32 PIN TEST SOCKET Search Results

PA32-PP

Abstract: PA32-PZP
Contextual Info: PA32-P Z P Data Sheet 32 pin PLCC socket/32 pin PLCC plug Supported Device/Footprints Adapter Construction These adapters accepts 32 pin PLCC devices and plugs into 32 pin PLCC production sockets. Test points are provided near the edges of the circuit board.

Contextual Info: 3M Interconnect Solutions : 3M Long Wire Test Clip, Alloy, 32-Pin 923690-32 : 923690-32 Select a Location English 3M Worldwide : Electronics Manufacturing Product Catalog for Interconnects Search This Product Catalog By Keyword Printer-friendly format 3M™ Long Wire Test Clip,

IC test

Contextual Info: WINSLOW ADAPTICs IC Test Socket & Prototyping Adapter Adapter is pinned 1:1 1.4 in 0.063 in 0.19 in 0.3 in 0.1 in WA51-0322-1031-1 32 pin QFP to 32 pin 0.1” grid array adapter This range of adapter converts test sockets to an alternative footprint. Solutions to Component Leadtime and Obsolescence

3224P

Contextual Info: PA32-24-wP Z d Data Sheet 32 pin PLCC socket/24 pin DIP 0.3” or 0.6” plug Introduction Adapter Construction This data sheet describes several adapters. They are all similar in that they have 32 pin PLCC test sockets and 24 pin DIP plugs. They differ in the dimensions of the DIP plug and the wiring from

enplas

Abstract: 28F001BX 28F002BC 28F002BX 28F010 28F020
Contextual Info: SOCKETS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile number of moving parts, which provides

TSOP 48 socket

Contextual Info: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series

B545-97

Contextual Info: Series 6556 Universal Test Socket Receptacle ORDERING INFORMATION XX-6556-XX No. of pins see table Series Pin style: 1=solder tail 2=2 level wire wrap 3=3 level wire wrap 4=solder cup No. of Pins 24 28 32 36 40 42 44 48 Dim. ”A” 1.790 [45.47] 1.990 [50.55]

6556

Contextual Info: Series 6556 Universal Test Socket Receptacle ORDERING INFORMATION XX-6556-XX No. of pins see table Series Pin style: 1=solder tail 2=2 level wire wrap 3=3 level wire wrap 4=solder cup No. of Pins 24 28 32 36 40 42 44 48 Dim. ”A” 1.790 [45.47] 1.990 [50.55]

QFN64

Abstract: 2231M CA-QFN64A-L-Z-T-01 SF-QFN64A-L-02
Contextual Info: 40.64mm [1.600"] Top View GND 63 49 NC 64 50 1 2 48 47 15 16 34 33 40.64mm [1.600"] 18 32 17 31 10.36mm [0.408"] Side View UGA SK-UGA9/65B-03 SF-QFN64A-L-02 Description: Carrier Adaptor 64 position MLF ZIF socket to 64 position surface mountable MLF emulator foot with test probes. Pin assignment/

QFN11T040-006

Abstract: WA200 QFN11T032-003 QFN11T048-008 IC51-1284-1433 QFN11T024-002 IC189-0282-042 IC189 IC51-0804-819-2 IC51-0242-367-1
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

QFN11T048-008

Abstract: NP445-064-002 QFN11T032-003 NP445-048-001 ic191-0482-004 pin details IC51-0202-912 IC51-0282-165 WA200 IC51-0302-914 IC51-1844-1148
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

WA200

Abstract: WA51-0644-1586-NOSKT IC51 ic51-1764-1505 IC51-1284-1433 IC51-0484-806 IC201-0804-014 KS1518 IC51-2404-1655-3 WA51-0564-680-NOSKT
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

PA32-32-DP

Abstract: PA32-32-DP-PP 3232DPSM
Contextual Info: PA32-32-DP -PP Data Sheet 32 pin DIP socket/32 pin PLCC plug Supported Device/Footprints Adapter Construction The PA32-32-DP adapter accepts 32 pin DIP devices and plugs into 32 pin PLCC production sockets. This allows DIP devices, or emulators with DIP plugs, to be used during development of

Contextual Info: SOP, SSOP, TSOP IC51 Series IC51- 028 2- 334-1 * Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No. of Sides with Contact Design No. Material PES / PEI Glass Filled Beryllium Copper Gold over Nickel

X518

Abstract: h525 pc 1 24-6518-00 28-6518-00 MIL-T-10727 QQN-290 1488 1489 standard
Contextual Info: 5 ^ 7 - '4/ “T s 7 £"47 SURFACE MOUNT OPEN FRAME Collet Sockets OSCILLATOR Sockets RS232 Surge Protector Sockets RRIES P .O . Box 130, Frenchtow n, NJ 08825 Phone 1-908-996-684 1 FAX 1-908-996-3891 ELECTRO NICS, IN C . Platform UL94V0 rated. Compatible with automatic insertion

CLCC 48 SOCKET

Abstract: HS538ESC02H
Contextual Info: PA-H8/536-84 Z Data Sheet 84 pin PLCC socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Parts & Part Numbers These adapters allow EPROM programming of Hitachi H8/536 devices in their PLCC or LCC packages on 32 pin DIP programmers. The following chart shows the various socket and board part

Contextual Info: PA-H8/338- T 80 Data Sheet 80 pin QFP(TQFP) socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Parts & Part Numbers These adapters allow EPROM programming of Hitachi H8/337 and H8/338 devices in their QFP or TQFP packages on 32 pin DIP programmers.

NP364

Abstract: QFN11T032-003 QFN11T048-008 QFN11T040-006 QFN 56 7x7 0.5 NP445-048-001 NP445-064-002 NP364-01649 QFN11T032-004 NP445-032-003
Contextual Info: QFN Quad Flat Non-leaded Packages TH Sockets - Open Top and Clamshell Types SMT Devices Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp.Range: Contact Force: 10,000MΩ min. at 100V DC 500V AC for 1 minute 30mΩ max. at 10mA/20mV max.

Contextual Info: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX135 PGA Interstitial interconnect pin socket, solder tail SERIES 550 Pin grid array sockets with intersitial contact rows, interconnect pin. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability

Contextual Info: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX101 PGA Interconnect pin solder tail SERIES 550 Pin grid array sockets, interconnect pin TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life

PA32Q-1498-1

Abstract: 32QF1498-1
Contextual Info: PA32Q-1498-1 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFP devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

Contextual Info: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability

AXS102013

Contextual Info: Discontinued as of September 30, 2010 AXS1 ROUND PIN TYPE IC SOCKETS HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket

Contextual Info: AXS1 ROUND PIN TYPE IC SOCKETS HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket with round pin external contacts