2C56 Search Results

2N5679 MOTOROLA

Abstract: 2n5680 motorola SILICON SMALL-SIGNAL DICE 2n5680
Contextual Info: 34 M O T O R O L A SC -CDIODES/OPTO} ;— 6 3 6 7 2 5 5 MOTOROLA SC ] > F | 1,3^7555 00 30 0 0 4 <DIODES/OPTO 34C 38004 r - 2 .i- n SILICON SMALL-SIGNAL TRANSISTOR DICE continued) 2C5680 DIE NO. — PNP LINE SOURCE — DSL211 This die provides performance similar to that of the following device types:

2N3773 MOTOROLA

Abstract: 2N6029 MJ15003 MJ15004 motorola transistor PNP 2N6031 MOTOROLA 2NC6 mj15004 pnp 2C603 2nc60
Contextual Info: MOTOROLA SC i D I O D E S / O P T O J 6367255 MOTOROLA "Im SC D F | b 3 b 7 2 S S 0037^3 3 D ( D IO D E S / OPTO 34 C 3793Ó T'33-Ot SIL'CON POWER TRANSISTOR DICE (continued) 2C5631 DIE NO. — NPN LINE SOURCE — PL500.34 NPN PNP D 2C6031 die no. — PNP

2N5666

Abstract: 2C5664 2N5664 9221
Contextual Info: Data Sheet No. 2C5664 Generic Packaged Parts: Chip Type 2C5664 Geometry 9221 Polarity NPN 2N5664, 2N5666 Chip type 2C5664 by Semicoa Semiconductors provides performance similar to these devices. Part Numbers: Product Summary: APPLICATIONS: Designed for high voltage, high speed switching and power

2C5660

Abstract: 2C5661 2C5662 2C5663
Contextual Info: PR O D U C T S CORP 45E D • b ñ S b m Q O G O T IS «PPC 2 Amp, 300 Transistor 2C5661 2C5663 FEATURES • Triple Diffused, Planar Design • C ontact M etallization: Base, Em itter - Alum inum - 30,000 A N om inal C ollector - Gold - 3,000 A Nom inal • Die Thickness - 8 M ils Nom inal

motorola transistor 614

Abstract: 2N5641 2N5641/D
Contextual Info: T m »FJb3t,7ESS 0Q3fl0tl Q MOTOROLA SC {DI ODES /O PTOl ! 6 3 6 7 2 5 5 MOTOROLA SC 34C 38061 DIODES/OPTO D r - / 3 - 07 SILICON R F TRANSISTOR DICE (continued) DIE NO. 2C5641 — NPN LINE SOURCE — RF605.165 & T his die provides perform ance equal to or better than that of

2N5642 motorola

Contextual Info: M O T O R O L A SC { D I O D E S / O P T O } 6367255 MOTOROLA SC 34 D F |b3L7E S S <DIO D ES/O PTO 34C 00 3 fl a t .a 38062 T- 3 Z ~ ^ SILICON RF TRANSISTOR DICE continued) 2C5642 DIE NO. — NPN LINE SOURCE — RF605.166 This die provides performance equal to or better than that of

2C5685

Abstract: HP 7611 2C5686
Contextual Info: P P C PRODUCTS CORP tjDE D bflSblil DDOCnbM 0 L47 IPPC 300W NPN Power Transistor Chips 2C5685 O P C fiO C ¿ IrO O O O T » -\ S FEATURES CHIP TYPE: AY • High SOA Assured by Epitaxial Base • Contact Metallization: Base, Emitter - Aluminum - 70,000 A Nominal

NPN Transistor 30A 400V

Abstract: 2C5667 2C5666 2C5664 2C5665 chip die npn transistor
Contextual Info: OD II 2C5664 2C5666 5 Amp, 300V, NPN Transistor Chips 2C5665 2C5667 FEATURES CHIP TYPE: AK • Triple Diffused, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 50,000 A Nominal Collector - Gold - 3,000 A Nominal • Die Thickness - 8 Mils Nominal

2N5681 MOTOROLA

Abstract: SILICON DICE motorola DSL212
Contextual Info: MOTOROLA SC -CDIODES/OPTO} 6367255 MOTOROLA SC ^ I>E |b 3 b 7 2 5 5 0033005 1 DIODES/OPTO 34C 38005 D f-a i-n SILICON SM ALL-SIGNAL TRANSISTOR DICE (continued) 2C5682 DIE NO. — NPN LINE SOURCE — DSL212 T h is die provides perform ance similar to that of the following device types:

TRANSISTOR SMD kl3

Abstract: P-LSSOP20-4 fra4 transistor bc 549
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

h-12-H

Abstract: SDA28 REJ09B0001 2CM06 DTC 304-2 user manual
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

