1NF 0201 Search Results

Contextual Info: Multi Layer Ceramic Capacitor MLCC 1. Model : CL03B102KO3NNNH 2. Description Part no. Size (inch(mm) Thickness (mm) Temperature charateristics Capacitance value(uF) Capacitance tolerance(%) Voltage (V) CL03B102KO3NNNH 0201/0603 0.3mm X7R 1nF ± 10 % 16

Contextual Info: Multi Layer Ceramic Capacitor MLCC 1. Model : CL03B102KA3NFNC 2. Description Part no. Size (inch(mm) Thickness (mm) Temperature charateristics Capacitance value(uF) Capacitance tolerance(%) Voltage (V) CL03B102KA3NFNC 0201/0603 0.3mm X7R 1nF ± 10 % 25

Contextual Info: Multi Layer Ceramic Capacitor MLCC 1. Model : CL03B102KA3NNNC 2. Description Part no. Size (inch(mm) Thickness (mm) Temperature charateristics Capacitance value(uF) Capacitance tolerance(%) Voltage (V) CL03B102KA3NNNC 0201/0603 0.3mm X7R 1nF ± 10 % 25

250v 333 K capacitor

Contextual Info: File No.: Version: Page: Date: SYNTON-TECH CORPORATION POLYESTER FILM CAPACITOR M/C-02 B 1/14 2012.11.23 z Explanations Of Ordering Code DESCRIPTION : M/C SYNTON CODE : M/C Capacitance Tolerance J : ±5% K : ±10% M : ±20% value 3 Digits : 1NF ~ 470NF 0.001UF~0.47UF

4.7uF 25V X7R 0603

Abstract: 1206 22uF 35V 0402 X7R 100NF 25v 50V 10uF X7R 47uf 4.7uF 0603 10v X7R 22uf 4.7uf MLCC 0805 X7R 16V 22uF 0805 2.2uf x7r
Contextual Info: Capacitance Availability Guide – Standard MLCC Vdc 6.3v 10V 16V 25V 35V 50V 100V 200V 250V 500V 630V 1KV 2KV 3KV 4KV 5KV 0201 NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R

Contextual Info: Capacitance Availability Guide – Standard MLCC Holy Stone Capacitance Availability Guide Vdc Dielectric 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 2.2uF 1uF 10uF 2.2uF 22uF 10uF 47uF 22uF 100uF 100uF 100nF 10uF 2.2uF 22uF 3.3nF 10uF 47uF 10nF

0402 X7R 100NF 25v

Abstract: NP0 180pF 50V 5 0603 mlcc 10pF 50V 10 0603 X7R MCCA000074 10uF 25V X7R 100nF MLCC mlcc y5v MCCA000227 50V 10uF X7R MLCC 16V 10uF
Contextual Info: MLCC Dimensions Table Size [Inch mm ] Thickness (mm)/Symbol 0201 (0603) 0.30 ±0.3 L 0401 (1005) 0.50 ±0.05 N 0.80 ±0.07 S 0.80 + 0.15/-0.10 X 0.60 ±0.10 A 0.80 ±0.10 B 1.25 ±0.10 D 0.80 ±0.10 B 0.95 ±0.10 C 1.15 ±0.15 J 1.25 ±0.10 D 1.60 ±0.20

C1093

Abstract: SLD9630TT C1079 2007-000162 BA68-40012N C1061 npn 470nF 50V X7R ics954 C347 C558 npn
Contextual Info: 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다. This Document can not be used without Samsung's authorization. 10.자재 리스트 10-1. Main Board X25 / X20(EXT Item No Design LOC Parts name Spec 0201-001002

Contextual Info: MLCC Dimensions Table Size [Inch mm ] Thickness (mm)/Symbol 0201 (0603) 0.30 ±0.3 L 0401 (1005) 0.50 ±0.05 N 0.80 ±0.07 S 0.80 + 0.15/-0.10 X 0.60 ±0.10 A 0.80 ±0.10 B 1.25 ±0.10 D 0.80 ±0.10 B 0.95 ±0.10 C 1.15 ±0.15 J 1.25 ±0.10 D 1.60 ±0.20

COBRA5272

Abstract: sentec tp 0401 ATMEL 0613 M95P08 ATMEL 0619 K4S641632 M95P080 TP0401 D0504
Contextual Info: 5 4 3 2 1 COBRA5272 Module R1.0 D D CON0301B CON0301A IC 0204 Reset-LED D[31:24] BDM-Interface Reset-Key Driver /RST IC 0701 IC 0704 Reset IC 0203 optional D[23:16] EEPROM Driver Test-LED PortA (16Bit) Data[31:0] PortB (8Bit) Addr[22:0] IC 0202 D[15:8] Driver

TPA 234

Abstract: SW DIP5 SW DIP-5 AN2454 1nF Y1 CAPACITOR pdi1394p23 TSB41AB1 se 562 capacitor LQFP80 PDI1394P21
Contextual Info: INTEGRATED CIRCUITS ABSTRACT Philips Semiconductors’ PDI1394P21/P23/P25 1394 physical layer devices are designed to be pin and function compatible to Texas Instruments’ TSB41LVxx and TSB41ABx physical layer devices. This application note outlines considerations that designers need to take

