3042S Search Results

Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuators PAT Series 6 dB 1.0 Description H 2.0 Mechanical H H H These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: AT02M750.02 - Rev D - Page 1 of 2 Product Family: High Precision Chip Attenuators Part Number Series: PAT Series Construction: Features: •     High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Application These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

PAT1632C

Abstract: PAT1632 PAT0510 PAT1220 RAT1010X
Contextual Info: AT02M750.00 - Rev A - Page 1 of 2 Product Family: High Precision Chip Attenuators Part Number Series: PAT / RAT Series Construction: Features: •     High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes

1000H

Contextual Info: Test Item Test Condition Short-time Overload Rated Voltage x 2.5, Resistance to Soldering Heat 260 ± 5°C, Temperature Cycle -55°C O + 125°C, Moisture Load Life 40 ± 2°C 90 ~ 95%, Load Life 70 ± 3°C, Insulation Resistance DC 500V, To meet 5sec. ± 0.2% + 0.050

PAT1220

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time.

H1632C

Contextual Info: Thin Film Chip Attenuators PAT Series 6 dB 1.0 Description H 2.0 Mechanical H H H These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metallization provides for very stable characteristics over temperature and time.

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

is 1632 n

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

PAT1632C

Contextual Info: AT02M750.02 - Rev D - Page 1 of 2 Product Family: High Precision Chip Attenuators Part Number Series: PAT / RAT Series Construction: Features: •     High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes

PAT1632C

Contextual Info: Product Family: High Precision Chip Attenuators Part Number Series: PAT / RAT Series Construction: Features: •     High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes 100% matte tin over Ni terminations

Contextual Info: AT02M750.02 - Rev C - Page 1 of 2 Product Family: High Precision Chip Attenuators Part Number Series: PAT / RAT Series Construction: Features: •     High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes

is 1632 n

Abstract: H1632C 010DB
Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

ps1608G

Abstract: RM2012 electronic passive components catalog RF Transceiver 1.9 ghz chip resistor 1206 RA1632 RS8A Chip Array Resistors RG1005 1005 Series PS5025 Susumu RG1608
Contextual Info: T Susumu World Group Companies Thin Film Technology Specialists R I S TERE EG D I S TERE EG D R About the Susumu Group ISO9001 ISO14001 A4 A8 303 561 THIN FILM TECHNOLOGY CORP. 1980 Commerce Drive North Mankato, MN 56003-1702 USA +1 507 625-8445 / +1 507 625-3523 fax

Contextual Info: Thin Film Chip Attenuator PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.

Contextual Info: AT02M750.02 - Rev E - Page 1 of 2 Construction: •     High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes 100% matte tin over Ni terminations RoHS compliant and Pb Free   

PAT1220

Contextual Info: Thin Film Chip Attenuators PAT Series 1.0 Description These 3042, 1632, and 1220 size chip attenuators exhibit excellent high frequency characteristics. The surface mount package is ideal for low noise, low inductance and parasitic capacitance applications. Thin film metalization provides for very stable characteristics over temperature and time.