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    NXP Semiconductors T4160NSE7PQB

    IC MPU QORIQ T4 1.8GHZ 1932BGA
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    NXP Semiconductors T4160NSN7TTB

    IC MPU QORIQ T4 1.8GHZ 1932BGA
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    Rochester Electronics LLC T4160NSN7TTB

    QORIQ, 64B POWER ARCH, 16X 1.8GH
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    Rochester Electronics LLC T4160NSE7QTB

    QORIQ, 64B POWER ARCH, 16X 1.67G
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    NXP Semiconductors T4160NSE7QTB

    IC MPU QORIQ T4 1.8GHZ 1932BGA
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    160NS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    200n60

    Abstract: robot control
    Text: Preliminary Data Sheet HiPerFASTTM IGBT IXGE 200N60B VCES IC25 VCE sat tfi = = = = 600 V 175 A 2.1 V 160ns E ISOPLUS 227TM (IXGE) Symbol Test Conditions Maximum Ratings VCES TJ = 25°C to 150°C 600 V VCGR TJ = 25°C to 150°C; RGE = 1 MΩ 600 V VGES Continuous


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    PDF 200N60B 160ns 227TM 728B1 200n60 robot control

    Datasheet CD4008

    Abstract: cd4008 CD4008BMS IOH15
    Text: CD4008BMS S E M I C O N D U C T O R CMOS 4-Bit Full Adder With Parallel Carry Out November 1994 Features Pinout • High-Voltage Type 20V Rating CD4008BMS TOP VIEW • 4 Sum Outputs Plus Parallel Look-ahead Carry-Output • High-Speed Operation - Sum In-To-Sum Out, 160ns


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    PDF CD4008BMS 160ns 100nA Datasheet CD4008 cd4008 CD4008BMS IOH15

    Untitled

    Abstract: No abstract text available
    Text: Memory Module Specifications KHX1600C9D3K4/16GX 16GB 4GB 512M x 64-Bit x 4 pcs. DDR3-1600 CL9 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin)


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    PDF KHX1600C9D3K4/16GX 64-Bit DDR3-1600 240-Pin 160ns KHX1600C9D3K4/16GX 64-bit

    Untitled

    Abstract: No abstract text available
    Text: Advance Technical Information IXFH160N15T2 TrenchT2TM HiperFETTM Power MOSFET VDSS ID25 RDS on trr N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode = = ≤ ≤ 150V 160A Ω 9.0mΩ 160ns TO-247 Symbol Test Conditions Maximum Ratings VDSS VDGR


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    PDF IXFH160N15T2 160ns O-247 160N15T2 4-10-A

    Untitled

    Abstract: No abstract text available
    Text: Memory Module Specifications KHX1866C9D3/4G 4GB 512M x 64-Bit DDR3-1866 CL9 240-Pin DIMM SPECIFICATIONS CL IDD 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin) 36ns (min.)


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    PDF KHX1866C9D3/4G 64-Bit DDR3-1866 240-Pin 160ns 64-bit

    Untitled

    Abstract: No abstract text available
    Text: Memory Module Specifications KHX16C9B1B/4 4GB 512M x 64-Bit DDR3-1600 CL9 240-Pin DIMM SPECIFICATIONS CL IDD 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin) 36ns (min.)


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    PDF KHX16C9B1B/4 64-Bit DDR3-1600 240-Pin 160ns 64-bit DDR3-1600

    Untitled

    Abstract: No abstract text available
    Text: High-Speed Load Response, Non-Isolated Type POL DC-DC Converter Ultra Small Size, Able to drive the Latest Digital LSI with High-Speed Load Response! NEW RoHS BELLNIX Compliance High Response T=160ns 12A BSV-H Series High accuracy Output Accuracy ±1 High-Speed Load Response, Step Down DC-DC Converter


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    PDF 160ns 5S12R0H BDD2008

    Untitled

    Abstract: No abstract text available
    Text: HiPerFASTTM IGBT IXGE 200N60B VCES IC25 VCE sat tfi = = = = 600 V 160 A 2.3 V 160ns E ISOPLUS 227TM (IXGE) Symbol Test Conditions Maximum Ratings VCES TJ = 25°C to 150°C 600 V VCGR TJ = 25°C to 150°C; RGE = 1 MΩ 600 V VGES Continuous ±20 V VGEM Transient


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    PDF 200N60B 160ns 227TM IXGN200N60B 405B2

    Untitled

    Abstract: No abstract text available
    Text: Advance Technical Information TrenchT2TM HiperFETTM Power MOSFET VDSS ID25 IXFH150N17T2 IXFT150N17T2 = = ≤ ≤ RDS on trr N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode 175V 150A Ω 12.0mΩ 160ns TO-247 (IXFH) Symbol Test Conditions Maximum Ratings


