256-PIN BGA DRAWING Search Results

bet GP 119 diode

Abstract: ir p 813h bet 82a BA-06 d31ad
Contextual Info: PCI1251AGFN/GJG PC CARD CONTROLLER S C P S 038-A U G U S T 1998 * • • • PCI Power Management 1.0 Compliant ACP11.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

PCI1251B

Contextual Info: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

AREG D10

Abstract: SCHEMATIC graphics card PCI1251A TPS2206 b12 7d diode
Contextual Info: PCI1251A GFN/GJG PC CARD CONTROLLER SCPS038 – AUGUST 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

1010 817 K14

Contextual Info: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

st LD33

Abstract: ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC
Contextual Info: NM6403 Digital Signal Processor 431282.001D3 Features General Description 40 MIPS, 25 ns Instruction Rate. CMOS 0,5µm Technology. 256-pin BGA Package. Low Voltage Supply, 3.0V to 3.6V. Memory Address Space - 16 Gbytes. Scalar and Vector Data Format: 32-bit Scalar Data,

CAD15-CAD8

Contextual Info: PCI1250A PC CARD CONTROLLER XCPS014 -D E C E M B E R 1997 * Peripheral Component Interconnect PCI Power Management Compliant • Supports Zoom Video With Internal Buffering • ACP11.0 Compliant • Programmable Output Select for CLKRUN • Packaged in 256-Pin BGA

AD27

Abstract: AD29 AD30 PCI1250A TPS2206 XCPS014
Contextual Info: PCI1250A PC CARD CONTROLLER XCPS014 – DECEMBER 1997 D D D D D D D D D D D D D D D D Peripheral Component Interconnect PCI Power Management Compliant ACPI 1.0 Compliant Packaged in 256-Pin BGA PCI Local Bus Specification Revision 2.1 Compliant 1995 PC Card Standard Compliant

Contextual Info: TMS320C6711 FLOATING-POINT DIGITAL SIGNAL PROCESSOR S P R S 088A - FEB R U A R Y 1999 - R EVISED MARCH 1999 GFN 256-PIN BALL GRID ARRAY BGA PACKAGE (BOTTOM VIEW) Y W V U T R P N M L K J H G F E D C VelociTI Advanced Very Long Instruction Word (VLIW) ’C6700 CPU Core

of BGA Staggered pins

Abstract: of BGA Staggered Pins package C10943X
Contextual Info: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up

C10943X

Contextual Info: Mounting pad of tape BGA The drawings of tape BGA mounting pads are shown in Figure 1-15, followed by Table 1-9, which provides detailed information of these pads. Figure 1-15. Mounting Pad Dimensions of Tape BGA 352 pins 35 x 35 1.27 x 25 = 31.75 1.27 x 19 = 24.13

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

144 QFP body size

Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
Contextual Info: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the

atmel 216

Abstract: TQFP 132 PACKAGE TQFP216 BGA-121
Contextual Info: Packaging Introduction Atmel pairs its high-performance silicon with packages, custom designed for the company’s gate arrays. Atmel offers our gate arrays in ceramic and plastic packages. Atmel’s plastic through hole and surface mount packages come in a

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

verilog code for 32 bit risc processor

Abstract: vhdl code for usart 35x35 bga Sun Enterprise 250 Sun Ultra 30 DesignWare SPI 0.18 um CMOS free vhdl code download for usart NEC-V850 PZT driver design
Contextual Info: GS30TR 0.15-µm CMOS Standard Cell/Gate Array Version 1.0 September 23, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the

MPC5668G

Abstract: MPC5668x SPC5668 emios MPC5668 eMIOS200
Contextual Info: Document Number: MPC5668X Rev. 3, 9/2009 MPC5668x MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category – 32 KB unified cache with line locking and eight-entry

NVIDIA schematics

Abstract: JUMP_43X79 MBK1608121YZF si7686 G72M-V compal Pm25LV010 4059f G72M bga nvidia
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document LS-354P VGA BD NVidia NB8x Solution 3 3 2006-08-28 REV:1.0 4 4 Compal Secret Data Security Classification 2005/08/29 Issued Date 2006/08/29 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

MPC5668

Abstract: MPC5668x MPC5668G sram ecc nexus 5001 ph-15 diode pj12 diode BGA mpc5668x 5668G mha 36
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 5, 01/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

mpc5668g

Abstract: MPC5668X a3700 automotive power transistor PJ15 SPC5668GF1AMMG SPC5668GF1 PJ59 SPC5668 317 MG 707 SPC5668x
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category

LS-354JP

Abstract: NVIDIA schematics MBK1608121YZF JUMP_43X79 compal nvidia chip nb8mgs hy5ps561621afp-25 43X79 nvidia g72m G72M
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document LS-354JP VGA BD NVidia NB8x Solution 3 3 2006-08-28 REV:1.0 4 4 Compal Secret Data Security Classification 2005/08/29 Issued Date 2006/08/29 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5668X Rev. 6, 03/2011 MPC5668x MAPBGA–208 17 mm x 17 mm MPC5668x Microcontroller Data Sheet MPC5668x features: • 32-bit CPU core complex e200z650 – Compliant with Power Architecture embedded category