27X27MM Search Results

RM7065C

Abstract: IEEE754 RM7065A
Contextual Info: RM7065C PACKAGING • • Fully Static 0.13µ CMOS design with dynamic power down logic 256 pin TBGA package, 27x27mm on Ex pe rt on Th ur sd ay ,0 8A ug us t, • Dual issue symmetric superscalar microprocessor with instruction prefetch optimized for system level

QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Contextual Info: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm

bu series

Abstract: MBA27002 plastic ul94v0 CU1100 27X27MM
Contextual Info: Model : MBA27002 Series For 27x27 Chip set BGA Heat Sink MBA27002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 27x27mm Part no. Height Fin shape Base MBA27002MBA27002MBA27002MBA27002- 12

CMBA022727

Abstract: MBH27002 27X27MM
Contextual Info: MBH27002 Series=CMBA022727 MBH27002-H12 MBH27002-H25 = 1373256 = 1373257 Model : CMBA022727 Series For 27x27 Chip set BGA Heat Sink CMBA022727 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 27x27mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm

EL4543

Abstract: EL4544 EL4544IGZ V356 RNC BH
Contextual Info: EL4544 Data Sheet April 3, 2007 Triple 16x5 Differential Crosspoint Switch Capable of Operation in Single-Ended or Differential Input Modes The EL4544 is a high bandwidth 16-channel differential RGB to 5-channel RGB single-ended RGB-HV video crosspoint

221-166

Abstract: System On Chip XP2-17
Contextual Info: Third Generation Non-Volatile FPGAs Enable System on Chip Functionality A Lattice Semiconductor White Paper June 2007 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Third Generation Non-volatile FPGAs Enable System on Chip Functionality

Implementation of digital clock using flip flops

Abstract: ffts used in software defined radio Lattice Semiconductor Package Diagrams 256-Ball fpBGA
Contextual Info: Expanding Applications For Low Cost FPGAs A Lattice Semiconductor White Paper April 2007 Revised August 2007 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Expanding Applications For Low Cost FPGAs

89HPES24N3

Abstract: 89HPES24N3BXG
Contextual Info: 89HPES24N3 Data Sheet 24-Lane 3-Port PCI Express Switch Device Overview – Supports locked transactions, allowing use with legacy software – Ability to load device configuration from serial EEPROM ◆ Highly Integrated Solution – Requires no external components

Contextual Info: Version 1.6 2007 Features ƒ ƒ PEX 8548 General Features o 48-lane PCI Express switch - Integrated SerDes o Up to nine configurable ports x1, x2, x4, x8, x16 o 27mmx27mm, 686-ball PBGA package o 37.5mm x 37.5mm, 736-ball PBGA package o Typical Power: 4.9 Watts

ibm25ppc750cxe

Abstract: dh28 code RISCwatch
Contextual Info: R Y PowerPC 750CXe RISC Microprocessor Datasheet February, 2001 PR EL IM IN A Version 1.0 for DD2.4 only IBM Microelectronics Division Notices Before using this information and the product it supports, be sure to read the general information on the back cover of this document.

Contextual Info: GPS Active Antenna Module APAMP-110 RoHS/RoHS II compliant Lead in copper alloy exemption 6c ; and Lead in glass exemption (7c-I) 49.20 X 40 X 15.20mm MSL level: Not Applicable FEATURES: • High Reliability/Sensitivity • Compact Size • Easy to install (magnetic base /adhesive tape)

Contextual Info: GPS+GSM Active Antenna Module APAMPS-106 RoHS/RoHS II compliant Lead in copper alloy exemption 6c ; and Lead in glass exemption (7c-I) Ø75 x 14.1mm MSL level: Not Applicable FEATURES: • Dual Band • High Reliability/Sensitivity • Compact Size, Easy to install

P-BGA676

Abstract: HTSSOP28 ADSL2 DSLAM single chipset ADSL2 chipset ADSL2 DSLAM chipset AFE LINE DRIVER STLC60243 STLC60454 PBGA676 ADSL Central Office CO Chipset
Contextual Info: CopperWing12 ADSL Central Office CO Chipset: STLC61256/55 + STLC60454 + STLC60243 DATA BRIEF 1 GENERAL DESCRIPTION The CopperWing12 ADSL Chipset family targets a complete set of solution for Central Office (CO) ADSL technology integrating also processing and

