10114829-11113LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions |
|
|
54121-111362000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. |
|
|
10129206-0011113LF
|
|
Amphenol Communications Solutions
|
DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch |
|
|
10082378-11113TLF
|
|
Amphenol Communications Solutions
|
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch |
|
|
10114828-11113LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions |
|
|