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TLP2301
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 3750 Vrms, 4pin SO6 |
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54122-411062300RLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch |
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54122-410062300RLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch |
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70230-112LF
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Amphenol Communications Solutions
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Metral® Board Connectors, Backplane Connectors, Signal Receptacle, Right Angle, Through Hole, 4 Rows, 192 Positions. |
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10148176-2301413LF
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Amphenol Communications Solutions
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DDR4 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Metal tab, With MYLAR |
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