256 BALL BGA Search Results

dpm001

Abstract: N203 zl50018 PMS-100 MFU C0 37 PMS01
Contextual Info: ZL50018 2 K Digital Switch with Enhanced Stratum 3 DPLL Data Sheet Features Ordering Information ZL50018GAC 256 Ball PBGA Trays ZL50018QCC 256 Lead LQFP Trays ZL50018GAG2 256 Ball PBGA* Trays *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output

dpm001

Contextual Info: ZL50022 Enhanced 4 K Digital Switch with Stratum 4E DPLL Data Sheet Features Ordering Information ZL50022GAC 256 Ball PBGA ZL50022QCC 256 Lead LQFP ZL50022GAG2 256 Ball PBGA* *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output streams Trays

Philips FA 145

Abstract: FLR13 VCT 492 x GR-1244-CORE ZL50021 ZL50021GAC ZL50021GAG2 ZL50021QCC SCA-7
Contextual Info: ZL50021 Enhanced 4 K Digital Switch with Stratum 3 DPLL Data Sheet Features Ordering Information ZL50021GAC 256 Ball PBGA Trays ZL50021QCC 256 Lead LQFP Trays ZL50021GAG2 256 Ball PBGA* Trays *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output

256-pin Plastic BGA

Abstract: BGA-256P-M21
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21

ispMACH M4A3

Abstract: ISPGDX160A ispGAL22V10
Contextual Info: 208-Ball fpBGA 256-Ball fpBGA 100-Ball caBGA 144-Ball fpBGA 49-Ball caBGA Fine Pitch BGA 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch 23.00 x 23.00 mm 1.0 mm pitch BGA 27.00 x 27.00 mm

pms01

Contextual Info: ZL50022 Enhanced 4 K Digital Switch with Stratum 4E DPLL Data Sheet Features Ordering Information ZL50022GAC 256 Ball PBGA ZL50022QCC 256 Lead LQFP ZL50022GAG2 258 Ball PBGA* *Pb Free Tin/Silver/Copper 32 serial TDM input, 32 serial TDM output streams Trays

ZL50411

Abstract: "Spanning Tree" BGA-596
Contextual Info: Managed Switches PACKET PROCESSING AND SWITCHING/ETHERNET SWITCHING VOICE/DATA • • • • 256 • • • • • • • SBRAM 512KB/1MB/2MB 64 • 456 ball BGA 6.55 2k 1522 • • 256 • • • • • • • SBRAM (512KB/1MB/2MB 64 • 456 ball BGA

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

256-pin BGA

Abstract: 24 pin MATRIX led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)

led matrix circuits

Abstract: 256-pin Plastic BGA BGA-256P-M02
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)

256-pin BGA

Abstract: led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)

256-pin Plastic BGA

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ

BGA-256P-M02

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)

c051004

Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension. 27.00±0.20(1.063±.008)SQ

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1

C1995

Abstract: 256-PIN 256-pin Plastic BGA
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M01 Lead pitch 50mil Pin matirx 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ Note: The actual shape of corners may differ from the dimension.

256 ball bga

Abstract: IPC-4552
Contextual Info: 256-301750-18 16x16 Array 256 Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: • Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by

ASTM-B-733

Abstract: 16x16 bga 256 ball bga
Contextual Info: 256-301750-18 16x16 Array 256 Ball BGA Adapter Converts from 0.8mm Pitch to 1.00mm Pitch FEATURES: • Correct-A-Ship technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by

BGA-256P-M02

Abstract: C1995 256-PIN
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M02 Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension.

010FH

Contextual Info: ZL50017 1 K Digital Switch Data Sheet Features • November 2006 1024 channel x 1024 channel non-blocking digital Time Division Multiplex TDM switch at 4.096, 8.192 or 16.384 Mbps Ordering Information ZL50017GAC ZL50017QCC ZL50017QCG1 256 Ball PBGA 256 Lead LQFP

LQFP256

Abstract: ZL50017 ZL50017GAC ZL50017GAG2 ZL50017QCC
Contextual Info: ZL50017 1 K Digital Switch Data Sheet Features • November 2006 1024 channel x 1024 channel non-blocking digital Time Division Multiplex TDM switch at 4.096, 8.192 or 16.384 Mbps Ordering Information ZL50017GAC ZL50017QCC ZL50017QCG1 256 Ball PBGA 256 Lead LQFP

492-Ball

Abstract: BGA 328 PACKING TRAYS
Contextual Info: u Chapter 7 Trays Plastic Ball Grid Array: 256-Ball 19 mm x 19 mm BGT Notes: (See next page for detailed views) 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 140°C. Packages and Packing Publication

Contextual Info: Up To 4 K Switching Matrix TDM/TSI SWITCHES VOICE/DATA Packaging M 8 40 pin PDIP, 44 pin PLCC, 44 pin QFP MT89L80 256 x 256 8 8 M 8 44 pin PLCC, 48 pin SSOP MT89L85 256 x 256 8 8 M 8 44 pin PLCC, 48 pin SSOP ZL50012 512 x 512 16 16 Per-Stream M 16 160 pin LQFP, 144 ball LBGA

BGG256

Abstract: PK018 BG256
Contextual Info: R Plastic BGA BG256/BGG256 Package PK018 (v1.3) March 19, 2007 256-BALL PLASTIC BGA (BG256/BGG256) 2001, 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.