32MX32BIT Search Results

H5MS1G22

Abstract: h5ms1g H5MS1G22MFP H5MS1G32MFP hynix mcp
Contextual Info: 1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O Specification of 1Gb 32Mx32bit Mobile DDR SDRAM Memory Cell Array - Organized as 4banks of 8,388,608 x32 This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for

Contextual Info: DRAM MODULE KMM53232004AK/AKG KMM53232004AK/AKG EDO Mode 32M X 32 DRAM SIMM Using 16Mx4, 4K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung KM M 53232004A is a 32Mx32bits RAM high density KM M 53232004A memory consists of module. sixteen Dynamic The Samsung

KMM53232000BK

Abstract: KMM53232000BKG
Contextual Info: DRAM MODULE KMM53232000BK/BKG KMM53232000BK/BKG Fast Page Mode 32M x 32 DRAM SIMM Using 16Mx4, 4K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung KMM53232000B is a 32Mx32bits Dynamic RAM high density memory module. The Samsung KMM53232000B consists of sixteen CMOS 16Mx4bits

KMM53232004BK

Abstract: KMM53232004BKG
Contextual Info: DRAM MODULE KMM53232004BK/BKG KMM53232004BK/BKG EDO Mode 32M x 32 DRAM SIMM Using 16Mx4, 4K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung KMM53232004B is a 32Mx32bits Dynamic RAM high density memory module. The Samsung KMM53232004B consists of sixteen CMOS 16Mx4bits

44C16100

Contextual Info: DRAM MODULE KMM53232000AK/AKG KMM53232000AK/AKG Fast Page Mode 32M x 32 DRAM SIMM Using 16Mx4, 4K Refresh, 5V GENERAL DESCRIPTION FEATURES The Samsung K M M 53232000A is a 32Mx32bits RAM high density KM M 53232000A memory consists of module. sixteen Dynamic

h5ms1g22

Contextual Info: 1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O Specification of 1Gb 32Mx32bit Mobile DDR SDRAM Memory Cell Array - Organized as 4banks of 8,388,608 x32 This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for

H55S1G

Abstract: H55S1G22MFP-60 H55S1G22MFP H55S1G32MFP BA4111
Contextual Info: 1GBit MOBILE SDR SDRAMs based on 8M x 4Bank x32 I/O Specification of 1Gb 32Mx32bit Mobile SDRAM Memory Cell Array - Organized as 4banks of 8,388,608 x32 This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for

ADM5120

Abstract: DG33 1K BSC COMPUTER SCIENCE digital logic design Notes PIN assignments of UTP cables 324-PIN ADM5001 TXC 3127 GMAC fet 004h BUT23
Contextual Info: ADM5120 HOME GATEWAY CONTROLLER Datasheet Version 1.13 ADMtek.com.tw Information in this document is provided in connection with ADMtek products. ADMtek may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on

"24 pin" DRAM

Contextual Info: DRAM MODULE KM M53232000B K/B KG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 Sept. 1997 ELECTRONICS DRAM MODULE KM M53232000B K/B KG Revision History Version 0.0 (Sept, 1997) • Removed two AC parameters t ELECTRONICS c acp (access time from CAS) and tAAP (access time from col. addr.) in A C CHARACTERISTICS.

PS3 computer motherboard circuit diagram

Abstract: Ps3 MOTHERBOARD CIRCUIT diagram MPC5200 gigabyte 865 MOTHERBOARD CIRCUIT diagram gigabyte 945 motherboard electrical diagram FX mode ethernet refernce design mea8 Micron 512MB NOR FLASH microprocessor bosch AC97
Contextual Info: Freescale Semiconductor Users Manual MPC5200 Users Guide This document contains information on a new product. Specifications and information herein are subject to change without notice. Freescale Semiconductor, Inc., 2004. All rights reserved. MPC5200UG

KMM53232004BK

Abstract: KMM53232004BKG km44c16104bk
Contextual Info: DRAM MODULE KMM53232004BK/BKG Revision History Version 0.0 Sept. 1997 • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS. Version 0.1 (June 1998) • The 3rd. generation of 64M DRAM components are applied for this module.

KMM53232000BK

Abstract: KMM53232000BKG
Contextual Info: DRAM MODULE KMM53232000BK/BKG Revision History Version 0.0 Sept. 1997 • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS. Version 0.1 (June 1998) • The 3rd. generation of 64M DRAM components are applied for this module.