89H48T12G2

Contextual Info: 48-Lane 12-Port PCIe Gen2 System Interconnect Switch 89HPES48T12G2 Data Sheet ® Device Overview The 89HPES48T12G2 is a member of the IDT PRECISE family of PCI Express® switching solutions. The PES48T12G2 is a 48-lane, 12port system interconnect switch optimized for PCI Express Gen2 packet

motorola mc 1563

Abstract: MBX860 MPC8270ZUUPE MPC8270CZUQLD bsdl of 8270 MPC8270ZQ PBGA 256 reflow profile MPC823 user manual SBC8260 MPC8270CZQMIBA
Contextual Info: Freescale Semiconductor, Inc. Technical Data MPC8280EC Rev. 1.0, 2/2004 Freescale Semiconductor, Inc. MPC8280 PowerQUICC II Family Hardware Specifications This document contains detailed information about power considerations, DC/AC electrical characteristics, and AC timing specifications for .13µm HiP7 members of the

PES24N3A

Abstract: 89HPES24N3A JESD-51 89HPES24N3AZCBXG
Contextual Info: 89HPES24N3A Data Sheet 24-Lane 3-Port PCI Express Switch ® Device Overview Flexible Architecture with Numerous Configuration Options – Automatic per port link width negotiation to x8, x4, x2 or x1 – Automatic lane reversal on all ports – Automatic polarity inversion on all lanes

FCBGA676

Abstract: 89HPES24T3G2 324-BGA
Contextual Info: 89HPES24T3G2 Data Sheet 24-Lane 3-Port Gen2 PCI Express Switch ® Device Overview – Dynamic link width reconfiguration for power/performance optimization – Configurable downstream port PCI-to-PCI bridge device numbering – Crosslink support – Supports ARI forwarding defined in the Alternative Routing-ID

PEX8647

Abstract: PEX8647-BB50BC PEX8647-BB PEX8647-SIL-PB-1
Contextual Info: Version 1.0 2009 PEX 8647 Features ƒ PEX 8647 Vitals - 48-lane, 3-port PCIe Gen2 switch Integrated 5.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: 2.8 Watts ƒ PEX 8647 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

Contextual Info: GPS Active Antenna Module APAMP-107 RoHS/RoHS II compliant Lead in copper alloy exemption 6c ; and Lead in glass exemption (7c-I) 48.6 X 39.2 X 15.2mm MSL level: Not Applicable FEATURES: • High Reliability/Sensitivity • Compact Size • Easy to install (magnetic base /adhesive tape)

Contextual Info: GPS+GSM Active Antenna Module APAMS-105 RoHS/RoHS II compliant Lead in copper alloy exemption 6c ; and Lead in glass exemption (7c-I) Ø76.8 x 15.8mm MSL level: Not Applicable FEATURES: • Dual Band • High Reliability/Sensitivity • Compact Size, Easy to install

Contextual Info: 89HPES24T3G2 Data Sheet 24-Lane 3-Port Gen2 PCI Express Switch Device Overview – Dynamic link width reconfiguration for power/performance optimization – Configurable downstream port PCI-to-PCI bridge device numbering – Crosslink support – Supports ARI forwarding defined in the Alternative Routing-ID

AR5212

Abstract: ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516
Contextual Info: 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams X05 7-1 This Document can not be used without Samsung’s authorization. 7 Schematic Diagrams and PCB Silkscreen 7-1-1 a Main Board Schematic Sheet 2 of 40(Operation Block Diagram)

NSK 5b 4.096

Abstract: RC410 RC410ME QUANTA ZL9 ICS951413CGLFT PCI7412 ev C703 Capacitor NSK CL-2M2012-900JT NSK XTAL
Contextual Info: 1 2 3 VCC_CORE CPU CORE 4 5 6 7 ZB3 X'TAL 14.31818MHz +1.5V_RUN MAX8736 8 VGA option Page:31 A +1.2V SC1470 VCCP_+1.05V (MAX1992) +1.2V ICS951413CGLFT MAX1993 INTEL Mobile_479 CPU SOCKET_M Page:5 VCCP_+1.05V +1.0V/+1.2V VGA Power Yonah/Yonah Celeron-M Clock generator

MAX8774

Abstract: PCI8402 RTL8111B-GR PCI8412 MAX8774 pdf 2N7002E-LF AMD Athlon 64 X2 dual 4800 pin out AMD Athlon 64 X2 4800 pin diagram BT129 ALC262
Contextual Info: 1 2 3 4 5 PCB P/N AND DESCRIPTION PCB ED5 MB 8L,309X218, REVA P/N: DA0ED5MB8A8 PCB ED5 USB/B(8L, 47.5X16.8, REVA) P/N: DA0ED5SB8A5 PCB ED5 MB(8L,309X218,REVB) P/N: DA0ED5MB8B6 ED5 PCB ED5 USB/B(8L,47.5X16.8,REVB) P/N: DA0ED5SB8B3 6 7 SATA ED5 SATA ASSY P/N