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TLP3450S
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Toshiba Electronic Devices & Storage Corporation
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Photorelay (MOSFET output), 1a, 20 V/0.16 A, 500 Vrms, S-VSON4T |
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68693-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch.. |
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68683-450LF
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Amphenol Communications Solutions
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Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 100 Positions, 2.54mm (0.100in) Pitch |
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69133-450HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch. |
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78233-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in)Pitch. |
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