KMM53232004CK

Abstract: KMM53232004CKG
Contextual Info: DRAM MODULE KMM53232004CK/CKG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. KMM53232004CK/CKG DRAM MODULE KMM53232004CK/CKG

Contextual Info: DRAM MODULE M53213200BE0/BJ0-C 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.1 June 1998 DRAM MODULE M53213200BE0/BJ0-C Revision History Version 0.0 (Sept. 1997) • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS.

16X2 LCD vhdl CODE

Abstract: DE2-115 EP4CE115F29 philips DVD player with usb port circuit diagram vhdl code for lcd display for DE2 altera LCD display module 16x2 HD44780 altera de2 zt3232 altera de2 board sd card simple vhdl de2 audio codec interface
Contextual Info: 1 CONTENTS Chapter 1 DE2-115 Package . 4 1.1 Package Contents . 4

SD1G32VS2490

Contextual Info: MEMORY MODULE SDRam 32Mx32-SOP Synchronous Dynamic Ram MODULE 3D SD1G32VS2490 1Gbit SDRam organized as 32Mx32, based on 32Mx16 Pin Assignment Top View SOP 70 - (Pitch : 0.635 mm) Features - Stack of two 512Mbit SDRam. - Organized as 32Mx32-bit. - Single +3.3V power supply.

ADM5120

Abstract: ADM5106 BSC COMPUTER SCIENCE digital logic design Notes DG33 1K v6 88 sgp 47-16 n2 biss 0001 description of transistor bc 148 PIN assignments of UTP cables 324-PIN
Contextual Info: ADM5120 HOME GATEWAY CONTROLLER Datasheet Version 1.14 ADMtek.com.tw Information in this document is provided in connection with ADMtek products. ADMtek may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on

ADM5120

Abstract: ADMTEK NAND FLASH BGA usb ethernet RS232 single chip switch 324-PIN
Contextual Info: ADM5120 HOME GATEWAY CONTROLLER Product Notes ADMtek.com.tw Information in this document is provided in connection with ADMtek products. ADMtek may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on

NAND FLASH BGA

Abstract: usb ethernet RS232 single chip switch adm5120 ADMTEK "Ethernet driver" usb ethernet single chip switch
Contextual Info: An Infineon Technologies Company ADM5120 Product Brief Infineon ADMtek Information in this document is provided in connection with ADMtek products. ADMtek may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on

32Mx32

Abstract: 3DFP
Contextual Info: MEMORY MODULE SDRam 64Mx32-SOP a HE ICO company Synchronous Dynamic Ram MODULE 3D SD2G32VS4484 2Gbit SDRam organized as 64Mx32, based on 32Mx16 Pin Assignment Top View SOP 70 - (Pitch : 0.635 mm) Features - Stack of four 512Mbit SDRam. - Organized as 32Mx32-bit.

CACP

Contextual Info: DRAM MODULE KM M53232004B K/B KG 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 Sept. 1997 ELECTRONICS DRAM MODULE KM M53232004B K/B KG Revision History Version 0.0 (Sept, 1997) • Removed two AC parameters t ELECTRONICS cacp (access time from CAS) and tAAP (access time from col. addr.) in A C CHARACTERISTICS.

Contextual Info: DRAM MODULE M53233200CE0/CJ0-C 4Byte 32Mx32 SIMM 16Mx4 base Revision 0.0 June 1999 DRAM MODULE Revision History Version 0.0 (June 1999) • The 4th. generation of 64Mb DRAM components are applied for this module. M53233200CE0/CJ0-C DRAM MODULE M53233200CE0/CJ0-C

Contextual Info: DRAM MODULE KMM53232000BV/BVG Revision History Version 0.0 Sept. 1997 • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS. Version 0.1 (May 1998) • The 3rd. generation of 64M DRAM components are applied for this module.

KMM5

Contextual Info: DRAM MODULE KMM53232004BV/BVG Revision History Version 0.0 Sept. 1997 • Removed two AC parameters tCACP(access time from CAS) and tAAP(access time from col. addr.) in AC CHARACTERISTICS. Version 0.1 (June 1998) • The 3rd. generation of 64M DRAM components are applied for this module.