28-PIN QFP Search Results

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

a06 transistor

Contextual Info: QUAD FLAT L-LEADED PACKAGE 28 PIN CERAMIC FPT-28C-A06 Lead pitch 50mil Package width x package length 11.40 × 11.40mm Lead shape Gullwing Sealing method Metal seal Length of flat portion of pins 0.80mm TYP 28-pin ceramic QFP FPT-28C-A06 28-pin ceramic QFP

Contextual Info: SMALL OUTLINE PACKAGE 28 PIN CERAMIC FPT-28C-A07 28-pin ceramic QFP Lead pitch 50mil Package width x package length 11.40 × 11.40mm Lead shape Gullwing Sealing method Metal seal Length of flat portion of pins 0.48mm FPT-28C-A07 28-pin ceramic QFP (FPT-28C-A07)

Contextual Info: PA32Q1498-28D6-21 Data Sheet 32 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of 32 pin QFP devices in their 28 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

FPQ-128-0

Contextual Info: PA1048C-128 Data Sheet 128 pin QFP socket/28 pin DIP 0.6" plug Supported Device/Footprints Adapter Wiring Using this adapter several 128 pin Lattice devices in QFP packages can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

Contextual Info: PA32Q1498-28D6-20 Data Sheet 32 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of 32 pin QFP devices in their 28 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

Contextual Info: PA711D3-QFP Data Sheet 44 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

Contextual Info: PA-H8/3332- T 80 Data Sheet 80 pin QFP(TQFP) socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction These adapters allow EPROM programming of Hitachi H8/3332 & H8/3334 devices in their QFP or TQFP packages on 28 pin DIP programmers.

PQFP160

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC FPT-160P-M15 160-pin plastic QFP FPT-160P-M15 160-pin plastic QFP (FPT-160P-M15) Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold

FPT-256P-M06

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-256P-M06 256-pin plastic QFP (FPT-256P-M06)

Contextual Info: PA28-32-20-Dx-QF Data Sheet 28 pin DIP 0.3” socket /32 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA28-32-20-Dx-QF adapters accept 28 pin DIP devices and have a removable 32 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during

FPT-256P-M09

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 EIAJ code : P-FQFP256-28 x 28-0.40 256-pin plastic QFP FPT-256P-M09 256-pin plastic QFP (FPT-256P-M09) Lead pitch 0.40 mm Package width × package length 28.0 × 28.0 mm Lead shape

QFP144

Abstract: QFP Package 144 lead QFP144-P-2828-2
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M02 EIAJ code : ∗QFP144-P-2828-2 144-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M02 144-pin plastic QFP (FPT-144P-M02)

sharp mask rom 44-pin

Abstract: mask programmable rom sharp mask rom 532595
Contextual Info: CMOS 256K 32K x 8 Mask Programmable ROM FEATURES • • • • • • PIN CONNECTIONS 32,768 x 8 bit organization Access time: 28-PIN DIP 28-PIN SOP TOP VIEW - \ 28 □ Vcc f 150 ns (MAX.) NCC 1• A12C 2 27 □ a 7C 3 26 □ Ai3 Operating: 110 mW (MAX.)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

FPT-256P-M06

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index FPT-256P-M06 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold

heat resistor

Abstract: 2001FUJITSU
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC FPT-160P-M15 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 4.10 mm MAX Features

QFP PACKAGE thermal resistance

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold

QFP PACKAGE thermal resistance

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M11 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold

FPT-256P-M09

Abstract: QFP PACKAGE thermal resistance
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M09 256-pin plastic QFP Lead pitch 0.40 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

28-pin quad packages

Abstract: a06 transistor
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index FPT-28C-A06 28-pin ceramic QFP Lead pitch 50 mil Package width x package length 11.40 × 11.40 mm Lead shape Gullwing Sealing method Metal seal

QFP160-P-2828-4

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M04 EIAJ code :∗QFP160-P-2828-4 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP208-P-2828-1

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M01 EIAJ code :∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP160-P-2828-5

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 160 PIN PLASTIC To Top / Package Lineup / Package Index FPT-160P-M08 EIAJ code :∗QFP160-P-2828-5 160-pin plastic QFP Lead pitch 0.65 mm Package width x package length 28 × 28 mm Lead shape Gullwing