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    32 QFP PACKAGE THERMAL RESISTANCE Search Results

    32 QFP PACKAGE THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    32 QFP PACKAGE THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    FPT-240P-M03

    Abstract: 32 QFP PACKAGE thermal resistance
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 240 PIN PLASTIC FPT-240P-M03 240-pin plastic QFP Lead pitch 0.50 mm Package width x package length 32 × 32 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type


    Original     		PDF FPT-240P-M03 240-pin FPT-240P-M03) 45MIN 75MAX 018MIN~ 030MAX) F240011S-1C-1 FPT-240P-M03 32 QFP PACKAGE thermal resistance

    Theta JB

    Abstract: JC15-1 G30-88 G38-87
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC


    Original     		PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 Theta JB JC15-1 G30-88

    Theta-JC QFP die down

    Abstract: G30-88 Theta-J G38-87 Theta JB
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC


    Original     		PDF 2500AN 7304LC G38-87 115x102 Theta-JC QFP die down G30-88 Theta-J Theta JB

    G30-88

    Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance
    Text: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square


    Original     		PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 G30-88 Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance

    exposed QFP 144

    Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
    Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal


    Original     		PDF

    STATS ChipPAC

    Abstract: AN 7823 EP 603 LQFP Package LQFP Package tray QFP JEDEC tray 64 leads qfp 32 QFP PACKAGE thermal resistance Techpoint
    Text: QFP-SD Stacked Die Quad Flat Pack • Stacking of die enables more functionality and integration in a conventional QFP package FEATURES DESCRIPTION • Combining devices into one package reduces PCB real estate and cost STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    OBD II Protocol ISO 9141

    Abstract: SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic SG187 Common rail injector service manuals
    Text: Automotive Quarter 4, 2005 SG187 Rev 22 About This Revision–Q4/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		PDF SG187 Q4/2005 MC68HC908QC4 MC68HC908QC8 MC68HC908QC16 MC9S08AW1e SG187 OBD II Protocol ISO 9141 SC510727 advantages of microcontroller mc9s08aw16 sg2023 relay K-line interface mc9s12dg256 code example assembly electric assisted power steering system motor circuit diagram obd diagnostic Common rail injector service manuals

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    OBD II Protocol ISO 9141

    Abstract: SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver SG187 switch circuit diagram af remote control door lock
    Text: Automotive Quarter 3, 2005 SG187 Rev 21 About This Revision–Q3/2005 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		PDF SG187 Q3/2005 MMA7260Q MC56F8335VFG60 MC56F8335MFG60 MAC7101 SG187 OBD II Protocol ISO 9141 SC510727 Common rail injector service manuals MC9S12XDP384 electric assisted power steering system motor LED DRIVER 16pin QFP circuit diagram obd diagnostic Common rail injector driver switch circuit diagram af remote control door lock

    OBD II Protocol ISO 9141

    Abstract: knock alarm report power window lifter and door switch panel solid state timer aCCELEROMETER APPLICATION CIRCUIT SC510727 mc33883 cars ecu immobilizer automotive ecu manual SG2010
    Text: Automotive Quarter 4, 2004 SG187 Rev 18 About This Revision–Q4/2004 When new products are introduced, a summary of the new products will be provided in this section. However, the New Product section will only appear on this page when new products have been introduced during the quarter.


    Original     		PDF SG187 Q4/2004 MM908E621 SG187-6e SG187 OBD II Protocol ISO 9141 knock alarm report power window lifter and door switch panel solid state timer aCCELEROMETER APPLICATION CIRCUIT SC510727 mc33883 cars ecu immobilizer automotive ecu manual SG2010

    SO20-300

    Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
    Text: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions


    Original     		PDF OT111-1 OT157-2 DBS13P OT141-6 DBS17P OT243-1 DBS23P OT411-1 HSOP20 OT418-2 SO20-300 QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120

    100 PIN "PGA" ALTERA DIMENSION

    Abstract: No abstract text available
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


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    altera ep610

    Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


    Original     		PDF

    180I

    Abstract: GS82032A GS82032AT-133 GS82032AT-166 GS82032AT-180 GS82032AT-200 GS82032AT-4 GS82032AT-5 QFP PACKAGE thermal resistance gs82032
    Text: GS82032AT/Q-200/180/166/133/100 TQFP, QFP Commercial Temp Industrial Temp 200 MHz–100 MHz 7.5 ns–12 ns 3.3 V VDD 3.3 V and 2.5 V I/O 64K x 32 2M Synchronous Burst SRAM Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipelined


    Original     		PDF GS82032AT/Q-200/180/166/133/100 GS82032AT-4 GS82032AT-6 GS82032AT-4I GS82032AT-6I GS82032AQ-4 GS82032AQ-6 GS82032AQ-4I GS82032AQ-6I 180I GS82032A GS82032AT-133 GS82032AT-166 GS82032AT-180 GS82032AT-200 GS82032AT-4 GS82032AT-5 QFP PACKAGE thermal resistance gs82032

    GS820H32T-133

    Abstract: GS820H32T-138 GS820H32T-150 820H32
    Text: GS820H32T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original     		PDF GS820H32T/Q-150/138/133/117/100/66 GS820H3218/361 2000C 820H3218/361 2000D GS820H32T-133 GS820H32T-138 GS820H32T-150 820H32

    GS82032

    Abstract: GS820322T-138 GS82032T-133 GS82032T-150 GS82032T-4 GS82032T-5 GS82032T-6
    Text: Preliminary GS82032T/Q-150/138/133/117/100/66 TQFP, QFP Commercial Temp Industrial Temp 64K x 32 2M Synchronous Burst SRAM Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation


    Original     		PDF GS82032T/Q-150/138/133/117/100/66 1999B; 1/2000C GS820321 2000C 2/2000D 2/2000D; GS82032 GS820322T-138 GS82032T-133 GS82032T-150 GS82032T-4 GS82032T-5 GS82032T-6

    Untitled

    Abstract: No abstract text available
    Text: GS82032T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original     		PDF GS82032T/Q-150/138/133/117/100/66

    820H32A

    Abstract: GS820H32A2T-138 GS820H32AT-133 GS820H32AT-150 GS820H32AT-4
    Text: GS820H32AT/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original     		PDF GS820H32AT/Q-150/138/133/117/100/66 GS82032 2000D GS820321 3/2000E 82032T/Q, 820E32TQ, 820H32TQ 820H32A GS820H32A2T-138 GS820H32AT-133 GS820H32AT-150 GS820H32AT-4

    ld 33v

    Abstract: GS820E32T-133 GS820E32T-138 GS820E32T-150 1999A
    Text: GS820E32T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation.


    Original     		PDF GS820E32T/Q-150/138/133/117/100/66 GS820E3218/361 2000C 820E3218/361 2000D ld 33v GS820E32T-133 GS820E32T-138 GS820E32T-150 1999A

    Infrared Touch Control cooker

    Abstract: HMCS404 HD4074224 hmcs42 HD404449 Series
    Text: R e liab ility Test D a ta of M icro co m p u te r 1. Introduction M icrocomputers are required to provide higher reliability and quality with increasing functions for an enlarged scale for wide applications. To meet this demand, Hitachi is improving the quality by


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Test Data of Microcomputer 1. Introduction Microcomputers are required to provide higher reliability and quality with increasing functions for an enlarged scale for wide applications. To meet this demand, Hitachi is improving the quality by evaluating its reliability, building up quality in


    OCR Scan     		PDF