24008 PC Search Results

BT 24008

Abstract: BT24008 SPLC780 17vee
Contextual Info: BATRON Data Modul Inc. - 120 Commerce Drive - Hauppauge New York 11788 Tel. 631-951-0800 - Fax 631-9512121 - www.datamodul.com BT 24008 Character LCD Modules 2 Lines x 40 Characters Dot Size Dimensions [mm] • MECHANICAL DATA ■ PIN TABLE Parameter Width x Height x Depth

Contextual Info: High-Frequency Center Probe Test Socket for Devices up to 13mm Square FEATURES • For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any pitch device on 0.30mm pitch or higher • Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression spring probes which are accurately located by two molded

Contextual Info: Molded 27mm Center Probe Test Socket FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm to 1.27mm. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.

Contextual Info: CSP/µBGA Test & Burn-in Socket for Devices up to 40mm Square FEATURES • For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any pitch device on 0.30mm or larger • 4-point crown insures “scrub” on solder oxides • Single Point Probes available for small land area contact pads

label infineon lot number barcode

Abstract: barcode label infineon label infineon lot number label infineon barcode INFINEON LOT NUMBER code label label infineon INFINEON DATECODE 4625-B6
Contextual Info: Application Notes 7.2.3 KP110: Package Information Packaging • Mode of delivery: Sawed wafers on adhesive foil in a sealed pack with max. 25 wafer in one pack. The foil is not expanded before delivery. • Diameter of the wafer: 6 Inch = 150 mm • Diameter of the foil: 185 mm

P1386

Abstract: MIL-HDBK-217-F2 PMC240 MIL-HDBK-217F2 KIT-PMC240 kontron 82545EM 82546EB TSOP32
Contextual Info: PMC240 Gigabit Ethernet Controller PMC Modules Speedy Reduce your network load considerably due to shortened transfer times. Innovative Optimize your application possibilities by using a multilateral module. Versatile Maximize your date throughput due to two independant

Contextual Info: High-Frequency Center Probe Test Socket for Devices up to 55mm Square FEATURES • For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any device on 0.30mm pitch or larger • 4-point crown insures “scrub” on solder oxides, while pointed probe works with

Contextual Info: CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square FEATURES • For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications • Any pitch device on 0.30mm pitch or higher • Socket is easily mounted and removed to & from the BIB due to solderless pressure

programmer manual EPLD cypress

Contextual Info: l l lt fM d l l l t? . I U t? 5 U d y , M U y U 5 > l I I , ItKfcS Revision: Tuesday, June 28,1994 pASIC380 Family F/ CYPRESS Features • Very high speed — Loadable counter frequencies greater than 100 MHz — Chip-to-chip operating frequencies up to 85 MHz

Est 13003

Abstract: Aries Electronics transistor E 13009 cup 10019 tsop 48 PIN SOCKET pin identification plcc thru hole socket 20 32 pin zif connector aries all transistor 13009 torlon transistor 13009
Contextual Info: 8 E DI N TH O EI G H T I INTERCONNECTION & PACKAGING SOLUTIONS SHORTFORM CATALOG For more than a quarter century, Aries has helped solve interconnection and packaging problems with an unusual range of standard, programmed, and custom products. Welcome to Aries!

S2403BP36RSM

Contextual Info: global solutions : local support | WLAN Antennas www.lairdtech.com Laird Technologies is the world leader in the design and supply of customized performance-critical products for wireless and other advanced electronic applications. Laird Technologies partners with its customers to help find

inductive wheel speed sensor interface

Abstract: label infineon TLE4905L hall switch ignition KP110 crankshaft sensor position AEB01585 AEB02059 airbag AED01626
Contextual Info: Application Notes Electrical Tests and Application Circuit • The sockets or integrated circuits must not be conducting any voltage when individual devices or assembled circuit boards are inserted or withdrawn, unless works’ specifications state otherwise. Ensure that the test devices and power supplies do not

41288

Abstract: app abstract
Contextual Info: MT90528 API Software Design Spec. and Porting Guide Part Number: MT90528 Revision Number: 1.1 Issue Date: September 2003 MT90528 Design Spec. and Porting Guide PURCHASE OF THIS PRODUCT DOES NOT GRANT THE PURCHASER ANY RIGHTS UNDER PATENT NO. 5,260,978. USE OF THIS PRODUCT OR ITS RE-SALE AS A COMPONENT OF ANOTHER PRODUCT MAY

TMS320C24X

Abstract: CAN BUS SENSOR instruction set of TMS320c24x DSP PROCESSOR send_frequence.asm MCR 2305 TMS320C241 FEDCBA9876543210 24256 7229h interfacing AC motor to pic
Contextual Info: Application Report SPRA500 Understanding the CAN Controller on the TMS320C24x DSP Controller Claire Monnet Digital Signal Processor Solutions Abstract The Texas Instruments TIä TMS320F241, TMS320C241 and TMS320F243 digital signal processor (DSP) controllers contain an on-chip Control Area Network (CAN) module. This module