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BCM 4335

Abstract: relay btk 1012 ADP 3208 bcm 3380 btk 1012 1664810000 97ATEX6007X DIN EN 60999-1 HD 11070 moduflex
Contextual Info: Company profile Weidmüller is the leading manufacturer of components for electrical and electronic interconnection technologies. The company develops, produces and sells customer-oriented solutions comprising the entire Weidmüller product portfolio. As an OEM supplier, the company sets global standards in the

HDC-HB-24-TSVU1

Abstract: HDC-HB-16-TSVU HDC-HDD-72BCM HDC-HDD-72SCM HDC-HBD-16-TSVL1 HDC-HDD-24BCM VDE0627 HDC-HB-24-DB sv-u HDC-HDD-108SCM
Contextual Info: Series HDD 104 Series HDD HDD inserts 24 - 216-poles Crimp connection Turned crimp termination Pole numbers: 24, 42, 72, 108, 144, 216 Note: 144-pole connectors are composed of two 72-pole inserts with the numbers 1-72 and 73-144. 216-pole connectors are composed of

750780

Contextual Info: HIGH-IP3 HIGH-IP3 TRIPLE-BALANCED TRIPLE-BALANCED LO = +17 dBm Click package to view outline drawing SURFACE MOUNT FREQUENCY RANGE MHz 133 1dB Comp. Pt. (dBm) ISOLATION (dB) CONVERSION LOSS (dB) Input IP3 (dBm) PIN OUT Package RF 820-850 865-898 1845-1920

microwave transceiver

Abstract: abstract for wireless communication system loop gain of Colpitts VCO design 5ghz microwave transceiver 3.5 GHz microwave transceiver sensitivity loop gain of Colpitts VCO design 4 ghz 0.18 um CMOS Spiral Inductor technology bjt microwave GHz Drive Base BJT 5.8 ghz Transceiver IC
Contextual Info: The Impact of SiGe BiCMOS Technology on Microwave Circuits and Systems Mehmet Soyuer IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598 E-mail: soyuer@us.ibm.com Abstract This paper focuses on low power and high integration capabilities of SiGe BiCMOS

Contextual Info: HIGH-IP3 TRIPLE-BALANCED MIXERS LO = +17 dBm SURFACE MOUNT FREQUENCY RANGE MHz RF LO 133 IF 820-850 750-780 60-75 865-898 700-730 165-168 1845-1920 1705-1780 135-145 Max. 9.0 9.0 9.0 1dB Comp. Pt. (dBm) ISOLATION (dB) CONVERSION LOSS (dB) Input IP3 (dBm)

HDC-HA-16-AVL

Abstract: HDC-HB-24-TSVU1 HDC-HB-32-AVU HDC-HD-40BCM HDC-HD-64 HDC-HD-16SCM HDC-HE-24BS weidmuller HDC-HB-24-TSVL1 HDC-HD-40BCG
Contextual Info: Schwere Steckverbinder Ein breites Spektrum von Systemkomponenten, das sich durch die Vielfalt der Kombinationsmöglichkeiten auszeichnet und durch eine applikationsgerechte Zubehörpalette abgerundet wird: 3 – 216polige Steckverbinder in Standard- oder korrosionsgeschützter Ausführung

BCM 4335

Contextual Info: RockStar inserts Contents RockStar® inserts RockStar® inserts HA series – the slim connectors B.2 250 V 22 A B 3 – 48 poles HE series – the universal connectors B.16 500 V 24 A 6 – 48 poles HEE series – high contact density B.30 500 V 16 A 10 – 46 poles

ALI-25

Abstract: ALI-25C SALI-25C ETHERMAP-3 PT, ED. B, 1A 05802
Contextual Info: CUBIT-Pro Device CellBusTM Bus Switch TXC-05802 DATA SHEET DESCRIPTION FEATURES • UTOPIA and 16-Bit ATM or PHY Layer cell interfaces • Inlet-side address translation and routing header insertion, using external SRAM of up to 256 kB • Programmable OAM-cell and RM-cell routing

TRA12

Contextual Info: BACK CUBIT-Pro Device CellBusTM Bus Switch TXC-05802 DATA SHEET DESCRIPTION FEATURES • UTOPIA and 16-Bit ATM or PHY or ALI-25 PHY Layer cell interfaces • Inlet-side address translation and routing header insertion, using external SRAM of up to 256 kB

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

3BCM

Abstract: HDC-CM-10 CR2428 HDC-CM-20 HDC-CR16-5B H07V-K4 HDC-CM-10BCM 1730120000 HDC-CM-10SCM
Contextual Info: Datasheet Heavy Duty Connectors Series ConCept Modula r Conn ec to r System Number of p oles : 2, 3, 4, 5, 10, 20 U n iv e rsal and f l exib l e – t he so lut i on f or an a lmo st in fi ni te v ari ety of combinations • S igna l an d pow er tr an sm i ss i on

