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2985X335X150 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
R/ULM850-05-TT-C0101DContextual Info: 5 Gbps VCSEL 850 nm 1x1/1x4/12 chip For flip chip stud bump and wire bond Unsealed 85% r.H./85°C certified 1, 4, or 12 channel array configuration INVISIBLE LASER RADIATION AVOID BEAM EXPOSURE CLASS 3B LASER PRODUCT Preliminary ELECTRO-OPTICAL CHARACTERISTICS |
Original |
1x1/1x4/12 ULM850-05-TT-C0101D ULM850-05-TT-C0104D ULM850-05-TT-C0112D 235x335x150 985x335x150 2985x335x150 R/ULM850-05-TT-C0101D |