16 PIN DIP WITH HEAT SINK Search Results

16 pin dip with heat sink

Abstract: 580200B00000G
Contextual Info: Standard Heat Sinks For use with 14 or 16 PIN DIP packages Part Number - 580200B00000G Mechanical Outline Drawing 10/24/2007 Page 2 of 3 A Dim 6.35 Thermal Curves Therm based o Product Information Part # Description Finish 580200B00000G Slide on heat sink with angled

Thermal Management

Abstract: Heatsinks for 14 pin dip 16 pin dip with heat sink njm3717 NJM3771 NJM3772 NJM3774 NJM3770A NJM3777
Contextual Info: Thermal Management New JRC’s stepper motor ICs are power Ics encapsulated in Dual in Line DIP , EMP and PLCC (Plastic Leaded Chip Carrier) packages. The silicon die is directly bonded to a heat-spreading lead-frame for efficient heat-transfer to an external heat sink, or to a copper ground plane on the printed circuit board.

NTE422

Abstract: NTE209 NTE410 NTE426 NTE430 NTE417 NTE421 TO3 SILICONE MICA SHEET DATA SHEET NTE435K28 NTE436W22
Contextual Info: HARDWARE & ACCESSORIES NTE Type Number Diagram Number Quantity Per Pkg NTE400 NTE401 NTE402 NTE403 NTE404 NTE405 NTE406 NTE406A NTE410 NTE411 NTE412 NTE440A NTE440B 362 352 363 364 365 366 373 727 354 345 367 520 520 2 2 2 2 1 1 2 2 2 2 2 1 1 Heat Sink for TO5/TO39 Type Package

Y1212

Abstract: b0505s-1w BM025 PMB2409 vrb2405d-5w PMB4824 ADP05C24A ADP05C24 Y051 WRB0515S-1W
Contextual Info: ADPCA Series FEATURES INPUT SPECIFICATIONS ● LCD Display Appropriative ● Single Output ● Small Footprint ● SIP Package ● Industry Standard Pinout ● UL94-V0 Package ● No Heat sink Required ● Temperature Range: -20°C -+71°C ● No External Components Required

Motorola ULN2068B

Abstract: all ic data Motorola ic DATA BOOK ULN2068 ULN2068B uln2060 motorola DTL
Contextual Info: Order this document by ULN2068/D ULN2068 Quad 1.5 A Sinking High Current Switch The ULN2068B is a high–voltage, high–current quad Darlington switch array designed for high current loads, both resistive and reactive, up to 300 W. It is intended for interfacing between low level TTL, DTL, LS and 5.0 V

Contextual Info: OVEN INDUSTRIES, INC. OPERATING MANUAL Model 5C7-550 A THERMOELECTRIC MODULE TEMPERATURE CONTROLLER CAUTION: Always be careful around heaters and TE modules, their related heat sinks, or other parts of the thermal system. Do not come into contact with a hot or very cold surface. Use a thermal fuse for

Contextual Info: M3WPWA_D Series 4:1 WIDE INPUT ISOLATED & REGULATED 3W OUTPUT DUAL OUTPUT 24 DIP PACKAGE FEATURES RoHS PRODUCT PROGRAM ● Wide 4:1 Input Range ● Operating Temperature: -40°C~+85°C ● 1.5KVDC Isolation ● Dual Output ● UL94-V0 Package ● No Heat Sink Required

682-2102

Abstract: amp 3510 682-2101 CRYDOM CX240D5
Contextual Info: C r y d o m Company Solid State Relays For Complete Product Specifications c FAX-ON-DEMAND, Call 888-267-9188 for Instant Specs on Your FAX c www.crydom.com Ñ View and Download Specifications AC Series SDV, SDI, DPA AC Series ASPF PowerFin Ñ Integral Heat Sink

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

SIP 400B

Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
Contextual Info: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS

16DIP300

Abstract: TAPE RECORDER bias tape head pre amplifier TAPE RECORDER bias application EARJ diode 1n60 1N60 S1A2213C01 S1A2213C01-D0B0 S1A2213C01-H0B0
Contextual Info: 1 CHIP TAPE RECORDER SYSTEM S1A2213C01 INTRODUCTION The S1A2213C01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300

tape head pre amplifier

Abstract: TAPE RECORDER bias application TAPE RECORDER cassette tape head 16DIP300 1N60 PACKAGE diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER bias
Contextual Info: 1 CHIP TAPE RECORDER SYSTEM S1A2213C01 INTRODUCTION The S1A2213C01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300