L33A SMD

Abstract: smd TRANSISTOR code b6 l36a adc 809 wk1 smd EA1 transistor smd PRQP0100JD-B smd code book R8C 702 TRANSISTOR smd l33a
Contextual Info: REJ09B0441-0010 R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, R8C/L3AA Group, 16 R8C/L35B Group, R8C/L36B Group, R8C/L38B Group, R8C/L3AB Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/Lx SERIES Preliminary All information contained in these materials, including products and product specifications,

1200ap

Abstract: PCM1701P Burr-Brown 3400B pcm65p pcm1701 4203SQ mp8316 DAC800-CBI-V MPC8S 4203j
Contextual Info: Burr-Brown Corporation Discontinued Products August 2, 1999 Model 0025MK 0100AP 0100MS-1 0100MS-2 0100MS-3 0100MS-4 0145MC 01AA-A1030-00 01DSA00024A001 01DSA00080A001 01DSA00236A002 01DSA00236A010 01DSA01898A003 0211B 0245MC 0422MC 0501-3A 0503A 0506/16 0506/16A

Contextual Info: Datasheet R8C/34W Group, R8C/34X Group, R8C/34Y Group, R8C/34Z Group RENESAS MCU 1. R01DS0012EJ0100 Rev.1.00 Nov 24, 2010 Overview 1.1 Features The R8C/34W Group, R8C/34X Group, R8C/34Y Group, and R8C/34Z Group of single-chip MCUs incorporate the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address

Contextual Info: R8C/33T Group RENESAS MCU 1. R01DS0046EJ0110 Rev.1.10 Apr 26, 2011 Overview 1.1 Features The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

Contextual Info: Datasheet R8C/34U Group, R8C/34K Group RENESAS MCU 1. R01DS0113EJ0110 Rev.1.10 Jun 15, 2011 Overview 1.1 Features The R8C/34U Group, R8C/34K Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: Datasheet R8C/3MU Group, R8C/3MK Group RENESAS MCU 1. R01DS0112EJ0110 Rev.1.10 Jun 15, 2011 Overview 1.1 Features The R8C/3MU Group, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of

Contextual Info: Datasheet R8C/3JT Group RENESAS MCU 1. R01DS0045EJ0100 Rev.1.00 Apr 26, 2011 Overview 1.1 Features The R8C/3JT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

017BH

Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/33A Group REJ03B0228-0001 Rev.0.01 Oct 26, 2007 RENESAS MCU 1. Overview 1.1 Features The R8C/33A Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated

rtm870t

Abstract: RTM870T-690 9LPR462 rtm870 SRN22J-4-GP ICS9LPR462 foxconn rs690mc Socket AM2 GPIO57
Contextual Info: 5 4 3 2 1 Yukon Block Diagram AMD 8,9 DDR2 SODIMM DIMM2 K8 Rev.G AM2 Socket DDR II 533/667/800 8,9 HyperTransport 16x16 32 4,5, 6,7 L1: Signal 1 L2: VCC L3: Inner Signal 2 L4: Inner Signal 3 L5: GND L6: Signal 4 Project code: 91.4BC01.001 PCB P/N : 48.4BC01.001

WPC8763LDG

Abstract: WPC8763L EC42 line output transformer RTM875T-605 BT 13A sla5v P2231NFC fds8884 g909 Socket AM2
Contextual Info: A B C D Calado Block Diagram Project code: 91.4X401.001 PCB P/N : 07227 REVISION : -1 SYSTEM DC/DC Mobile CPU 4 CLK GEN. 3 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U DDR2 533/667 MHz 533/667MHz G792 533/667 MHz 71.GL960.00U, SLA5V LVDS AZALIA 26 MIC In C-Link0

WPC8763LDG

Abstract: RTM875T-605 N7C1 pll gl960 hall sensor w50 SC10U6D3V5MX SW-TACT-119-GP ICS9LPRS502PGLF 1D05V RTM875T
Contextual Info: A B C D Calado Block Diagram Project code: 91.4X401.001 PCB P/N : 07227 REVISION : -1 SYSTEM DC/DC Mobile CPU 4 CLK GEN. 3 2.0G : 71.MEROM.A0U 2.33G : 71.MEROM.B0U DDR2 533/667 MHz 533/667MHz G792 533/667 MHz LVDS 71.GL960.00U, SLA5V AZALIA 26 MIC In 6,7,8,9,10,11 GM965 : KI.96501.008

g792

Abstract: CP2211F G7922 NIPPON CHEMICON ASF CPUTEST25L ATI-RS690M wistron MARVELL G77 WPC8768LDG c70021
Contextual Info: 5 4 3 2 1 Orta Block Diagram AMD 8,9 DDR2 SODIMM DIMM2 8,9 Power Switch P2231NFC1 28 HyperTransport New card 28 RJ45 C 24 24 INPUT OUTPUT DCBATOUT CRT13 VCC_CORE_S0 SYSTEM DC/DC LCD14 INPUT OUTPUT DCBATOUT PCI-E x 1 1D2V_S0 1D8V_S3 SYSTEM DC/DC INPUT PCI-E x 4