23346 Search Results

pll 02 a

Abstract: FS6206 FS6206-01
Contextual Info: FS6206 Dual-PLL Clock Generator IC 1.0 Features 2.0 • Uses inexpensive fundamental-mode crystals • Integrated phase-locked loops PLL multiply crystal frequency to the higher system frequencies needed • 3.3V or 5V supply voltage available • Small circuit board footprint (8-pin 0.150″ SOIC)

FS6146

Abstract: FS6146-01
Contextual Info: FS6146 VCXO Clock Generator IC 1.0 Features 2.0 • On-chip tunable voltage-controlled crystal oscillator circuitry VCXO allows precise system frequency tuning (pull range typically 300ppm) • VCXO tuning range: 0-3V • Uses inexpensive fundamental-mode crystals

FS6209

Abstract: FS6209-01 22.5792 CMOS crystal oscillator
Contextual Info: FS6209 Dual PLL VCXO Clock Generator IC 1.0 Features 2.0 • Dual phase-locked loop PLL device two output clock frequencies • On-chip tunable voltage-controlled crystal oscillator (VCXO) allows precise system frequency tuning • 3.3V supply voltage •

FS6182

Abstract: FS6182-01
Contextual Info: FS6182 VCXO Clock Generator IC 1.0 Features 2.0 • Three output clock frequencies • On-chip tunable voltage-controlled crystal oscillator VCXO allows precise system frequency tuning • Wide crystal “pulling” range (typically 300ppm) • VCXO tuning range from 0-3 volt

M24308

Abstract: FC8122D M24308/4-11F DD15M10000-50-799 M24308/2-14 fc6018d FC8022D-14 m24308/25-6F M24308/24-2p M24308/23-76
Contextual Info: Catalog C-001 Rev. B POSITRONIC INDUSTRIES About Us Founded in 1966, Positronic Industries is a vertically integrated manufacturer of high quality interconnect products. Positronic has earned the worldwide reputation as a service oriented, quick-reaction, top quality connector supplier. We

CPGA

Abstract: cpga dimensions
Contextual Info: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed

RUJ 17 33

Abstract: 3145
Contextual Info: AMI A M I S E M IC O N D U C T O R %s PQ2 Packaging Capabilities . . Description Surface Mount The Power Quad II is a molded plastic quad flatpack with improved thermal performance. The Power Quad II isconstruced using a copper lead frame which is directly attached to a copper heat slug. The heat slup increases the thermal

Contextual Info: MOE D • MOSSTlb 0D137Ö3 3 ■ A M I . . T - M 2 - 8 \ G ould AMI S ilic o n F ou n d ry A pproach Gould AMI is proud of the leadership position it occupies in today’s fast-paced world of process and technology. Our Silicon Foundry services and capabilities are truly world class. We pro­

Solistrand 65505

Abstract: tyco 30692 E13288 m7928 7 AMP 59973-1 crimper MS20659 M7928/7 MIL-T-7928g 74909 m 52707
Contextual Info: SOLISTRAND, Budget and DIAMOND GRIP Uninsulated Terminals and Splices Catalog 65505 Revised 9-00 Product Facts • SOLISTRAND Terminals and Splices ■ Utilize a brazed seam ■ Applied with “W” crimp tooling ■ Available in wire sizes 26 AWG – 600 MCM

TSOP 48 bonding

Abstract: AMI Semiconductor ROM
Contextual Info: AMI A M I MEM l C O N D U C T O R % Packaging Capabilities TSOP Description Surface Mount The Thin Small Outline Package TSOP is a thin ends only package. This package is constructed using the latest low stress molding compounds and bonding technology to provide a package with total body thickness of less then 1.90 mm.

Amkor SBGA

Abstract: Amkor Technology 170A1
Contextual Info: AMI AM I mE M l C O N D U C T O R %s Packaging Capabilities SBGA Description Surface Mount $> The Super Ball Grid Array (SBGA W is a high density cavity down surface mount package for low stress operating environments. The package is comprised of a coper heat spreader to which

313 pin PBGA

Abstract: ami 2470
Contextual Info: AMI A M ! S E M IC O N D U C T O R % s PBGA Packaging Capabilities . . Description Surface Mount The Plastic Ball Grid Array PBGA is a high density surface mount package for low stress operating environments. The package includes BT Laminate base, plastic overmolded body and tin-lead solder balls. With the thermal

diode LN 4001

Abstract: Diode XA 1106 UHC400 UHD433-1883 UHD533 UHD400-883 sprague 300 A760 max 9694 e cmos 4061
Contextual Info: In teg rated Circuits UHD-400, .« SERIES —. U HD-400 THROUGH f t SPRAGUE_ THE MARK o f r e l i a b i l i t y SERIES UHD-400, UHD-400-1, AND UHD-500 POWER AND RELAY DRIVERS UHD-400-1, MIL-STD-883 Compliant FEATURES 500 mA O utput C urrent-S ink C ap ab ility

