2010L Search Results

Contextual Info: Page 1 of 1 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010L Type 2010L101RT001 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: Page 1 of 1 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010L Type 2010L201RT4S1 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: Page 1 of 2 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010LC Type 2010LC040T002 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: Page 1 of 2 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010LC Type 2010LC220T002 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: Page 1 of 2 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010LC Type 2010LC080T002 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: Page 1 of 1 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010L Type 2010L75R0T001 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

MEA2010L50R0T001

Abstract: MEA2010L50R0T
Contextual Info: Page 1 of 1 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010L Type 2010L50R0T001 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: Page 1 of 2 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010LC Type 2010LC060T002 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

MEA2010LC150T002

Abstract: MEA2010LC150T
Contextual Info: Page 1 of 2 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010LC Type 2010LC150T002 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

MEA2010LC100T002

Contextual Info: Page 1 of 2 Product Name Series Type Part Number 3-terminal Filters Array MEA Series 2010LC Type 2010LC100T002 Product Lifecycle Stage PROD Specification Summary/Applications/Feature Mounting Method Flag Yes Processing MULTI-LAYER Shape Chip-Array Circuit Type

Contextual Info: * Uppgjord-Prepared f FJ M/TI2 G E n g s t r d m ^ ^ Dokansv/Godk -Doe rosponsfKpprovd M/TO Sheet Rev. 2 A 3 A Tekn amv -Ttchmcaljuponiiblt M/TI2C Granskad-Checked M/TI2C OoKumtntnannn - Document name Biad - Sheet Article list Nr-No 120 PBL 3726/16N Datum •Data

equivalent of BS107

Abstract: BS107 VN2010L BS107 application
Contextual Info: 2010L/BS107 Vishay Siliconix N-Channel 200-V D-S MOSFETs PRODUCT SUMMARY Part Number V(BR)DSS Min (V) rDS(on) Max (W) VGS(th) (V) ID (A) 10 @ VGS = 4.5 V 0.8 to 1.8 0.19 28 @ VGS = 2.8 V 0.8 to 3 0.12 2010L 200 BS107 D D D D D Low On-Resistance: 6 W

HC SR04

Abstract: lcm-5331-22ntk toshiba Notebook lcd inverter schematic schematic LG TV lcd backlight inverter NEC plasma tv schematic diagram lcd power board schematic lg yp LCM-5327-24NAK mod 8 using jk flipflop NEC J330 lcd backlight inverter schema
Contextual Info: Introduction 65535 High Performance Flat Panel / CRT VGA Controller • Highly Integrated Design Flat Panel/CRT Controller, RAMDAC, Clock Synthesizer, non­ multiplexed bus, direct panel drive ■ Integrated Interface for Multiple Bus Architec­ tures • Local Bus (32-bit 386/486 or 16-bit 386SX)

300mm2

Abstract: 106G 10MW 1206LF 1R00 210F
Contextual Info: High Temperature Thick Film Chip Resistors HTC Series • • • • • Operation to 200°C Excellent high temperature stability Improved working voltage ratings Pb-free wrap-around terminations Standard chip sizes available from 1206 to 2512 Electrical Data

1K19

Abstract: rifa PBD DALE r3f PBL3726 120M circuit diagram for simple IR transmitter using u 470yF PBL and Application Note PBL+3726/9
Contextual Info: U ppgiord T e kn ansv. - T tc • h nhnieaIJUfion ic a ljM tp o n s ib l» P r e p a riti M/TI2 G Engstrôm Sheet Rev. 2 A 3 A 4 A 5 A 6 7 A A 8 A 1 19 Nr - No Datum • D i t t I Re» 9 A F ile A 1987-10-08 M/TI2C M/TO Biad • S*«*f Artide list 120 PBL 3726/16N

2512 pcb layout

Abstract: 100MW 10MW 1206LF 100K100 1M201
Contextual Info: High Voltage Chip Resistors HVC Series • • • • • Continuous voltages up to 3KV Resistance Values from 100KW to 100MW Tolerances of ±0.5% to ±10% Sn/Pb or Matte Sn wrap-around terminations Standard chip sizes available from 1206 to 2512 • Robust thick film construction

Contextual Info: High Temperature ThickResistors Film Chip Resistors Make Possible High Temperature Temperature High High Temperature Thick Film Chip Resistors HTC Series Thick Film Chip ChipResistors Resistors Thick Film OperationHTC to Series 200°C Excellent high temperature stability

GE10000

Abstract: IRC 0805
Contextual Info: Pulse Withstanding Chip Resistors IRC Advanced Film Division PWC Series • • • • • Higher power ratings Improved working voltage ratings Excellent pulse withstanding performance Sn/Pb or Pb-free wrap-around terminations Standard chip sizes available from 0805 to 2512

Contextual Info: 2010L/BS107 Vishay Siliconix N-Channel 200-V D-S MOSFETs PRODUCT SUMMARY Part Number V(BR)DSS Min (V) rDS(on) Max (W) VGS(th) (V) ID (A) 10 @ VGS = 4.5 V 0.8 to 1.8 0.19 28 @ VGS = 2.8 V 0.8 to 3 0.12 2010L 200 BS107 D D D D D Low On-Resistance: 6 W

LRC1206

Abstract: lrf1206 1206LF LR1206 LR2010 R020
Contextual Info: Low Value Current Sense Flat Chip Resistor IR C Ad vanced Film Di vision IRC Adv Division ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○

BS107

Abstract: 55C24 VN2010L
Contextual Info: 2010L/BS107 Vishay Siliconix N-Channel 200-V D-S MOSFETs PRODUCT SUMMARY Part Number V(BR)DSS Min (V) rDS(on) Max (W) VGS(th) (V) ID (A) 10 @ VGS = 4.5 V 0.8 to 1.8 0.19 28 @ VGS = 2.8 V 0.8 to 3 0.12 2010L 200 BS107 D D D D D Low On-Resistance: 6 W

CY7C510

Abstract: LMA1010 LMA2010 TMC2210 LMA1010GMB55 LMA1010GMB LMA2010JC-55 LMA1010GMB40 CERAMIC CHIP CARRIER LCC 68 socket LMA2010JC-25
Contextual Info: LMA1010/2010 LMA1010/2010 DEVICES INCORPORATED 16 x 16-bit Multiplier-Accumulator 16 x 16-bit Multiplier-Accumulator DEVICES INCORPORATED FEATURES DESCRIPTION ❑ 20 ns Multiply-Accumulate Time ❑ Replaces TRW TMC2210, Cypress CY7C510, IDT 7210L, and AMD

Contextual Info: Zerohm Thick Film Jumper Chip IRC Advanced Film Division LRZ Series • Current rating to 35 amps • 0.002 ohm maximum resistance • Copper on Alumina construction • Very low inductance • Available in 1206, 2010 and 2512 chip sizes Electrical Data Size 1206

0805LF

Abstract: 10MW 1206LF IEC62
Contextual Info: Pulse Withstanding Chip Resistors PWC Series • • • • • Higher power ratings Improved working voltage ratings Excellent pulse withstanding performance Sn/Pb or Pb-free wrap-around terminations Standard chip sizes available from 0805 to 2512 Electrical Data