24 PIN VDIP Search Results

VDIP1

Abstract: vnc1-1a CON12 1700T3302 usb2dm
Contextual Info: 3V3 24 PIN DIP HEADER 3V3 5V0 3V3 R8 0R MCP 1700T3302 REG1 3 I O G R1 USBD1M GND C1 10uF 6.3v C4 1 26 R2 USBD1P 27R R3 100nF 25 27R 29 2 R4 FB USB FLASH DRIVE CN-USB CN1 27R 28 GND 1 2 3 4 47uF 10v 4 USB2DM USB2DP C8 10pF USB1DP USB2DM USB2DP ACBUS0 ACBUS1

VDIP1 Schematic

Abstract: VDIP1 CON12 78C11 vnc1 GND55
Contextual Info: 24 PIN DIP HEADER 3V3 3V3 5V0 3V3 R8 0R C12 3V3 MCP1700T3302 REG1 3 I G O GND C1 10uF 6.3v C4 1 R1 USBD1P R2 27R 26 GND 27R R3 100nF 25 27R 29 2 R4 FB USB FLASH DRIVE CN-USB CN1 27R 28 4 GND 1 2 3 4 47uF 10v USB2DM USB2DP C8 68pF AVCC USB1DP USB2DM USB2DP

chip t4 3570

Abstract: VNC1L-1A t4 3570 datasheet VDIP1 VNC1L T4 3570 FTDIs VNC1L usb flash drive circuit diagram datasheet of Traffic signal simple spi flash
Contextual Info: Preliminary - Subject to Change Future Technology Devices International Ltd. ™ VDIP1 Vinculum VNC1L-1A Prototyping Module http://www.vinculum.com Copyright Future Technology Devices International Ltd. 2006 Preliminary - Subject to Change Page 2 1. I n t r o d u c t i o n a n d F e a t u r es

VDIP1

Abstract: VNC1L-1A T4 3570
Contextual Info: Future Technology Devices International Ltd. ™ VDIP1 Vinculum VNC1L Prototyping Module http://www.vinculum.com Copyright Future Technology Devices International Ltd. 2006-2007 Page  1. I n t r o d u c t i o n a n d F e a t u r es 1.1 Introduction

VDIP2

Abstract: T4 3570 T4 3570 datasheet VNC1L-1A
Contextual Info: Future Technology Devices International Ltd. ™ VDIP2 Vinculum VNC1L Prototyping Module http://www.vinculum.com Copyright Future Technology Devices International Ltd. 2006-2007 Page  1. I n t r o d u c t i o n a n d F e a t u r es 1.1 Introduction

Contextual Info: Future Technology Devices International Ltd. VDIP2 Vinculum VNC1L Module Datasheet Document Reference No.: FT_000017 Version 1.0 Issue Date: 2010-03-08 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

VDIP2

Abstract: VNC1L uart General Instrument usb flash drive circuit diagram VDIP vinculum V205 RS485 FTDI interface Board schematic usb to spi
Contextual Info: Future Technology Devices International Ltd. VDIP2 Vinculum VNC1L Module Datasheet Document Reference No.: FT_000017 Version 1.0 Issue Date: 2010-03-08 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

1m x 16 memory module

Abstract: AEPDD4X1M5 d1758
Contextual Info: AEPDD4X1M5 DYNAMIC RAM MODULE > > Four 1,048,576 x 5 Organization > > Module can be organized into three separate configurations: I. 1M x 20 II. 2M x 10 III. 4M x 5 > > 36 x 2 72 pins VDIP edge clip > > 0.100 inch distance between pins > > Single +5V power supply

VDIP1

Contextual Info: Future Technology Devices International Ltd. VDIP1 Vinculum VNC1L Module Datasheet Document Reference No.: FT_000016 Version 1.02 Issue Date: 2010-05-31 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

Contextual Info: Future Technology Devices International Ltd. VDIP1 Vinculum VNC1L Module Datasheet Document Reference No.: FT_000016 Version 1.02 Issue Date: 2010-05-31 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

VDIP1

Abstract: ftdi spi example uart General Instrument usb flash drive circuit diagram vinculum V205
Contextual Info: Future Technology Devices International Ltd. VDIP1 Vinculum VNC1L Module Datasheet Document Reference No.: FT_000016 Version 1.01 Issue Date: 2010-05-31 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