AMIS 690

Abstract: AMI 68 pin cny 42
Contextual Info: AMI A M I S E M IC O N D U C T O R %s PRE-JLDCC Packaging Capabilities Description Surface Mount The Pre-Leaded Chip Carrier is a multilayer ceramic package. The pre-leaded chip carrier provides all of the high reliability and thermal attributes of a ceramic package with the footprint

din 42802

Abstract: AMP,simel insulated crimp lugs raychem catalog termination kit and splicing kit cma 10024 531220-2 simel AMP 2-520128-2 7483 Raychem 55A CATALOG 42770-2
Contextual Info: Catalog 296642 Focused Product Guide Revised 3-99 Input/Output Connectors Index Table of Contents Section One: Input/Output Connector Click Below Subminiature D, HDP-20 Crimp, Snap-In Connector AMPLIMITE Crimp, Snap-In Contacts and Solder Contacts, Size 20 D

RDRAM SOP

Abstract: concurrent rdram 50mhz crystal oscillator FS6115-01 CRYSTAL oscillator 14.318MHZ ami computer motherboard circuit diagram ICS rambus clock generator rdram clock generator concurrent RDRAM 72 rambus clock generator soic
Contextual Info:   6    X  T %DVH&RQFXUUHQW 5'5$0 &ORFN *HQHUDWRU ,&V $GYDQFH ,QIRUPDWLRQ August 1998 1.0 Features 2.0 • Single phase-locked loop PLL) device with two clock outputs for Rambus Base/Concurrent RDRAM applications supporting an expansion RModule

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED COPYRIGHT 3 RELEASED FOR PUBLICATION ALL INTERNATIONAL RIGHTS RE5ERVED, BY TYCO ELECTRONICS CORPORATION. - REVISIONS LOC G 0 6 .7 3 + 0.1 3 [.2 6 5 + 0 0 5 ] FOR 1 /4 STUD S E R R A TIO N S 14 P LTR DESCRIPTION DATE T1 REVISED PER E C R-08-022232

Contextual Info: Part Number Search Products | Catalog | Brands | Industries | Commerce | Supplier | Contact Us | About | Home Part Number Search Home Part Number Search Enter Part Number If you do not know the exact part number, select "Contains" or "Starts With" as the Search Method. No special characters are

2-34119-1

Contextual Info: SOLISTRAND, Budget and DIAMOND GRIP Uninsulated Terminals and Splices Catalog 65505 Revised 9-00 Ring Tongue Terminals Wire Size Range AWG 26 to 16, CMA 202 to 3,260 [0.1 to 1.65 mm2] Material Terminal Body — Copper per ASTM B-152 Plating — Tin per MIL-T-10727

FS6219

Contextual Info: FS6219 Dual-VCXO/Triple-PLL Programmable Clock Generator IC 1.0 Features 2.0 • Two voltage-controlled crystal oscillators VCXO • Three fully programmable phase-locked loops (PLL) • Three system clock frequency outputs • I Cä-bus serial interface

4F512

Abstract: 4F256
Contextual Info: FLASH A S IS D IV IS IO N 1. APPLICATION T h is sp e cifica tio n m anual a p p lie s to th e co n fo rm in g pro du ct s p e cifica tio n s o f th e 68-pin, tw o piece F LA S H E E P R O M ca rd o f th e JE ID A ve rsio n 4.1 and P C M C IA ve rsio n 2 .0 a sso cia tions.

FS6377-01

Abstract: 11486-801 100MHz FREQUENCY DIVIDER
Contextual Info: FS6377-01 Programmable 3-PLL Clock Generator IC 1.0 Part Numbers 2.0 3.0 AMIS Part Ordering Number 11486-801 AMIS Marketing Number old FS6377-01 HP Part Number 1822-0041 The FS6377 is a CMOS clock generator IC designed to minimize cost and component count in a variety of elec2

tqfp 7x7

Abstract: 10X10 14X14 LQFP 7x7 package
Contextual Info: TQFP Packaging Capabilities Surface Mount Description packages with a nominal body thickness of 1.0mm. This package finds many applications where size and weight are a critical factor. The Thin Quad Flatpack TQFP plastic package family is a reduced thickness plastic surface mount package.

FS6205-01

Abstract: REF436
Contextual Info:   6 9&;2 &ORFN *HQHUDWRU ,&    X  T 3UHOLPLQDU\ June 1999 1.0 Features 2.0 • On-chip tunable voltage-controlled crystal oscillator circuitry VCXO) allows precise system frequency tuning (pull range typically 300ppm) • Uses inexpensive fundamental-mode crystals