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    PDF IXFH150N17T2 IXFT150N17T2 160ns O-247 150N17T2

    Untitled

    Abstract: No abstract text available
    Text: BELLNIX High Speed Load Response, Non-isolated Type POL DC-DC Converter NEW RoHS BELLNIX Compliance Fast response High accuracy T=160ns ±1% Low Cost Ultra small type and responds to latest Digital LSI 9.5A BSV-HE Series High speed response, Output accuracy ±1% step down DC-DC converter


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    PDF 160ns C147F C222F

    XBM-DN32S

    Abstract: Keyence PLC KV 40 R XBE-DC32A XBM-DN16S Keyence PLC KV 40 T XBE-DC16A basic plc ladder diagram PLC S7 200 use encoder siemens S7-200 cpu 224xp XBM-DR16S
    Text: LS new compact-type Programmable Logic Controller XGB series LS PLC XGB series 1. Main Feature High Performance CPU processing speed : 160ns / Step Max. 480 I/O control with 64-point I/O: soon to be released Max. 10K Step program capacity Expanded application with floating-point arithmetic


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    PDF 160ns 64-point S7-200 224XP) K120S XBF-DV04A XBF-AM03A XBF-RD04A XBF-TC04A DC24V XBM-DN32S Keyence PLC KV 40 R XBE-DC32A XBM-DN16S Keyence PLC KV 40 T XBE-DC16A basic plc ladder diagram PLC S7 200 use encoder siemens S7-200 cpu 224xp XBM-DR16S

    ddr3

    Abstract: No abstract text available
    Text: Memory Module Specifications KHX1600C9D3K3/12GX 12GB 4GB 512M x 64-Bit x 3 pcs. DDR3-1600 CL9 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin)


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    PDF KHX1600C9D3K3/12GX 64-Bit DDR3-1600 240-Pin 160ns KHX1600C9D3K3/12GX 64bit ddr3

    DDR3-2400

    Abstract: Kingston 16gb
    Text: Memory Module Specifications KHX24C11K4/16X 16GB 4GB 512M x 64-Bit x 4 pcs. DDR3-2400 CL11 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin)


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    PDF KHX24C11K4/16X 64-Bit DDR3-2400 240-Pin 160ns KHX24C11K4/16X 64-bit CL11-12-12 Kingston 16gb

    SODIMM DDR3 Mechanical Dimensions

    Abstract: SODIMM ddr3 8gb DDR3 Mechanical Dimensions DDR3 SDRAM Document ddr3 so-dimm 204
    Text: Memory Module Specifications KHX1600C9S3K2/8GX 8GB 4GB 512M x 64-Bit x 2 pcs. DDR3-1600 CL9 204-Pin SODIMM Kit SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin)


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    PDF KHX1600C9S3K2/8GX 64-Bit DDR3-1600 204-Pin 160ns KHX1600C9S3K2/8GX 64-bit DDR3-1600MHz DDR3-1333 CL7-7-7-20 SODIMM DDR3 Mechanical Dimensions SODIMM ddr3 8gb DDR3 Mechanical Dimensions DDR3 SDRAM Document ddr3 so-dimm 204

    Untitled

    Abstract: No abstract text available
    Text: Memory Module Specifications KHX1333C9D3B1K2/8G 8GB 4GB 512M x 64-Bit x 2 pcs. DDR3-1333 CL9 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin)


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    PDF KHX1333C9D3B1K2/8G 64-Bit DDR3-1333 240-Pin 160ns KHX1333C9D3B1K2/8G 64-bit

    IXFH150N17T2

    Abstract: IXFT150N17T2 ixfh150n17t
    Text: Advance Technical Information IXFH150N17T2 IXFT150N17T2 TrenchT2TM HiperFETTM Power MOSFET VDSS ID25 = = ≤ ≤ RDS on trr N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode 175V 150A Ω 12.0mΩ 160ns TO-247 (IXFH) Symbol Test Conditions Maximum Ratings


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    PDF IXFH150N17T2 IXFT150N17T2 160ns O-247 150N17T2 IXFH150N17T2 IXFT150N17T2 ixfh150n17t

    SODIMM DDR3 Mechanical Dimensions

    Abstract: No abstract text available
    Text: Memory Module Specifications KHX1333C7S3K2/4G 4GB 2GB 256M x 64-Bit x 2 pcs. DDR3-1333 CL7 204-Pin SODIMM Kit SPECIFICATIONS CL(IDD) 7 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) Row Active Time (tRASmin)


