zif socket
Abstract: SOIC16 socket zif soic16 socket SOIC-16
Text: DIL16W/SOIC16 ZIF 300mil ord.no. 70-0881 universal adapter, assigned for SOIC devices up to 16-pins operation (mechanical) life of ZIF socket - 10.000 actuations made in Slovakia Ord. no 70-0881 Socket ZIF SOIC16, open top type Bottom 2 rows, 2x 8 pins, square, 0.6x0.6mm, rows spacing
|
Original
|
PDF
|
DIL16W/SOIC16
300mil
16-pins
SOIC16,
600mil
22nF-100nF
SOIC16
zif socket
SOIC16
socket zif
soic16 socket
SOIC-16
|
DIP20
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 20Pin Plastic DIP20 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
20Pin
DIP20
300mil)
ED-7303A)
51min
DIP20
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Dual In-line Package 10Pin Plastic DIP10S 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
10Pin
DIP10S
300mil)
ED-7303A)
DIP10S
|
DIP14
Abstract: 300mil
Text: SANYO Semiconductor Dual In-line Package 14Pin Plastic DIP14T 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
14Pin
DIP14T
300mil)
ED-7303A)
26max
51min
DIP14T
DIP14
300mil
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Small Outline Package 18Pin Plastic MFP18 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
18Pin
MFP18
300mil)
ED-7303A)
SANYOMFP18
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 14Pin Plastic DIP14TD 300mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
14Pin
DIP14TD
300mil)
ED-7303A)
54kage
26max
51min
DIP14TD
|
Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 26 PIN PLASTIC FPT-26P-M02 Lead pitch 50mil Package width 300mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 26-pin plastic TSOP II (FPT-26P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)
|
Original
|
PDF
|
FPT-26P-M02
50mil
300mil
26-pin
FPT-26P-M02)
F26002S-3C-3
|
FPT-24P-M01
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M01 EIAJ code : ∗SOP024-P-0300-1 Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold 24-pin plastic SOP FPT-24P-M01 24-pin plastic SOP
|
Original
|
PDF
|
FPT-24P-M01
OP024-P-0300-1
50mil
300mil
24-pin
FPT-24P-M01)
FPT-24P-M01
|
Untitled
Abstract: No abstract text available
Text: UG9M43722 4 KBG(T) 16M Bytes (4M x 36) DRAM 72Pin SIMM w/ECC based on 4M X 4 General Description Features The UG9M43722(4)KBG(T) is a 4,149,304 bits by 36 SIMM module.The UG9M43722(4)KBG(T) is assembled using 9 pcs of 4Mx4 2K/4K refresh DRAMs 300mil SOJ Package mounted on 72 Pin
|
Original
|
PDF
|
UG9M43722
72Pin
300mil
1000mil)
|
Untitled
Abstract: No abstract text available
Text: UG54W742 4 4GJ(T)G 32M Bytes (4M x 72) DRAM 168Pin DIMM With ECC based on 4M x 4 General Description Features The UG54W742(4)4GJ(T)G is a 4,194,304 bits by 72 EDO DRAM module. The UG54W742(4)4GJ(T)G is assembled using 18 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in
|
Original
|
PDF
|
UG54W742
168Pin
300mil
168-pin
100Max
54Max
540Min)
100Min
|
Untitled
Abstract: No abstract text available
Text: UG54W662 4 4GJ(T)G 32M Bytes (4M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG54W662(4)4GJ(T)G is a 4,194,304 bits by 64 EDO DRAM module. The UG54W662(4)4GJ(T)G is assembled using 16 pcs of 4Mx4 DRAMs in a 300mil SOJ/TSOP package,and one 2k EEPROM for SPD in
|
Original
|
PDF
|
UG54W662
168Pin
300mil
168-pin
350Max
89Max
540Min)
100Min
|
we 510
Abstract: UG9M
Text: UG9M13621DBG T 4M Bytes (1M x 36 ) DRAM w/Parity 72Pin SIMM based on 1M X 4 General Description Features The UG9M13621DBG(T) is a 1,048,576 bits by 36 SIMM module.The UG9M13621DBG(T) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package, and 1 pc of 1Mx4 Quad-CAS
|
Original
|
PDF
|
UG9M13621DBG
72Pin
300mil
1000mil)
we 510
UG9M
|
Untitled
Abstract: No abstract text available
Text: UG58E642 4 4GJ(T)L 64M Bytes (8M x 64) DRAM 168Pin DIMM based on 4M x 4 General Description Features The UG58E642(4)4GJ(T)L is a 8,388,608 bits by 64 EDO DRAM module. The UG58E642(4)4GJ(T)L is assembled using 32 pcs of 4Mx4 2K/4K refresh DRAMs in 300mil SOJ/TSOP package, and
|
Original
|
PDF
|
UG58E642
168Pin
300mil
ABT16244
240mil
168-pin
1250mil)
190Max
|
1Mx4
Abstract: No abstract text available
Text: UG8M13201DBJ N 4M Bytes (1M x 32 ) DRAM 72Pin SIMM based on 1M X 4 General Description Features The UG8M13201DBJ(N) is a 1,048,576 bits by 32 SIMM module.The UG8M13201DBJ(N) is assembled using 8 pcs of 1Mx4 1K refresh in 300mil package,mounted on a 72 Pin unbuffered
|
Original
|
PDF
|
UG8M13201DBJ
72Pin
300mil
500mil)
D661-2788
1Mx4
|
|
|
KSZ8721B
Abstract: sn0736 "sn 0732" KSZ8721BL SN0726 ksz8721bla4 ksz8721bt SSOP-300mil spnz801 KSZ8721CL
Text: 2007 ETHERNET PACKAGE RELIABILITY High Temperature Storage Life +150 deg C, 1000 hours Device Lot No Pkg Pin Pre-con. KSZ8721SL A4TR GDN2621 SSOP 300mil 48L N/A KSZ8721BL GDN2631 LQFP(7*7mm) 48L N/A KSZ8721BLA4 GDN2619 LQFP(7*7mm) 48L N/A KSZ8721SL TR GDN3785
|
Original
|
PDF
|
KSZ8721SL
GDN2621
300mil)
KSZ8721BL
GDN2631
KSZ8721BLA4
GDN2619
GDN3785
300mils)
KSZ8721B
sn0736
"sn 0732"
KSZ8721BL
SN0726
ksz8721bla4
ksz8721bt
SSOP-300mil
spnz801
KSZ8721CL
|
motorola mc146818B crystal
Abstract: motorola mc146818B DS12885S MC146818B DS1285 DS12885 DS12885N DS12885Q DS12885QN DS12885T
Text: www.maxim-ic.com DS12885/DS12885Q/DS12885T Real-Time Clock www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § § § § DS12885, 24 DIP DS12885S, 24 SO 300mil § PIN ASSIGNMENT Top View Drop- in replacement for IBM AT computer clock/calendar
|
Original
|
PDF
|
DS12885/DS12885Q/DS12885T
DS12885,
DS12885S,
300mil
MC146818B
DS1285
12-hour
24-hour
motorola mc146818B crystal
motorola mc146818B
DS12885S
DS1285
DS12885
DS12885N
DS12885Q
DS12885QN
DS12885T
|
20P2N-A
Abstract: 20P2N SOP20 Package
Text: 20P2N-A Plastic 20pin 300mil SOP EIAJ Package Code SOP20-P-300-1.27 JEDEC Code – Weight g 0.26 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 Symbol F 10 A D A2 A1 b y L e L1 HE e1 I2 20 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters
|
Original
|
PDF
|
20P2N-A
20pin
300mil
OP20-P-300-1
20P2N-A
20P2N
SOP20 Package
|
SSOP24-P-300-0
Abstract: 24P2Q 24p2q-a
Text: 24P2Q-A Plastic 24pin 300mil SSOP EIAJ Package Code SSOP24-P-300-0.80 JEDEC Code – Weight g 0.2 Lead Material Cu Alloy e I2 13 E F Recommended Mount Pad Symbol 1 12 A A2 A1 D L L1 HE e1 24 b2 e y c b Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
|
Original
|
PDF
|
24P2Q-A
24pin
300mil
SSOP24-P-300-0
24P2Q
24p2q-a
|
20PIN
Abstract: P20C
Text: 20PIN PLASTIC DIP 300mil 20 11 1 10 A K L H G J I P F D N M C B M 0~15° P20C - 100 - 300SA NOTE 1) Each lead centerline is located within 0.25 mm(0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed
|
Original
|
PDF
|
20PIN
300mil)
300SA
P20C
|
DIP12F
Abstract: DIP-12F
Text: SANYO Semiconductor Dual In-line Package 12Pin Plastic DIP12F 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
12Pin
DIP12F
300mil)
ED-7303A
51min
26max
DIP12F
DIP-12F
|
DIP22S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Dual In-line Package 22Pin Plastic DIP22S 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
22Pin
DIP22S
300mil)
ED-7303A
51min
DIP22S
|
DIP-24
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 24Pin Plastic DIP24 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
24Pin
DIP24
300mil)
ED-7303A
51MIN
DIP24
DIP-24
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Dual In-line Package 8Pin Plastic DIP8 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
300mil)
ED-7303A
51MIN
|
DIP20
Abstract: DIP-20
Text: SANYO Semiconductor Dual In-line Package 20Pin Plastic DIP20 300mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
20Pin
DIP20
300mil)
ED-7303A
51min
DIP20
DIP-20
|
