 nm and radiation of 420 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-420H SMB1N-D420H SMB1N-420H

    SMB1N-420H-02

    Abstract: No abstract text available
    Text: SMB1N-420H-02 v 1.0 17.07.2014 Description SMB1N-420H-02 is a surface mount InGaN High Power LED with a typical peak wavelength of 420 nm and radiation of 420 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.


    Original     		PDF SMB1N-420H-02 SMB1N-420H-02

    Untitled

    Abstract: No abstract text available
    Text: rm h a r r is S E M I C O N D U C T O R C lA i^ m ¡^ m PRELIMINARY Quad-Gated Inverting Power Driver Features Description • Independent Over-Current Limiting On Each Output The CA3262 is used to interface Low-Level Logic to High Current Loads. Each Power Driver has four inverting


    OCR Scan     		PDF CA3262