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    PDF KHX1333C7S3K2/4G 64-Bit DDR3-1333 204-Pin 160ns KHX1300C7S3K2/4G 64-bit DDR3-1333MHz DDR3-1333< SODIMM DDR3 Mechanical Dimensions

    Untitled

    Abstract: No abstract text available
    Text: High-Speed Load Response, Non-Isolated Type POL DC-DC Converter RoHS Compliance Ultra Small Size, Able to drive the Latest Digital LSI with High-Speed Load Response! High Response T=160ns 12A BSV-H Series Output Accuracy ±3 High-Speed Load Response, Step Down DC-DC Converter


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    PDF 160ns 3S12R0H BDD2008

    DSP320C10I

    Abstract: DSP320C10 DSP320C10-25 dsp32010 Pin Diagram of ic MC 4086 DSP320 dps320
    Text: MICROCHIP TECHNOLOGY INC OS D • Microchip blD3201 DDD4DflS t ■_ DSP320C10 CMOS Digital Signal Processor FEATURES: ■ ■ ■ ■ ■ 160ns instruction cycle max 144 word on-chip data RAM ROMIess version-DSP320C10 1.5K word on-chip program ROM - DSP320CM10


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    PDF blD3201 DSP320C10 160ns version-DSP320C10 DSP320CM10 16-bit 32-bit 160ns 15-bit DSP320C10I DSP320C10 DSP320C10-25 dsp32010 Pin Diagram of ic MC 4086 DSP320 dps320

    La 7676

    Abstract: No abstract text available
    Text: CD4008BMS S3 H Ä ls a s CMOS 4-Bit Full Adder With Parallel Carry Out Decem ber 1992 Pinout Features CD4008BMS TOP VIEW • High-Voltage Type 20V Rating • 4 Sum Outputs Plus Parallel Look-ahead Carry-Output • High-Speed Operation - Sum In-To-Sum Out, 160ns


    OCR Scan
    PDF CD4008BMS 160ns 100nA La 7676

    Untitled

    Abstract: No abstract text available
    Text: Semiconductor CD4008BMS C M O S 4-B it Full A d d er W ith Parallel C arry O ut November 1994 Pinout Features • High-Voltage Type 20V Rating CD4008BM S TOP VIEW • 4 Sum Outputs Plus Parallel Look-ahead Carry-Output • High-Speed Operation - Sum In-To-Sum Out, 160ns


    OCR Scan
    PDF CD4008BMS CD4008BM 160ns 100nA

    Ci 4008 HCF

    Abstract: HCF4008BC1 Ci 4008 HCC4008BF
    Text: r= Z S G S -T H O M S O N » M i L i O T i s * ! H C C / H C F 4 0 0 8 B 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT • 4 SUM OUTPUTS PLUS PARALLEL LOOKAHERD CARRY-OUTPUT ■ HIGH-SPEED OPERATION-SUM IN-TO-SUM O UT 160ns (typ. : CARRY IN-TO-CARRY OUT 50ns (typ.) AT V d d = 10V, C l = 50pF


    OCR Scan
    PDF 160ns 10OnA HCC4008BF HCF400 245os l60ns HCC/HCF4008B Ci 4008 HCF HCF4008BC1 Ci 4008

    Sj31

    Abstract: No abstract text available
    Text: Æ J S G S T H O M S O N K E M I I L i e r a W l g i H C C / H C F 4 8 B 4-BIT FULL ADDER WITH PARALLEL CARRY OUTPUT . 4 SUM OUTPUTS PLUS PARALLEL LOOKAHERD CARRY-OUTPUT • HIGH-SPEED OPERATION-SUM IN-TO-SUM OUT 160ns typ. : CARRY IN-TO-CARRY OUT 50ns (typ.) AT V dd = 10 V , C l = 50pF


    OCR Scan
    PDF 160ns 100nA HCC4008BF HCF4008BIN. ------------------------------------P013H 7R2T237 HCC/HCF4008B PLCC20 Sj31

    jeida dram 88 pin

    Abstract: STI321000C2
    Text: STI321000C2-xxV,-xxSV 88-PIN CARDS 1M X 32 DRAM Card FEATURES • GENERAL DESCRIPTION Performance range: I ^RAC ^CAC *RC STI3210O0C2-60 60ns 15ns 120ns STI321000CZ-70 70ns 20ns 140ns STI3210OOC2-8O 80ns 20ns 160ns The Simple Technology STI321000C2 is a 1M bil x3 2 Dynamic


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    PDF STI321000C2-xxV STI3210O0C2-60 STI321000CZ-70 STI3210OOC2-8O 120ns 140ns 160ns 88-PIN STI321000C2 jeida dram 88 pin