TAPE RECORDER bias

Abstract: TAPE RECORDER bias application 16DIP300 diode 1n60 DUAL PRE-AMPLIFIER FOR TAPE RECORDER tape head pre amplifier PRE-AMPLIFIER FOR TAPE RECORDER
Contextual Info: 1 CHIP TAPE RECORDER SYSTEM S1A2213B01 INTRODUCTION The S1A2213B01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300

TAPE RECORDER bias

Abstract: TAPE RECORDER bias application tape head pre amplifier 16DIP300 DUAL PRE-AMPLIFIER FOR TAPE RECORDER diode 1n60 ALC RECORDER PRE-AMPLIFIER FOR TAPE RECORDER TAPE RECORDER 1N60 diode
Contextual Info: 1 CHIP TAPE RECORDER SYSTEM S1A2213B01 INTRODUCTION The S1A2213B01 is a monolithic integrated circuit consisting of a preamplifier, ALC circuit, and power amplifier in a 14pin/16 pin plastic dual-in-line package with heat sink. 14−DIPH−300 FEATURES 16−DIP−300

Teledyne

Contextual Info: ö'llTbbT QQOQSÔS 3 • TSS 45E D TELEDYNE SOLID STATE WTELEDYNE SOLID STATE MODEL MILITARY SOLID STATE RELAY 682-1 M28750/9 OPTICALLY ISOLATED 1 A, 250 Vrms (2 A with Heat Sink) SPST/SO FEATURES • JAN Relay, qualified to MIL-R-28750 PART NUMBER* MILITARY

FSBB30CH60C

Abstract: AN-9044 FSBB15CH60C schematic diagram inverter air conditioner FSBB20CH60C pneumatic system used in train heat sink design guide, inverter, water cooling IGBT INVERTER CIRCUIT FSBB20CH60CT COMPONENT REQUIRED FOR MAKING MINI INVERTER
Contextual Info: V4 Mini DIP SPM Application Note 2008-03-03 Application Note AN-9044 Smart Power Module Motion-SPM in Mini DIP SPM Ver.4 User’s Guide Written by: BokKeun Song JongMu Lee SooHyuk Han GuHo Jung Motion Control System HV FPG FAIRCHILD SEMICONDUCTOR 2008-03-03

Contextual Info: M2WWRA-B_N Series 2W, WIDE INPUT, DUAL & SINGLE OUTPUT, DIP DC-DC CONVERTER FEATURES PRODUCT PROGRAM Ultra Miniature Dip Package Wide 2:1 Input Range 1500VDC Isolation Operating Temperature: -40°C~+85°C No Heat Sink Required Short Circuit Protection (Automatic Recovery)

191 ISOLATION TRANSFORMER

Abstract: HI-1567PSI TQ1553 HI-1567 TQ1553-2 HI-1568 HI-1569 Holt Applications Note AN-500
Contextual Info: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers November 2004 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

HI1568PSI

Abstract: TL1553-45 MIL-STD-1553 voltage HI-1567 TQ1553 TQ1553-2 HI-1568 HI-1569 HI-1567CDI HI-1567PSI
Contextual Info: HI-1567, HI-1568 MIL-STD-1553 / 1760 5V Monolithic Dual Transceivers May 2003 DESCRIPTION PIN CONFIGURATIONS To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to

Contextual Info: SMB1N-1550 v 1.0 1.07.2014 Description SMB1N-1550 is a surface mount InGaAsP High Power LED with a typical peak wavelength of 1550 nm and radiation of 16 mW. It comes in SMD package PA9T with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin.

124 008r

Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER July 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus

3188 diode

Abstract: 124 008r
Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 ARINC 429 DIFFERENTIAL LINE DRIVER December 2003 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus

HI-3183

Abstract: 124 008r HI-3182 HI-3184 HI-3185 HI-3186 HI-3187 HI-3188 HI-8382 HI-8383
Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 December 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus