30JAN05 Search Results

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. DIST LOC ALL RIGHTS RESERVED. AD 00 REVISIONS LTR B DESCRIPTION DATE EC 0G3C 0809 04 DWN APVD BSV JRO 30JAN05 THESE DIMENSIONS PERTAIN TO CAVITY CENTERLINES ONLY,

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-262/263 D2PAK Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 292 185,504 85_C, 85%RH 0.00 BOND INT 2,040 1,020,000 200_C + N2 0.00 HAST 5,557

SQFP-48

Abstract: M2003 65C15
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SQFP 48-64 LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 240 120,000 200_C +N2 0.00 HAST 530 53,000 130_C, 85%RH 0.00 Pressure Pot 730 70,080

SOT-563 SOT-666

Abstract: marking 802 soic8 sot-563 MOSFET D1 20l sot-23 siliconix MARKING CODE mSOp-8 siliconix code marking to-220 marking code 20L sot-23 sot23 V30114-T1
Contextual Info: Si1024X Vishay Siliconix Dual N-Channel 20-V D-S MOSFET PRODUCT SUMMARY VDS (V) 20 rDS(on) (W) ID (mA) 0.70 @ VGS = 4.5 V 600 0.85 @ VGS = 2.5 V 500 1.25 @ VGS = 1.8 V 350 FEATURES D D D D D D D BENEFITS Very Small Footprint High-Side Switching Low On-Resistance: 0.7 W

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-70 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 760 126,360 85_C, 85%RH 0.00 BOND INT 975 393,750 200_C + N2 0.00 HAST 4,113 426,800 130_C, 85%RH

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR SO-8 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 492 492,000 85_C, 85%RH 0.00 BOND INT 540 240,000 200_C +N2 0.00 HAST 4,785 480,600

transistor HR

Abstract: m2003 package diode electronic reliability siliconix j201
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR METAL CAN Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 420 3,360 883 M2003 0.00 Temp Cycle 2,300 662,500 −65_C−150_C 0.00 Document Number: 72454

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PLCC Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 315 31,500 130_C, 85%RH 0.00 Pressure Pot 1,075 103,200 121_, 15 PSIG 0.00 Solder DUNK 110 330

M2003

Abstract: TO252-DPAK
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-251/252 AND REVERSE TO-252 DPAK Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 1,050 744,704 85_C, 85%RH 0.00 BOND INT 2,800 1,400,000 200_C + N2

130C

Abstract: Siliconix
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR 1212 SOLDER PROCESS Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage HAST 550 55,000 130_C, 85%RH 0.00 Pressure Pot 275 30,360 121_, 15 PSIG 0.00

2n4416 and application note

Abstract: TSSOP-8 footprint and soldering sot-23 2N4416 equivalent Siliconix sot23 marking THERMAL SWITCH SC-75A sot-23 Marking N2 699 marking code sot23-5 marking code v6 SOT23 V30114 marking code 20L sot-23 sot23
Contextual Info: 2N4416/2N4416A/SST4416 Vishay Siliconix N-Channel JFETs PRODUCT SUMMARY Part Number VGS off (V) V(BR)GSS Min (V) gfs Min (mS) IDSS Min (mA) 2N4416 −v6 −30 4.5 5 2N4416A −2.5 to −6 −35 4.5 5 SST4416 −v6 −30 4.5 5 FEATURES BENEFITS D Excellent High-Frequency Gain:

cerdip

Abstract: sidebraze siliconix j201 transistor HR M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR CerDIP/SIDEBRAZE Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage Solderability 105 840 883 M2003 0.00 Temp Cycle 500 130,000 −65_C−150_C 0.00 Document Number: 72452

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSOP-5/6 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 275 44,880 85_C, 85%RH 0.00 BOND INT 805 463,820 200_C +N2 0.00 HAST 3,594 377,800 130_C, 85%RH

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR 1212 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND TNT 120 60,000 200_C +N2 0.00 HAST 4,046 401,650 130_C, 85%RH 0.00 Power Cycle 246 5,271,288

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SOT-23 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 820 485,000 200_C + N2 0.00 HAST 4,809 510,200 130_C, 85%RH 0.00 Pressure Pot 9,500 947,040

transistor 388

Abstract: M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-220 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 360 180,000 200_C + N2 0.00 HAST 1,631 160,950 130_C, 85%RH 0.00 Power Cycle 801 7,332,008

PowerPAK SO-8

Abstract: M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PowerPAKR SO-8 SOLDER PROCESS Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 300 150,000 200_C +N2 0.00 HAST 2,102 207,450 130_C, 85%RH 0.00 Power Cycle

PDIP-8

Abstract: M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR PDIP 8-28 LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 200 10,000 85_C, 85%RH 0.00 BOND INT 375 227,500 200_C + N2 0.00 HAST 2,090 206,5750

M2003

Abstract: 72451 415 tssop
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSSOP 8-LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 1,000 500,000 200_C + N2 0.00 HAST 4,705 476,000 130_C, 85%RH 0.00 Pressure Pot 10,380

M2003

Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TO-92 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 320 191,000 200C + N2 0.00 HAST 2,005 200,500 130_C, 85%RH 0.00 Pressure Pot 4,700 468,000

M2003

Abstract: SC-89
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SC-89 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 165 25,080 85_C, 85%RH 0.00 BOND INT 285 176,250 200_C +N2 0.00 HAST 1,255 133,640 130_C, 85%RH

Package Reliability

Abstract: 72456 M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MSOP Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 80 90,000 200_C + N2 0.00 HAST 1,130 118,500 130_C, 85%RH 0.00 Pressure Pot 2,180 214,560

Package Reliability

Abstract: 72455 M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR MLP/QFN Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 165 51,700 85_C, 85%RH 0.00 BOND INT 960 700,000 200_C + N2 0.00 HAST 1,910 191,000 130_C, 85%RH

SSOT-23

Abstract: M2003
Contextual Info: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SSOT-23 Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage BOND INT 200 100,000 200_C + N2 0.00 HAST 650 76,000 130_C, 85%RH 0.00 Power Cycle 246 3,690,000