32L0 Search Results

32L0 Result Highlights (2)

Part	ECAD Model	Manufacturer	Description	Download	Buy
TPS65132L0YFFR		Texas Instruments	Split-Rail, Single Inductor Dual Output Converter with Positive and Negative Outputs 15-DSBGA -40 to 85
TPS65132L0YFFT		Texas Instruments	Split-Rail, Single Inductor Dual Output Converter with Positive and Negative Outputs 15-DSBGA -40 to 85

32L0 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
intel packaging Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than	Original	CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays	PDF
CERAMIC CHIP CARRIER LCC 68 socket Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a	Original		PDF
PF08109B Abstract: ic PF08109B PF08109B-TB PMM Bd-5701 j131 TCA 345 pf08109 h9908010n8 samsung Lot Code Identification ASQC-21 Contextual Info: SPECIFICATION *lo. SAMSUNG ELECTRONICS Co.Ltd. H9908010NS 9 Sep. 1999 Issue Date. Revised Date. 12 Nov. 1999 REV. 1 Cut No. 3,2 T h is d o c u m e n t is re v is e d . P le a s e re tu rn th is d o c u m e n t w ith y o u r a p p ro v al s ig n a tu re b y	OCR Scan	H9908010NS 96082TÂ 6596082X220 PF08109B ic PF08109B PF08109B-TB PMM Bd-5701 j131 TCA 345 pf08109 h9908010n8 samsung Lot Code Identification ASQC-21	PDF

Catalog Datasheet

Type

Document Tags

PDF

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

Original

CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

PDF

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

Original

PDF

PF08109B

Abstract: ic PF08109B PF08109B-TB PMM Bd-5701 j131 TCA 345 pf08109 h9908010n8 samsung Lot Code Identification ASQC-21
Contextual Info: SPECIFICATION *lo. SAMSUNG ELECTRONICS Co.Ltd. H9908010NS 9 Sep. 1999 Issue Date. Revised Date. 12 Nov. 1999 REV. 1 Cut No. 3,2 T h is d o c u m e n t is re v is e d . P le a s e re tu rn th is d o c u m e n t w ith y o u r a p p ro v al s ig n a tu re b y

OCR Scan

H9908010NS 96082TÂ 6596082X220 PF08109B ic PF08109B PF08109B-TB PMM Bd-5701 j131 TCA 345 pf08109 h9908010n8 samsung Lot Code Identification ASQC-21

PDF