Contextual Info: AEPDD4X1M5 DYNAMIC RAM MODULE > > Four 1,048,576 x 5 Organization > > Module can be organized into three separate configurations: I. 1M x 20 II. 2M x 10 III. AM x 5 > > 36 x 2 72 pins VDIP edge clip > > 0.100 inch distance between pins > > Single +SV power supply

Contextual Info: 3TE D ADVANCED ELECTRO NIC PKG B D5SM7T3 ÜDOOBbS 1 IAEP AEPDD4X1M5 DYNAMIC RAM MODULE > > Four 1,048,576 x 5 Organization > > Module can be organized into three separate configurations: I. 1 M X 20 II. 2 M x 10 III. » 4M X 5 36 x 2 72 pins VDIP edge clip

sm2166

Contextual Info: JUl it: WS SM21664V 1MBit 64K x 16 CMOS SRAM Module General Description Features The SM21664V is a high performance, 1-megabit static RAM m odule organized as 64K words by 16 bits, in a 40-pin, vertical dip (VDIP) package. The module utilizes four 64K x 4 static RAMs in surface mount package on

tsop 48 PIN type2

Abstract: 50 mil pitch ceramic package BGA and QFP Package mounting 64 pin IC FOUR SIDE 48 pin ic qfj 84-Pin QFN
Contextual Info: Packages for IC Through-hole mount type DIP Surface mount type1 SIP Dual In-line Package (Single In-line Package) Terminals are on one side of the package and are arranged in a row. Terminals are on two opposite sides of the package and are arranged two rows.

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

3N44

Abstract: TA8795BF rainbow
Contextual Info: TA8795BF TENTATIVE TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system IC integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with B, G,

QFN "100 pin" PACKAGE

Abstract: PIN32 BGA 176 ball package IC-288 280-Pin BGA
Contextual Info: IC パッケージ 端子挿入タイプ DIP 表面実装タイプ 1 SIP Dual In-line Package (Single In-line Package) 端子がパッケージの２側面から取り 出された端子列２のパッケージ。 端子ピッチは2.54 mm (100 mil) 端子がパッケージの１側面から取り

TA8795BF

Abstract: V29P v17b 338N
Contextual Info: TA8795BF TENTATIVE TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system IC integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with B, G,

V34B

Abstract: TRF1092D TRF1093D TA8795BF 3N44 SHARP VEO TV SCHEMATIC DIAGRAM TAS795BF-21 PAL color bar GENERATOR multi burst V29P philips semiconductor data handbook
Contextual Info: TOSHIBA TENTATIVE TA8795BF TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system 1C integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with

sync di

Abstract: NT5C TA8795BF 6p43 pe
Contextual Info: TO SHIBA TENTATIVE TA8795BF TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8795BF VIDEO SIGNAL PROCESSOR IC FOR LCD TVs Offered in a flat 60-pin plastic package, the TA8795BF is a multi-system 1C integrating video, chroma, and sync signal processor circuits for PAL, NTSC, and SECAM systems with

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

SIP 400B

Abstract: 24-Pin Plastic DIP MP-45G slim 40 pin Shrink Zig-Zag In-line Package TO-126 p40v P5VP-340B3-2 254B1 nec 40 pin dip
Contextual Info: : Available, : Under development Plastic SIP Nominal Dimensions Lead Pitch mm Pin Counts 2 3 4 5 7 8 9 10 12 1.27 1.5 1.7 — 2.0 2.3 2.54 Plastic V-DIP Nominal Dimensions Lead Pitch (mm) Pin Counts 5 14 15 1.27 — 1.7 2.0 Plastic ZIP Nominal Dimensions

10kw pfc

Abstract: pfc 10kw phase locked loop circuit OC48 STM16 STM-16 VDIP Package GIGA receivers for SDH STM 16
Contextual Info: 2.5 Gbit/s 1:1 Clock and Data Recovery Circuit GD16646 Advance Information General Description Features The GD16646 is a high performance monolithic integrated Clock and Data Recovery CDR device applicable for optical communication systems including: u SDH STM-16