256-PIN PLASTIC BGA 17 X 17 Search Results

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

of BGA Staggered pins

Abstract: of BGA Staggered Pins package C10943X
Contextual Info: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

BGA 256 PACKAGE power dissipation

Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
Contextual Info: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced

bga 0,8 mm

Abstract: XC2C32A VQ44 XC2C128 XC2C32A XC2C256 XC2C384 XC2C64A XCR3032XL CP132 XCR3128XL
Contextual Info: CoolRunner-II Family Logic Resources XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512 XCR3032XL XCR3064XL XCR3128XL XCR3256XL XCR3384XL XCR3512XL System Gates 750 1,500 3,000 6,000 9,000 12,000 750 1,500 3,000 6,000 9,000 12,000 Macrocells 32 64 128 256 384

vhdl code for dice game

Abstract: Video Proc 3.3V 0.07A 64-Pin PQFP ez811 GRAPHICAL LCD interfaced with psoc 5 cypress ez-usb AN2131QC CYM9239 vhdl code PN 250 code generator CY3649 cy7c63723 Keyboard and Optical mouse program CY7C9689 ethernet
Contextual Info: Product Selector Guide Communications Products Description Pins Part Number Freq. Range Mbps ICC (mA) Packages* 3.3V SONET/SDH PMD Transceiver 2.5V SiGe Low Power SONET/SDH Transceiver SONET/SDH Transceiver w/ 100K Logic 2.5 G-Link w/ 100K Logic OC-48 Packet Over SONET (POS) Framer

Contextual Info: Spartan-II 2.5V FPGA Automotive IQ Product Family: Introduction and Ordering R DS105-1 v1.0 July 17, 2002 Advance Product Specification Introduction The Spartan -II 2.5V Field-Programmable Gate Array (FPGA) Automotive IQ product family gives users high performance, abundant logic resources, and a rich feature set.

gal16v8d programming algorithm

Abstract: gal programming algorithm vantis jtag schematic 1 of 8 selector 96 L 2 GAL16V8D LATTICE 3000 SERIES cpld PALCE610H-XX ISPGDX160A GAL22V10D
Contextual Info: Lattice and Vantis Product Selector Guide February 2000 Universe of Programmable Solutions Introduction Lattice and Vantis 3.3V and 2.5V ISP CPLD Families Lattice and Vantis. The companies that gave the world ISP and took you Beyond Performance now bring you their combined

pin diagrams of basic gates

Abstract: BGA and QFP Package Nand gate Crystal Oscillator 272000 astro tool HQFP-208 MCM NAND qcm 5 sim 980 CE61
Contextual Info: To Top / Lineup / Index Product Line-up FUJITSU Semicustom Products Semicustom Products Gate arrays Sea-of-Gate CMOS Macro-embedded type cell arrays CMOS Standard cell CMOS Semicustom microcontrollers QCM series* ASTRO NT Bi-CMOS SIM/PLL SERIES Bi-CMOS SAW PLL

BGA PACKAGE thermal resistance

Abstract: 100 PIN tQFP ALTERA DIMENSION capacitor cross reference EPM1270 EPM2210 324 air variable capacitor EPM2210 EPM240 EPM570 MS-026
Contextual Info: Chapter 7. Package Information MII51007-1.0 Introduction This data sheet provides package information for Altera’s MAX II devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . . 7–1

alphanumeric display 2 character

Abstract: SJ 1848 176-QFP SP 1848 LQFP176 256-pin Plastic BGA BGA and QFP Package
Contextual Info: Renesas Package Code Notation The overall structure of the package code is as follows. x × ×× ×××× × × — × Auxiliary appearance code 1 alphanumeric character; sequential (No general common rules; this code is used to identify lead shape and the like)

2M X 32 Bits 72-Pin Flash SO-DIMM

Abstract: AN2131QC Triton P54C SO-DIMM 72pin 32bit 5V 2M AN2131-DK001 AN2131SC vhdl code for pipelined matrix multiplication VIC068A user guide parallel interface ts vhdl 7C037
Contextual Info: GO TO WEB MAIN INDEX 3URGXFW 6HOHFWRU *XLGH Static RAMs Organization/Density Overview Density X1 X4 X8 X9 X16 X18 X32 X36 7C148 7C149 7C150 4 Kb 16 Kb 7C167A 7C168A 7C128A 6116 64 Kb to 72 Kb 7C187 7C164 7C166 7C185 6264 7C182 256 Kb to 288 Kb 7C197 7C194

MSM52V1016LP

Contextual Info: E2I0019-17-Y1 ¡ Semiconductor MSM52V1016LP ¡ Semiconductor This version: Jan. 1998 MSM52V1016LP Previous version: Aug. 1996 65,536-Word ¥ 16-Bit CMOS STATIC RAM DESCRIPTION The MSM52V1016LP is a 65,536-word by 16-bit CMOS static RAM featuring 3.0 V to 3.6 V power

MSM52V1016L

Contextual Info: E2I0018-17-Y1 ¡ Semiconductor MSM52V1016L ¡ Semiconductor This version: Jan. 1998 MSM52V1016L Previous version: Aug. 1996 65,536-Word ¥ 16-Bit CMOS STATIC RAM DESCRIPTION The MSM52V1016L is a 65,536-word by 16-bit CMOS static RAM featuring 2.7 V to 3.6 V power

bt 1696

Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Contextual Info: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are