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    2766 238E Search Results

    2766 238E Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TLP2766A
    		Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), High-speed, 20 Mbps, 5000 Vrms, SO6L Visit Toshiba Electronic Devices & Storage Corporation
    77313-827-66LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions Visit Amphenol Communications Solutions
    77313-427-66LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions Visit Amphenol Communications Solutions
    77313-127-66LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions Visit Amphenol Communications Solutions
    RJCSE238E01
    		Amphenol Communications Solutions Modular Jack - 8P8C, Right Angle, Surface Mount, Single Port, Shield With Top and Side EMI Tabs, With LEDs Visit Amphenol Communications Solutions

    2766 238E Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    K643

    Abstract: 65A3 n373 276C 238e ts-w 307f K573 2732 memory chip motorola 5118 user manual ber 2a37 rX 433 N
    Contextual Info: S19204CBI12 MEKONG Datasheet Rev 1.9 September 16, 2002 AMCC - PROPRIETARY AND CONFIDENTIAL RESTRICTED DISTRIBUTION NDA REQUIRED AMCC - Confidential and Proprietary Dear customer, Thank you for choosing an AMCC device. We appreciate your confidence in our products.


    Original     		S19204CBI12 S19204CBI12: STS-192/STM-64 K643 65A3 n373 276C 238e ts-w 307f K573 2732 memory chip motorola 5118 user manual ber 2a37 rX 433 N PDF