LTN141W

Abstract: HAINAN2 VK-2120 MX25L8005 C327 W70 HED5 T60H928 R5538 BA75-01862A C557
Contextual Info: Mat.Number Std.Name 0201-000160 ADHESIVE-TS;D520,NTR,0201-001002 ADHESIVE-TS;8380,SIL,9000CPS,10cc 0202-001461 SOLDER-CREAM;NP303-LD155-GQ,-,D38~10UM,9 0202-001499 SOLDER-WIRE FLUX;SR34 SUPER LFM-48,-,D0. 0203-000223 PAPER-CARBON;BARCODE GEN,T0.25,W60,L300,

schematic for vga splitter

Abstract: epson printer board schematic SAM080UPM schematic diagram vga to laptop TP-104-01 WIRING diagram vga to usb CABLE VGA 15 PIN wiring DIAGRAM usb ultrasound probe RN116 tp-105-01-09
Contextual Info: Evaluation Board for Dual VGA and ADC EVAL-AD8332/AD9238 FEATURES INTRODUCTION Full selection of VGA functions Self-contained high speed differential dual ADC On-board clock source Provisions for external clock Jumper selectable VGA features Standard ADI HSC FIFO board for control

capacitor 47uF 25V SMD

Abstract: CAP.200V capacitor 100nf 25v 0805 100nF X7R 25V 0805 Ceramic Capacitor capacitor 47nf MCCA000255 Capacitor 47uf 100V 1210 x7r General Purpose Series (4V to 100V) 4.7uf 16v capacitor capacitor 0402 X7R 100NF 50V 10
Contextual Info: Multilayer SMD Ceramic Capacitors General Purpose Series 10 to 100V NP0, X7R & Y5V Dielectrics Description MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC’s MLCC is made by NP0,

HDR1X9

Contextual Info: RFFM6901 RFFM6901 2.8V to 4.2V, 915MHz ISM Band Transmit/Receive Module with Diversity Switch The RFFM6901 is a single-chip front end module FEM for application in the 868MHz and 915MHz ISM Bands. The RFFM6901 addresses the need for aggressive size reduction for typical portable equipment RF

47n J 1000V

Contextual Info: Standard Grade Validity: Q1-CY2014 X5R – roadmap 0101 to 0603 Case Size 0101 = EIA 01005 0201 Voltage Mass Production 2014 2015 Capacitance Value / Capacitance Code 100 150 220 330 470 680 1n 1n5 2n2 3n3 4n7 6n8 10n 15n 22n 33n 47n 68n 100n 220n 470n 1u

HDR1X9

Contextual Info: RFFM6901 2.8V TO 4.2V, 915MHZ ISM BAND TRANSMIT/ RECEIVE MODULE WITH DIVERSITY SWITCH Package Style: LGA, 32-Pin, 6mm x 6mm 868/900 MHz TX Only From XCVR Features     4 GND PA2_IN PA1_IN GND GND PA1_OUT NC 27 26 GND 25 24 PA_VCC1 23 PA_VCC2 22

HDR1X9

Contextual Info: RFFM6901 2.8V TO 4.2V, 915MHZ ISM BAND TRANSMIT/ RECEIVE MODULE WITH DIVERSITY SWITCH Package Style: LGA, 32-Pin, 6mm x 6mm 868/900 MHz TX Only From XCVR Features     4 GND PA2_IN PA1_IN GND GND PA1_OUT NC 27 26 GND 25 24 PA_VCC1 23 PA_VCC2 22

DG201ACJ

Abstract: DG201A DG201AAK DG201ABK DG201ACY DG202 DG202AK DG202CJ DG441 GDIP1-T16
Contextual Info: DG201A, DG202 T UC T R OD R OD U C P E P , T E E P DI OL UT OBS UBSTIT DG441 P42 S 4 , ) E , DG Sheet R DIP C)Data SIBL POS 0201(CE1HS(SOI HI1- I9P020 H itle G20 , 202 bt uad ST, OS a- May 2001 File Number 3117.3 Quad SPST, CMOS Analog Switches Features

w76l

Abstract: 9m50
Contextual Info: Mai nSyst em Opt i on SECCode Loc at i on Name Descr i pt i on Uni t I C0902002197 T7300 2. 0GHz CPU MI CROPROCESSOR; LF80537GG0414M, 2. 0GHz, uFCPGA, 479P, TR, PLASTI C, 1. 05V, 34W, 0t o+10 PC 0C, 4MB, Mer om T7300, FSB800, 4M I CDRAM MODULE; M470T6554,

y1 smd transistor

Abstract: transistor SMD Y1 c3 smd transistor smd transistor Y1 sot-23 TRANSISTOR SMD x2 smd transistor diode ZENER C2 smd 1/a4w smd transistor Y1 smd
Contextual Info: Lighting Ballast - European Standard Table of Contents PRIMARY SIDE, EMI/RFI PRIMARY SIDE, Overvoltage Protection. 4

R5C485-LQFP144

Abstract: bc725 BC698 BC236 BC709 bc711 BC717 BC683 RC300MB SMD RA3 PNP
Contextual Info: 8 Part List 8-1 Exploded View 8-1-1 System Exploded Housing Bottom P28 8-1 This Document can not be used without Samsung’s authorization. 8 Part List No Part Name Code No Q’ty Specification Vendor 1 UNIT/HOUSING-BOTTOM BA75-01374A 1 SON & ARRK 2 FAN BA31-00018A

MX25L1605DM2I-12G

Abstract: samsung R540 service AR5B95 samsung r730 NP303-CQS-2 mx25l1605dm2i NP303-CQS-2-F1 88E8040-A0-NNB2-C000 bremen-ul 88E8040-A0-NNB2C000
Contextual Info: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 6. Material List 6-1. 15" Material List Level .1 .1 .1 .1 .1 .1 .1 .1 .1 Code 0203-001869

samsung R540 service

Abstract: L0613 samsung R540 service manual atheros ar5B95 JLCD501 AC82GL40 ATHEROS WLL6160-D99 DAC-09N019 4309-00 ltn156at01
Contextual Info: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다. - - This Document can not be used without Samsung's authorization. – 6. Material List Level 1 Parts Code Assembled EA Spec. Description ,-