SKiip 83 EC 125 T1

Abstract: SKiiP 82 AC 12 T1 SKiiP 81 AN 15 T1 semikron SKHI 22 SPICE MODEL semikron skiip 32 nab 12 T7 SKiip 83 EC 12 1 T1 SKiiP 24 NAB 063 T12 skiip 83 ac 128 BUZ78 equivalent SKIIP 81 AC 12 I T1
Contextual Info: 0 Betriebsweise von Leistungshalbleitern Betriebsweise von Leistungshalbleitern 0.1 Elementare Schaltvorgänge Leistungshalbleiter arbeiten bis auf wenige Sonderanwendungen im Schalterbetrieb. Daraus resultieren grundlegende Prinzipien und Funktionsweisen, die in allen leistungselektronischen

Contextual Info: Product data sheet Industrial CompactFlashTM Card C-440 Series up to UDMA6 / MDMA4 / PIO6 B U: Fl a sh Pr od u ct s Date : Se pte mbe r 25 , 2 01 3 Re vi si o n: 1 . 22 Fi le : C - 44 0_ da ta_ s he e t_ C F - H x B U_Re v 1 2 2 .d oc Swissbit AG Industriestrasse 4

IL-404

Contextual Info: Table of Contents Product Series Pages W R .31 - 42 IL-3 3 - 45 P D 1 .4 6 -

AMP 59974-1 crimper

Abstract: AMP 90277-1 amp 825590-3 90277-1 ferrule crimper pull test 734536-1 AMP 47387 crimper AMP junior power timer contact 734535-1 654149-1
Contextual Info: TYCO ELECTRONICS TECHNOLOGY PORTFOLIO Connector Systems / Electromechanical Components Circuit Protection Devices Magnetics Wireless Components Racks and Panels Antennas, GPS Antennas, Integrated Antenna Systems Touch Screens Resistors and Inductors Printed Circuit Board

HDC-HD-40BCG

Abstract: HDC-HD-40SCM 1788800000 HDC-HD-25SCG HB-16 HDC-HD-64SCM HDC-HD-40SCG 1650590000 1650650000 25-BCM
Contextual Info: Series HD 60 Series HD HD-Inserts 7 - 128 Pole Crimp contacts Stamped or turned crimp contacts Pole number: 7, 8, 15, 16, 24, 25, 40, 50, 64, 80, 128 61 Series HD Technical data Series HD Standards DIN VDE 0627 DIN VDE 0110 Technical data Series HD Approvals

Contextual Info: tm ä nx-S w it c h S FEATURES DESCRIPTION • UTOPIA and 16-Bit ATM or PHY Layer cell in­ terfaces • Inlet-side address translation and routing header insertion, using external SRAM of up to 256 kB • Programmable OAM-cell and RM-cell routing

Contextual Info: CUBIT-Pro Device CellBus Bus Switch TXC-05802 DATA SHEET PRODUCT PREVIEW FEATURES DESCRIPTION • UTOPIA and 16-Bit ATM or PHY or ALI-25 PHY Layer cell interfaces • Inlet-side address translation and routing header insertion, using external SRAM of up to 256 kB

Contextual Info: tm ä nx-S w it c h CUBIT-Pro Device CellBus Bus Switch S TXC-05802B DATA SHEET DESCRIPTION FEATURES • UTOPIA and 16-Bit ATM or PHY Layer cell in­ terfaces • Inlet-side address translation and routing header insertion, using external SRAM of up to 256 kB

Contextual Info: • TRAN ^ k 1004152 0007020 104 ■ CUBIT Device «g*, »* jiüüM R. > ,.M V. CellBus Bus Switch TXC-05801 DATA SHEET DESCRIPTION FEATURES CUBIT is a single-chip solution for implementing low-cost ATM multiplexing and switching systems, based on the CellBus bus architecture. Such systems

Contextual Info: tm ä nx-S w it c h CUBIT-Pro Device S C ellB us Bus Switch TXC-05802B DATA SHEET DESCRIPTION • UTOPIA and 16-Bit ATM or PHY Layer cell in­ terfaces • Inlet-side address translation and routing header insertion, using external SRAM of up to 256 kB

Contextual Info: C U B IT Device C eîîB us Switch TXC-05801 DATA SH EE T FEATURES DESCRIPTION • U TO PIA or A LI-25 physical-layer cell interface C U B IT is a single-chip solution fo r im plem enting low -cost ATM m ultiplexing and sw itching system s, based on the CellBus architecture. Such system s are

Contextual Info: AMP Terminals and Splice s Application Tooting, Service Kits AMP Kabelschuhe und Verbinder Verarbeitungswerkzeuge, Service-Sortimente AMP PIDG Type A Stiftkabelschuhe, AMP PIDG Wire Pins, 0.1-6.6 m m 2 0 ,1 -6 ,6 mm2 o Kabelschuhmaterial: Cu, verzinnt Isolierungshulse: