20 TSSOP Search Results

TSSOP16

Abstract: 0734 tssop 24 datasheet TSSOP16 msl TSSOP-16 mic2310 prec 0749 TSSOP 20 ss 211
Contextual Info: TSSOP Lead Free Package Rel Data High Temperature Storage Life +150 deg C, 1000 hours Device MSL Soak Peak Temp Plating Lot No Pkg 6A28540MEF 6A28540MED 4A25866MEC 4A29416M10 TSSOP-20 TSSOP-20 TSSOP-20 TSSOP-20 HTSL.L2 HTSL.L2 HTSL HTSL +150C +150C +150C +150C

Contextual Info: DEMO MANUAL DC1925A LTC2378-20/LTC2377-20/LTC2376-20 20-Bit,1Msps/500ksps/250ksps, Low Power, SAR ADCs with 104dB SNR DESCRIPTION The LTC 2378-20, LTC2377-20 and LTC2376-20 are 20‑bit, low power, low noise SAR ADCs with serial outputs that operate from a single 2.5V supply. The following text

AD411

Contextual Info: Features * 8-Bit Multiplexed Addresses/Outputs * Fast Read Access Time - 70 ns * Low Power CMOS Operation - 20 mA max. Active at 5 MHz * 20-Lead TSSOP Package * 20-Lead SOIC Package * 28-Lead TSOP Package * 5V + 10% Supply * High Reliability CMOS Technology

TSSOP-20

Contextual Info: TSSOP-20 1. Purpose This specification is applicable to the tape and reel packing for 20-lead thin shrink small outline package. TSSOP-20 2. Dimensions and composition of tape & reel 2.1. Dimensions of embossed carrier tape 7.0 ±0.1 (7.15) (13.5) 1.5 +0.1

Contextual Info: Features * 8-Bit Multiplexed Addresses/Outputs * Fast Read Access Tim e - 70 ns * Low Power CMOS Operation - 20 mA max. Active at 5 MHz * 20-Lead TSSOP Package * 20-Lead SOIC Package * 5 V + 10% Supply * High Reliability CMOS Technology - 2,000V ESD Protection

CA3086 spice

Abstract: Pspice ca3086 EL1510 X93156 11EVAL HIP4082 pspice ISL6253 EL8400 EL5375 DC DC isolated flyback eval board
Contextual Info: Design Tools 20 2005 P RODUCT S ELECTION GUIDE 20-2 Design Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-3 Evaluation Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RU-20

Contextual Info: a 20-Lead TSSOP Package RU-20 Dimensions shown in inches and (mm) 0.260 (6.60) 0.252 (6.40) 20 11 0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25) 1 10 PIN 1 0.006 (0.15) 0.002 (0.05) SEATING PLANE 0.0433 (1.10) MAX 0.0256 (0.65) 0.0118 (0.30) BSC 0.0075 (0.19)

RU-20

Contextual Info: a 20-Lead TSSOP Package RU-20 Dimensions shown in inches and (mm) 0.260 (6.60) 0.252 (6.40) 11 0.256 (6.50) 0.246 (6.25) 0.177 (4.50) 0.169 (4.30) 20 1 0.006 (0.15) 0.002 (0.05) SEATING PLANE 10 PIN 1 0.0433 (1.10) MAX 0.0256 (0.65) 0.0118 (0.30) BSC 0.0075 (0.19)

RU-20

Contextual Info: a 20-Lead TSSOP Package RU-20 Dimensions shown in inches and (mm) 0.260 (6.60) 0.252 (6.40) 20 11 0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25) 1 10 PIN 1 0.006 (0.15) 0.002 (0.05) SEATING PLANE 0.0433 (1.10) MAX 0.0256 (0.65) 0.0118 (0.30) BSC 0.0075 (0.19)

sn74abt245pw

Abstract: smd tabellen SN74ABT245DB SN74ABT245DW SN74ABT32501PZ ss 211 1A17 SN74 SN74ABT16245 SN74ABT16245DGG
Contextual Info: EB 211 Vergleich der Gehäuse DIP, SOP, SSOP, TSSOP, TQFP Verfasser: Peter Forstner Datum: 04.08.94 Rev.: 1.0 Der vorliegende Bericht vergleicht die mechanischen Daten, elektrischen Eigenschaften und thermischen Parameter der sieben Gehäuseformen 20-Pin DIP Dual In-Line Package , 20-Pin SOP (Small Outline Package), 20-Pin und

27C520

Abstract: AT27C520 AT27C520-70 AT27C520-70SC AT27C520-70SI AT27C520-70XC AT27C520-70XI AT27C520-90
Contextual Info: Features • 8-Bit Multiplexed Addresses/Outputs • Fast Read Access Time - 70 ns • Low Power CMOS Operation • • • • • • • • – 20 mA max. Active at 5 MHz 20-Lead TSSOP Package 20-Lead SOIC Package 5V ± 10% Supply High Reliability CMOS Technology

JEDEC MO-153

Abstract: TSSOP-EP RE201 MO-153-ACT
Contextual Info: 20-Lead Thin Shrink Small Outline With Exposed Pad [TSSOP_EP] RE-20-1 a Dimensions shown in millimeters 4.25 4.20 4.15 6.60 6.50 6.40 11 20 4.50 4.40 4.30 TOP VIEW 1 10 BOTTOM VIEW 1.05 1.00 0.80 1.20 MAX SEATING PLANE COPLANARITY 0.10 0.30 0.19 8° 0°

MO-153-AC

Abstract: MO-153AC RU-20
Contextual Info: a 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20 Dimensions shown in millimeters 6.60 6.50 6.40 20 11 4.50 4.40 4.30 1 6.40 BSC 10 PIN 1 0.65 BSC 0.15 0.05 0.30 COPLANARITY 0.19 0.10 1.20 MAX 0.20 0.09 SEATING PLANE 8؇ 0؇ COMPLIANT TO JEDEC STANDARDS MO-153AC

0752B

Abstract: AT27C520 AT27C520-70SC AT27C520-70TC AT27C520-70XC AT27C520-90SC AT27C520-90TC AT27C520-90XC 20PIN 27C520
Contextual Info: Features • 8-Bit Multiplexed Addresses/Outputs • Fast Read Access Time - 70 ns • Low Power CMOS Operation • • • • • • • • • – 20 mA max. Active at 5 MHz 20-Lead TSSOP Package 20-Lead SOIC Package 28-Lead TSOP Package 5V ± 10% Supply

RU-20

Contextual Info: a 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20 Dimensions shown in millimeters 6.60 6.50 6.40 20 11 4.50 4.40 4.30 1 6.40 BSC 10 PIN 1 0.65 BSC 0.15 0.05 0.30 COPLANARITY 0.19 0.10 1.20 MAX 0.20 0.09 SEATING PLANE 8؇ 0؇ COMPLIANT TO JEDEC STANDARDS MS-153AC

a13h

Contextual Info: Features • 8-Bit Multiplexed Addresses/Outputs • Fast Read Access Tim e - 70 ns • Low Power CMOS Operation - 20 mA max. Active at 5 MHz • 20-Lead TSSOP Package • 20-Lead SOIC Package • 28-Lead TSOP Package • 5 V ± 10% Supply • High Reliability CMOS Technology

RC2798G

Abstract: TSSOP-20 tssop20
Contextual Info: Analog and Mixed Signal Integrated QAM IF Downconverter Description Package Packing RC2798G Integrated QAM IF Downconverter TSSOP-20 Tube RC2798GT Integrated QAM IF Downconverter TSSOP-20 TnR Part Number www.fairchildsemi.com

GRM39COG1R5B50V

Abstract: RMC16-102JT LQG11A6N8J00 MAX2320 MAX2320EUP MAX232 MAX2321 MAX2322 MAX2327 293D106X0010B
Contextual Info: 19-1535; Rev 1; 6/00 MAX2320/21/22/24/26/27 Evaluation Kits Ordering Information TEMP. RANGE IC PACKAGE MAX2320EVKIT PART -40°C to +85°C 20 TSSOP-EP* MAX2321EVKIT -40°C to +85°C 20 TSSOP-EP MAX2322EVKIT -40°C to +85°C 20 TSSOP-EP MAX2324EVKIT -40°C to +85°C

AD531

Abstract: AD5327 AD5330 AD5330BRU AD5331 AD5331BRU AD5340 AD5340BRU AD5341 AD5341BRU
Contextual Info: a 2.5 V to 5.5 V, 115 ␮A, Parallel Interface Single Voltage-Output 8-/10-/12-Bit DACs AD5330/AD5331/AD5340/AD5341* FEATURES AD5330: Single 8-Bit DAC in 20-Lead TSSOP AD5331: Single 10-Bit DAC in 20-Lead TSSOP AD5340: Single 12-Bit DAC in 24-Lead TSSOP AD5341: Single 12-Bit DAC in 20-Lead TSSOP

CS8421

Abstract: sample rate converter
Contextual Info: CS8421 20-pin TSSOP 6.5 mm 6.4 mm 20-pin QFN 5.0 mm 5.0 mm IC dimensions pin-to-pin nominal CS8421 Features & Benefits • High performance, asynchronous sample rate converter • 16, 20, 24, 32-bit support • Supports sample rates 8 kHz to 192 kHz • Input/Output ratios from 7.75:1 to 1:8

RS232 Driver

Contextual Info: DALLAS SFMICOHPIICTOR DS229 Tripl RS—232 TrBnsrnitt6r/R©c6iv6r PIN ASSIGNMENT FEATURES • Compatible with DS1229 1 20 J v+ C 2 19 C1- C 3 18 j C2+ C 4 17 C2- c 5 16 C1 + L • 5V operation • 20-pin DIP or SOIC package • 20-pin TSSOP package for height restricted applica­

TVSOP-56

Abstract: TVSOP-48
Contextual Info: là PER ¡COM Package Cross Reference Guide Package Type TSSOP-48 TSSOP-56 BQSOP-40 BQSOP-48 BQSOP- O SSOP-14 SSOP-16 SSOP-20 SSOP-24 8 SSOP-28 TVSOP-48 TVSOP-56 TSSOP-8 TSSOP-14 TSSOP16 TSSOP 20 TSSOP 24 TSSOP 28 PDIP-8 PDIP-14 PDIP-16 PDIP-20 PDIP-24 PDIP-28

TSSOP-20

Contextual Info: 06014 Only One Name Means ProTek’Tion TSSOP-20 PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE TSSOP-20 A 20 11 C B PACKAGE DIMENSIONS 1 DIM 10 D E K F J M N G P A B C D E F G J K M N P MILLIMETERS MIN MAX 0.65 BSC 4.30 6.30 0.05 0.16 0° 0.09 0.45 0.09

Contextual Info: IDT74FCT162827AT/CT FAST CMOS 20-BIT BUFFER INDUSTRIAL TEMPERATURE RANGE FAST CMOS 20-BIT BUFFER IDT74FCT162827AT/CT FEATURES: DESCRIPTION: • • • • • The FCT162827T 20-bit buffers are built using advanced dual metal CMOS technology. These 20-bit bus drivers provide high-performance bus interface