280LM Search Results

GW5BNC15L02

Abstract: GW5BDC15L02 Application of electronics circuits to lighting GW5BDF15L00 GW5BWF15L00 SHARP Zenigata
Contextual Info: Product Information LED Lighting Modules 280lm/540lm Series Status: November 2008 Applications Whether Spot or ambient, indoor or outdoor, stationary or mobile – you can set innovative 18 mm2 standards in the general lighting sector with Sharp’s high-performance square LED Lighting Modules:

High Brightness 30W RGB Lumen LED

Abstract: halogen bulb light source circuit diagram solar 4V led Led rgb 9w chip SHARP LED safety solar traffic light EDISON SMD LEDS led matrix 8 8 one colour SHARP Zenigata solar led street light
Contextual Info: SF/LED/1108 Contacts Where to find out more about Sharp’s LED technology? Just contact us and our specialist consultants will be glad to help in any way. Liaison Offices Sharp Microelectronics Europe* SME Paris Office 1 Rue Raoul Follereau Bussy Saint Georges

Contextual Info: SPECIFICATIONS FOR LIGHT GREEN SURFACE MOUNT LED Model: LGI-XXMB15BD-GT1 Company Name: Confirmed By Customer: DATE: 深圳市绿色半导体照明有限公司 SHENZHEN Light Green International CO.，LTD 深圳市南山区松白路百旺信工业园二区第 6 栋

LM 739 N

Abstract: led XP-G cree xp-g leds XPCWHT ANSI C78.377 clm3c-wkw xpewht 530080 MCE4CT-A2-0000-00A5AAAA1 clm4b-bkw
Contextual Info: Cree — Lighting Class High Power White LED 科銳 — 照明級高功率 LED Cree — Lighting Class MX6 LED 科銳 — 照明級 MX6 LED This is specially designed for promoting HP-LEDs which are measured in Lumen @350mA/25°C normally. Cree is Arrow Asia’s focus LED line for the brightest white color HP-LEDs when driving

Contextual Info: Product Guide High Power LED Modules LLM2WM series We realize most appropriate LED modules for outdoor lighting to combine high power LED and our own luminous intensity distribution control technology ,which is cultivated by automobile head lamp. You can choose luminous intensity distribution from three characteristic

LOCTITE 3621

Contextual Info: Technical Data Sheet LOCTITE 3621 January-2014 LOCTITE 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical