|
TLP2768B
|
|
Toshiba Electronic Devices & Storage Corporation
|
Photocoupler (photo-IC output), 20 Mbps, 5000 Vrms, SO6L |
|
|
|
77313-427-68LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
|
|
|
77313-827-68LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
|
|
|
77313-127-68LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions |
|
|
